Browsing by Author "Gupta, Anshul"
- Results Per Page
- Sort Options
Publication 1/f noise in fully integrated electrolytically gated FinFETs with fin width down to 20nm
Meeting abstract2019, ICNF conference, 18/01/2019, p.66-68Publication A Holistic Evaluation of Buried Power Rails and Back-Side Power for Sub-5 nm Technology Nodes
Journal article2022-07-07, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 8, p.4453-4459Publication Airgap Integration in MP18 Two-Level Semi-damascene Interconnects with Fully Self-aligned Vias
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Alternative metals: from ab initio screening to calibrated narrow line models
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.154-156Publication Buried Bitline for sub-5nm SRAM Design
;Mathur, R. ;Bhargava, M. ;Annamalai, S. ;Chong, Y. K. ;Sinha, S. ;Cline, B.Kulkarni, J. P.Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Buried Interconnects for Sub-5 nm SRAM Design
Journal article2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 3, p.1041-1047Publication Buried Power Rail Integration for CMOS Scaling beyond the 3 nm Node
Proceedings paper2022, Conference on Advanced Etch Technology and Process Integration for Nanopatterning XI Part of SPIE Advanced Lithography and Patterning Conference, APR 24-MAY 27, 2020-2022, p.120560BPublication Buried power rail integration with FinFETs for ultimate CMOS scaling
Journal article2020, IEEE Transactions on Electron Devices, (67) 12, p.5349-5354Publication Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication Buried Power Rail Metal exploration towards the 1 nm Node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Buried power rails and back-side power grids: ARM CPU power delivery network design beyond 5nm
Proceedings paper2019, IEEE International Electron Devices Meeting - IEDM 2019, 9/12/2019, p.446-449Publication Buried power SRAM DTCO and system-level benchmarking in N3
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication Challenges with SOT-MRAM integration towards N5 node and beyond
Proceedings paper2022, Conference on DTCO and Computational Patterning, APR 24-MAY 27, 2022, p.1205202Publication Characterization and modeling of hot carrier degradation in N-channel gate-all-around nanowire FETs
Journal article2020, IEEE Transactions on Electron Devices, (67) 1, p.4-10Publication CMOS area scaling and the need for high aspect ratio vias
Proceedings paper2018, 50th International Conference on Solid State Devices and Materials - SSDM, 9/09/2018, p.453-454Publication Demonstration of MP18-26nm Ru Semi-Damascene Spacer-is-Dielectric SADP Integration
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Device-, circuit- & block-level evaluation of CFET in a 4 track library
Proceedings paper2019, 2019 Symposia on VLSI Technology and Circuits, 9/06/2019, p.T204-T205Publication Direct metal nanowire patterning using ion beam etch
Meeting abstract2017, AVS 64th International Symposium and Exhibition, 29/10/2017, p.PS-WeM13Publication Engineering high quality and conformal ultrathin SiNx films by PEALD for downscaled and advanced CMOS nodes
Journal article2021, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, (39) 4
- «
- 1 (current)
- 2
- 3
- »