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Browsing by Author "Jech, M."

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    Atomic Hydrogen Exposure to Enable High-Quality Low-Temperature SiO2 with Excellent pMOS NBTI Reliability Compatible with 3D Sequential Tier Stacking

    Franco, Jacopo  
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    de Marneffe, Jean-Francois  
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    Vandooren, Anne  
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    Kimura, Yosuke  
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    Nyns, Laura  
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    COMPHY - A compact-physics framework for unified modeling of BTI

    Rzepa, Gerhard
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    Franco, Jacopo  
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    O'Sullivan, Barry  
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    Subirats, Alexandre
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    Simicic, Marko  
    Journal article
    2018, Microelectronics Reliability, 85, p.49-65
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    Efficient physical defect model applied to PBTI in high-k stacks

    Rzepa, G.
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    Franco, Jacopo  
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    Subirats, Alexandre
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    Jech, M.
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    Vaisman Chasin, Adrian  
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    Grill, A.
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.XT-11.1-XT-11.6
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    Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

    Makarov, A.
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    Tyaginov, S. E.
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    Kaczer, Ben  
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    Jech, M.
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    Vaisman Chasin, Adrian  
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    Grill, A.
    Proceedings paper
    2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.310-313
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    Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

    Makarov, A
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    Tyaginov, Stanislaw
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    Kaczer, Ben  
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    Jech, M.
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    Vaisman Chasin, Adrian  
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    Grill, A.
    Proceedings paper
    2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.310-313
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    Mapping of CMOS FET degradation in bias space – Application to DRAM peripheral devices

    Kaczer, Ben  
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    Franco, Jacopo  
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    Tyaginov, S. E.
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    Jech, M.
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    Rzepa, G.
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    Grasser, T.
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    O'Sullivan, Barry  
    Journal article
    2017, Journal of Vacuum Science and Technology B, (35) 1, p.01A109
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    Physical Modeling the Impact of Self-Heating on Hot-Carrier Degradation in pNWFETs

    Makarov, A.
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    Jech, M.
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    Tyaginov, Stanislav  
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    Vaisman Chasin, Adrian  
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    Bury, Erik  
    Proceedings paper
    2020, IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), JUL 20-23, 2020
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    Physics-based modeling of hot-carrier degradation in Ge NWFETs

    Tyaginov, Stanislav  
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    Vaisman Chasin, Adrian  
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    Makarov, A.
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    El-Sayed, A.
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    Jech, M.
    Proceedings paper
    2019, International Conference on Solid-State Devices and Materials - SSDM, 2/09/2019, p.565-566
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    Simulation study: the effect of random dopants and random traps on hot-carrier degration in nFinFETs

    Makarov, A.
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    Kaczer, Ben  
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    Roussel, Philippe  
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    Vaisman Chasin, Adrian  
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    Vandemaele, Michiel  
    Proceedings paper
    2020, International Conference on Solid-State Devices and Materials - SSDM, 2/09/2019, p.609-610
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    The impact of self-heating and its implications on hot-carrier degradation-A modeling study

    Makarov, A.
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    Jech, M.
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    Tyaginov, Stanislav  
    ;
    Vaisman Chasin, Adrian  
    ;
    Bury, Erik  
    Journal article
    2021, MICROELECTRONICS RELIABILITY, (122) 1

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