Browsing by Author "Lefaucheux, Philippe"

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

Cryoetching processes applied to ULK material

Damage free cryogenic etching of porous organosilica ultralow-k film

Low damage cryoetching of low-K materials

Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4

Low damage ULK etching by means of high boiling point organic condensation

Low-k integration: Gas screening for cryogenic etching and damage mitigation

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation

Paths towards low-damage etching of highly porous organo-silicate low-k dielectrics