Browsing by Author "Lofrano, Melina"
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Publication 3D stacking induced mechanical stress effects
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.309-315Publication A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
Meeting abstract2012, Materials for Advanced Metallization - MAM, 11/03/2012, p.P3-08Publication A CMOS-compatible 20MHz poly-SiGe MEMS oscillator with low-power heating for frequency stabilization over temperature
Proceedings paper2011, IEEE International Frequency Control Symposium, 1/05/2011Publication A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Journal article2022, MICROELECTRONICS RELIABILITY, 138, p.114632Publication A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Meeting abstract2013, Materials for Advances Metallization - MAM, 10/03/2013Publication A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Journal article2014, Microelectronic Engineering, 120, p.85-89Publication A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Proceedings paper2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 26/05/2020Publication A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.1442-1447Publication A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Meeting abstract2020, IMAPS 53rd International Symposium on Microelectronics, 6/10/2020Publication A novel test method for simultaneous measurement of thermal conductivity, CTE, residual stress and Young's modulus of suspended thin films using a laser Doppler vibrometer
Proceedings paper2011, 16th International Conference on Solid-State sensors, Actuators and Microsystems - Transducers, 5/06/2011Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly
Proceedings paper2017, 18th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and ... - IEEE EuroSime, 3/04/2017, p.1-8Publication An investigation of thermo-mechanical stress in IC's induced during chip assembly
Meeting abstract2018, 10th European Conference on Residual Stresses - ECRS10, 11/09/2018, p.127-127Publication Assessment of critical Co electromigration parameters
Proceedings paper2022, IEEE International Reliability Physics Symposium (IRPS), MAR 27-31, 2022Publication Block level and package level thermal assessment for back side power delivery network.
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1036-1043Publication Bump pad design and its impact on the reliability of flip chip packages
Meeting abstract2018, 10th European Conference on Residual Stresses - ECRS10, 11/09/2018, p.125Publication Calibrated fast thermal calculation and experimental characterization of advanced BEOL stacks
Proceedings paper2023, IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023Publication Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Meeting abstract2013, Materials for Advance Metallization - MAM, 10/03/2013, p.203-204Publication Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Proceedings paper2012, 14th Electronics Packaging Technology Conference - EPTC, 5/12/2012Publication Chip package interaction: A stress analysis on 3D IC's packages
Proceedings paper2015, 16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 19/04/2015, p.1-9