Browsing by Author "Grillaert, Joost"
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Publication A new dummy-free shallow trench isolation concept for mixed-signal applications
Publication A new dummy-free shallow trench isolation concept for mixed-signal applications
Publication A new scaling issue in the electrical behavior of damascene versus plasma-etched interconnects
Proceedings paper1998, Proceedings Advanced Metallization and Interconnect Systems for ULSI Applications in 1997, 30/09/1997, p.535-541Publication A novel approach for the elimination of the pattern density dependence of CMP for shallow trench isolation
Proceedings paper1998, Proceedings of the 3rd International Chemical-Mechanical-Planarization for ULSI Multilevel Interconnection Conference - CMP-MIC, p.313-318Publication A static model for scratches generated during aluminum chemical-mechanical polishing process: orbital technology
Journal article1999, Japanese Journal of Applied Physics. Part 1: Regular Papers, (38) 4A, p.1932-1938Publication A study of the planarization process during chemical mechanical polishing for oxides and shallow trench isolation
Grillaert, JoostPHD thesis1999-05Publication Advanced solutions for copper and low k technology
Oral presentation2000, Semicon Europe; 2000; München, Germany.Publication Characterization of slurry system and suppression of oxide erosion in aluminun CMP (chemical-mechanical planarization)
Proceedings paper2000, Chemical-Mechanical Polishing - Fundamentals and Challenges, 5/04/1999, p.115-120Publication Cleaning, rinsing and drying aspects in post-Cu-CMP clean
Oral presentation1999, 4th International Symposium on Chemical-Mechanical Polishing; 8-11 August 1999; Lake Placid, NY, USA.Publication Cleaning, rinsing and drying effects in post-Cu CMP clean
; ; ; Proceedings paper2000, Proceedings CMP for ULSI Multilevel Interconnection Conference (CMP-MIC); 2-3 March 2000; Santa Clara, Ca, USA., p.507Publication Comparison of the performance of slurries for STI processing
Publication Critical issues in the integration of Copper and low-k dielectrics
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.262-264Publication Development of a global planarization process without CMP
Proceedings paper1994, 11th VLSI Multilevel Interconnect Conference - VMIC, 07/06/1994, p.172-178Publication Effect of CMP slurry filtration on wafer defectivity
Oral presentation1998, MRS Spring Meeting 1998. Symposium Q: Materials Issues in Chemical-Mechanical Polishing; April 15-16, 1998; San Francisco, CalifPublication Impact of dummy metal structures on post oxide CMP planarization
Proceedings paper1999, 4th International Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference - CMP-MIC, 11/02/1999, p.413-416Publication Influence of the height difference between the first and second nitride layer on erosion and dishing in the dual nitride approach for shallow trench isolation
Proceedings paper1998, Proceedings of the 2nd International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing, 5/05/1998, p.26-36Publication Integrating a hydrogen silsesquioxane spin-on dielectric in a quarter micron technology
Proceedings paper1997, 3rd International Dielectrics for ULSI Multilevel Interconnection Conference - DUMIC, 10/02/1997, p.310-316Publication Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
Oral presentation2000, Materials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.Publication Low-k organic spin-on materials in a non-etchback interconnect strategy
Proceedings paper1996, 2nd International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference - DUMIC, 20/02/1996, p.52-59Publication Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables
Proceedings paper1997, Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, 1/10/1996, p.525-530