Browsing by Author "Feurprier, Yannick"
Now showing 1 - 11 of 11
- Results per page
- Sort Options
Publication Approaches to Enable Patterning of Tight Pitches towards High NA EUV
Publication Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below
Proceedings paper2022-06-29, IITC2022, 2022-06-27Publication Etch challenges in high aspect ratio aupervia patterning
Proceedings paper2019, 11th PESM-2019, 20/05/2019Publication Etch tool pressure optimization enabling wafer edge overlay control.
Oral presentation2020, ASML Technology Conference 2020Publication High Aspect Ratio Supervia Dual Damascene etch for iN5 and beyond
Meeting abstract2021, AVS 67th International Symposium and Exhibition, 24/10/2021Publication Intra-field etch induced overlay penalties
Proceedings paper2020, Advanced Etch Technology for Nanopatterning IX, 23/02/2020, p.1132910Publication Mitigation of the etch-induced intra-field overlay contribution
Publication Novel processing technologies for advanced EUV patterning materials using metal oxide resist (MOR)
Publication On product overlay characterization after stressed layer etch
Proceedings paper2021, Advanced Etch Technology and Process Integration for Nanopatterning X, 21/02/2021, p.116150NPublication Recent advances in EUV patterning in preparation towards high-NA EUV
Proceedings paper2023, Conference on Advances in Patterning Materials and Processes XL, FEB 27-MAR 01, 2023, p.Art. 124981GPublication Tone reversal technology development targeting below 5nm technology node applications
Meeting abstract2017, AVS 64th International Symposium and Exhibition, 29/10/2017