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Browsing by Author "Gupta, Anshul"

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    1/f noise in fully integrated electrolytically gated FinFETs with fin width down to 20nm

    Martens, Koen  
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    Du Bois, Bert  
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    Van Roy, Wim  
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    Severi, Simone  
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    Siew, Yong Kong  
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    Gupta, Anshul  
    Meeting abstract
    2019, ICNF conference, 18/01/2019, p.66-68
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    A Holistic Evaluation of Buried Power Rails and Back-Side Power for Sub-5 nm Technology Nodes

    Nibhanupudi, S. S. Teja
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    Prasad, Divya
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    Das, Shidhartha
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    Zografos, Odysseas  
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    Robinson, Alex
    Journal article
    2022-07-07, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 8, p.4453-4459
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    Airgap Integration in MP18 Two-Level Semi-damascene Interconnects with Fully Self-aligned Vias

    Delie, Gilles  
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    Murdoch, Gayle  
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    Marti, Giulio  
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    Gupta, Anshul  
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    Wu, Chen  
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    Lesniewska, Alicja  
    Proceedings paper
    2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024
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    Alternative metals: from ab initio screening to calibrated narrow line models

    Adelmann, Christoph  
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    Sankaran, Kiroubanand  
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    Dutta, Shibesh
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    Gupta, Anshul  
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    Kundu, Shreya  
    Proceedings paper
    2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.154-156
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    Buried Bitline for sub-5nm SRAM Design

    Mathur, R.
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    Bhargava, M.
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    Annamalai, S.
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    Chong, Y. K.
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    Sinha, S.
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    Cline, B.
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    Kulkarni, J. P.
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Buried Interconnects for Sub-5 nm SRAM Design

    Mathur, R.
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    Bhargava, M.
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    Cline, B.
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    Salahuddin, Shairfe Muhammad  
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    Gupta, Anshul  
    Journal article
    2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 3, p.1041-1047
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    Buried Power Rail Integration for CMOS Scaling beyond the 3 nm Node

    Gupta, Anshul  
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    Tao, Zheng  
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    Radisic, Dunja  
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    Mertens, Hans  
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    Varela Pedreira, Olalla  
    Proceedings paper
    2022, Conference on Advanced Etch Technology and Process Integration for Nanopatterning XI Part of SPIE Advanced Lithography and Patterning Conference, APR 24-MAY 27, 2020-2022, p.120560B
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    Buried power rail integration with FinFETs for ultimate CMOS scaling

    Gupta, Anshul  
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    Varela Pedreira, Olalla  
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    Arutchelvan, Goutham  
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    Zahedmanesh, Houman  
    Journal article
    2020, IEEE Transactions on Electron Devices, (67) 12, p.5349-5354
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    Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node

    Gupta, Anshul  
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    Mertens, Hans  
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    Tao, Zheng  
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    Demuynck, Steven  
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    Boemmels, Juergen  
    Proceedings paper
    2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020
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    Buried Power Rail Metal exploration towards the 1 nm Node

    Gupta, Anshul  
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    Radisic, Dunja  
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    Maes, J.W.
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    Varela Pedreira, Olalla  
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    Soulie, Jean-Philippe
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond

    Gupta, Anshul  
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    Varela Pedreira, Olalla  
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    Tao, Zheng  
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    Mertens, Hans  
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    Radisic, Dunja  
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Buried power rails and back-side power grids: ARM CPU power delivery network design beyond 5nm

    Prasad, D.
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    Nibhanupudi, S.
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    Das, S.
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    Zografos, Odysseas  
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    Chehab, Bilal  
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    Sarkar, Satadru  
    Proceedings paper
    2019, IEEE International Electron Devices Meeting - IEDM 2019, 9/12/2019, p.446-449
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    Buried power SRAM DTCO and system-level benchmarking in N3

    Salahuddin, Shairfe Muhammad  
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    Perumkunnil, Manu  
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    Dentoni Litta, Eugenio  
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    Gupta, Anshul  
    Proceedings paper
    2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020
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    Challenges with SOT-MRAM integration towards N5 node and beyond

    Gupta, Mohit  
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    Perumkunnil, Manu  
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    Yasin, Farrukh  
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    Mirabelli, Gioele  
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    Garello, K.
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    Gupta, Anshul  
    Proceedings paper
    2022, Conference on DTCO and Computational Patterning, APR 24-MAY 27, 2022, p.1205202
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    Characterization and modeling of hot carrier degradation in N-channel gate-all-around nanowire FETs

    Gupta, Charu
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    Gupta, Anshul  
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    Tuli, Shikhar
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    Bury, Erik  
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    Parvais, Bertrand  
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    Dixit, Abhisek
    Journal article
    2020, IEEE Transactions on Electron Devices, (67) 1, p.4-10
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    CMOS area scaling and the need for high aspect ratio vias

    Briggs, Basoene  
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    Guissi, Sofiane  
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    Wilson, Chris  
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    Ryckaert, Julien  
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    Paolillo, Sara  
    Proceedings paper
    2018, 50th International Conference on Solid State Devices and Materials - SSDM, 9/09/2018, p.453-454
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    Demonstration of MP18-26nm Ru Semi-Damascene Spacer-is-Dielectric SADP Integration

    Wu, Chen  
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    Decoster, Stefan  
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    Renaud, Vincent  
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    Hermans, Yannick  
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    Marien, Philippe  
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    Marti, Giulio  
    Proceedings paper
    2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024
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    Device-, circuit- & block-level evaluation of CFET in a 4 track library

    Schuddinck, Pieter  
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    Zografos, Odysseas  
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    Weckx, Pieter  
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    Matagne, Philippe  
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    Sarkar, Satadru  
    Proceedings paper
    2019, 2019 Symposia on VLSI Technology and Circuits, 9/06/2019, p.T204-T205
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    Direct metal nanowire patterning using ion beam etch

    Kundu, Shreya  
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    Dutta, Shibesh
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    Gupta, Anshul  
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    Jamieson, Geraldine  
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    Piumi, Daniele  
    Meeting abstract
    2017, AVS 64th International Symposium and Exhibition, 29/10/2017, p.PS-WeM13
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    Engineering high quality and conformal ultrathin SiNx films by PEALD for downscaled and advanced CMOS nodes

    Tomomi, Takayama
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    Taishi, Ebisudani
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    Eiichiro, Shiba
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    Sepulveda Marquez, Alfonso  
    Journal article
    2021, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, (39) 4
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