Browsing by Author "Maggioni, Federica"
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Publication 3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
Proceedings paper2015, 31st Semiconductor Thermal Measurement and Management Symposium - SEMI-THERM, 15/03/2015, p.107-112Publication Advancements in thermal-fluid engineering and its application to electronics cooling system design
;Baelmans, Martine ;Buckinx, Geert ;Gielen, Ruben ;Maggioni, FedericaSaenen, TomOral presentation2014, IEEE Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimEPublication Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections
Proceedings paper2014, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 14th IEEE ITHERM, 27/05/2014, p.98-106Publication Convolution based compact thermal model for 3D-ICs: methodology and accuracy analysis
Proceedings paper2013-09, 19th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 25/09/2013, p.152-157Publication Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnections
Proceedings paper2014, 15th International Heat Transfer Conference - IHTC, 10/08/2014, p.9115Publication Convolution Based Modeling Methodology for the Fast Thermal Analysis of 3D-ICs
Maggioni, FedericaPHD thesis2016-05Publication Convolution-based fast thermal model for 3D-ICs: transient experimental validation
Journal article2017, IEEE Transactions on Components, Packaging and Manufacturing Technology, (7) 2, p.221-228Publication Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Proceedings paper2015-05, IEEE Electronic Components & Technology Conference - ECTC, 26/05/2015, p.1134-1141Publication Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact
Journal article2014-12, Microelectronics Journal, (45) 12, p.1746-1752Publication Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs
Journal article2016, IEEE Transactions on Components, Packaging and Manufacturing Technology, (6) 3, p.424-431Publication New fast distributed thermal model for analysis of GaN based power devices
Proceedings paper2016, 46th European Solid-State Device Research Conference - ESSDERC, 12/09/2016, p.172-175Publication Thermal experimental and modeling analysis of high power 3D packages
Proceedings paper2015-06, International Conference on IC Design and Technology - ICICDT, 1/06/2015, p.1-4Publication Thermal modeling and experimental model validation for 3D stacked ICs
Book chapter2019-04