Browsing by Author "Leunissen, Peter"
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Publication A functional 41-stage ring oscillator using scaled FinFET devices with 25nm gate lengths and 10nm Fin widths applicable for the 45nm CMOS node
Journal article2004-08, IEEE Electron Device Letters, (25) 8, p.568-570Publication All wet photoresist strip by solvent aerosol spray
Oral presentation2008, 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces - UCPSSPublication An overview of some recent CMP projects at imec
Oral presentation2011, Clarkson University SeminarPublication Bath stability monitoring for electroless Cu seed formation in high aspect ratio TSV
Meeting abstract2012, ECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects, 7/10/2012, p.2727Publication Challenges with respect to high-k/metal gate stack etching and cleaning
Proceedings paper2007, Physics and Technology of High-k Dielectrics, 7/10/2007, p.275-283Publication Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Journal article2014, Microelectronic Engineering, 116, p.17-21Publication Chemical mechanical polishing of Ge using colloidal silica particles and H2O2
Journal article2011, Electrochemical and Solid-State Letters, (14) 7, p.254-257Publication Chemical mechanical polishing of InP
Journal article2012, ECS Journal of Solid State Science and Technology, (1) 4, p.P184-P189Publication Chemical mechanical polishing of nickel for damascene applications
Oral presentation2012, 17th Annual International Cymposium on Chemical-Mechanical PlanarizationPublication Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Meeting abstract2010, 10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS, 19/09/2010, p.188-189Publication CMP of Ge and InP for microelectronic applications
Oral presentation2011, 16th International Symposium on Chemical-Mechanical PlanarizationPublication CMP of Ge for high mobility channels
Proceedings paper2010, International Conference on Planarization/CMP Technology - ICPT, 14/11/2010Publication CMP of novel materials
Proceedings paper2009, 14th International Symposium on Chemical-Mechanical Planarization - CMP, 9/08/2009Publication CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries
Meeting abstract2014, International Conference on Planarization Technology - ICPT, 19/11/2014Publication CMP processing to enable 3D stacked IC integration
Proceedings paper2009, International Conference on Planarization/CMP Technology - ICPT, 19/11/2009Publication Co-silicide, Co(Ni)-silicide and Ni-silicide to source/drain contact resistance
Proceedings paper2003, Advanced Short-Time Thermal Processing for Si-based CMOS devices, 27/04/2003, p.197-204Publication Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Proceedings paper2009-03, International Semiconductor Technology Conference - ISTC/CSTIC, 19/03/2009, p.453-458Publication Current status of 193 nm immersion lithography and outlook to the future
Proceedings paper2005, JSR Semminar Japan, 9/12/2005Publication Damage clustering and damage-size distributions after megasonic cleaning
Proceedings paper2007, Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10, 7/10/2007, p.87-93