Browsing by Author "Ivankovic, Andrej"
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Publication 3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Proceedings paper2012, IEEE International Conference on IC Design and technology - ICICDT, 30/05/2012Publication 3D stacking induced mechanical stress effects
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.309-315Publication Analysis of microbump induced stress effects in 3D stacked IC technologies
; ; Proceedings paper2012, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.9-AprPublication Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Meeting abstract2013, Materials for Advance Metallization - MAM, 10/03/2013, p.203-204Publication Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Proceedings paper2012, 14th Electronics Packaging Technology Conference - EPTC, 5/12/2012Publication Chip-package interaction
Oral presentation2013, IEEE International Reliability Physics Symposium - IRPSPublication Chip-package interaction in 3D stacked IC packages using finite element modelling
Journal article2014, Microelectronics Reliability, (54) 6_7, p.1200-1205Publication Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Journal article2012, Microelectronics Reliability, (52) 11, p.2677-2684Publication Copper through silicon via induced keep out zone for 10nm node bulk FinFET CMOS technology
; ; ; Publication Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.1517-1522Publication Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Proceedings paper2010, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 26/04/2010Publication Effect of 4-point bending test procedure on crack propagation in thin film stacks
Journal article2015, Microelectronic Engineering, 137, p.59-63Publication Effect of 4-point bending test procedure on crack propagation in thin film stacks
Meeting abstract2014, Materials for Advanced Metallization Conference, 2/03/2014Publication FET arrays as CPI sensors for 3D stacking and packaging characterization
Proceedings paper2012, IEEE International Reliability Physics Symposium - IRPS, 15/04/2012, p.2.00E-03Publication IC-package interaction
Proceedings paper2013, IEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE, 14/04/2013Publication Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM
Proceedings paper2011-04, 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE, 18/04/2011Publication Impact of through silicon via induced mechanical stress on fully depleted bulk FinFET technology
Proceedings paper2012, International Electron Devices Meeting - IEDM, 10/12/2012, p.18.4Publication Reliability concerns in copper TSV's: methods and results
Proceedings paper2012-07, 19th International Symposium on the Physical & Failure Analysis of Integrated Circuits - IPFA, 2/07/2012Publication The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses
Proceedings paper2014, 15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 6/04/2013, p.1-8Publication Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits
Proceedings paper2011, Electronics Packaging Technology Conference - EPTC, 7/12/2011