Browsing by Author "Limaye, Paresh"
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Publication A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Journal article2009, Journal of Electronic Materials, (38) 9, p.1881-1895Publication An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Proceedings paper2009, 59th Electronic Components and Technology Conference - ECTC, 25/05/2009, p.704-712Publication Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Journal article2007, Microelectronics Reliability, (47) 2_3, p.215-222Publication Challenges in the packaging of GaN-on-si devices
Journal article2011-03, Semiconductor Packaging NewsPublication Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Proceedings paper2005-09, SMTA International Annual Conference, 25/09/2005, p.371-377Publication Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Proceedings paper2007, 9th Electronics Packaging Technology Conference - EPTC, 10/12/2007, p.703-712Publication Cu/Sn microbumps interconnect for 3D TSV chip stacking
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.858-863Publication Design issues and cosiderations for low-cost 3D TSV IC technology
Proceedings paper2010, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2010, p.148-149Publication Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
Proceedings paper2010, Electronics System Integration Technology Conference - ESTC, 13/09/2010Publication Fine pitch micro-bump interconnections for advanced 3D chip stacking
Proceedings paper2011, China Semiconductor Technology International Conference - CSTIC, 13/03/2011, p.523-528Publication Finite element analysis of ultra thin BGA package: first and second level reliability
Proceedings paper2004-05, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 9/05/2004, p.225-232Publication Flexible AlScN based PMUT arrays for conformal and wearable ultrasound
Proceedings paper2025, IEEE Symposium (IUS) Ultrasonics, 2025-09-15, p.1-4Publication High density Cu-Sn TLP bonding for 3D integration
Proceedings paper2009, 59th Electronic Components and Technology Conference - ECTC, 26/05/2009, p.345-349Publication Il packaging dei dispositivi GaN-on-Si
Journal article2011-01, PCB Magazine, Gennaio, p.56-58Publication Influence of intermetallic properties of lead-free flip chip solder joints
Journal article2008, IEEE Transactions on Advanced Packaging, (31) 1, p.51-57Publication Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Proceedings paper2010, IEEE 60th Electronics Components and Technology Conference - ECTC, 1/06/2010, p.1370-1375Publication Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Proceedings paper2005, Proceedings 15th European Microelectronics and Packaging Conference - EPMC, 12/06/2005, p.253-258Publication Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint
Journal article2011, Journal of Applied Physics, (109) 9, p.93101Publication Lead free solder joint in electronic applications: material behaviour and reliability
Limaye, PareshPHD thesis2010-01