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Browsing by Author "Maggioni, Federica"

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    3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications

    Maggioni, Federica
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    Oprins, Herman  
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    Milojevic, Dragomir  
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    Beyne, Eric  
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    De Wolf, Ingrid  
    Proceedings paper
    2015, 31st Semiconductor Thermal Measurement and Management Symposium - SEMI-THERM, 15/03/2015, p.107-112
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    Advancements in thermal-fluid engineering and its application to electronics cooling system design

    Baelmans, Martine
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    Buckinx, Geert
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    Gielen, Ruben
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    Maggioni, Federica
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    Saenen, Tom
    Oral presentation
    2014, IEEE Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
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    Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections

    Maggioni, Federica
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    Oprins, Herman  
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    Beyne, Eric  
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    De Wolf, Ingrid  
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    Baelmans, Tine
    Proceedings paper
    2014, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 14th IEEE ITHERM, 27/05/2014, p.98-106
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    Convolution based compact thermal model for 3D-ICs: methodology and accuracy analysis

    Maggioni, Federica
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    Oprins, Herman  
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    Beyne, Eric  
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    De Wolf, Ingrid  
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    Baelmans, Tine
    Proceedings paper
    2013-09, 19th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 25/09/2013, p.152-157
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    Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnections

    Maggioni, Federica
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    Oprins, Herman  
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    Beyne, Eric  
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    De Wolf, Ingrid  
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    Baelmans, Tine
    Proceedings paper
    2014, 15th International Heat Transfer Conference - IHTC, 10/08/2014, p.9115
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    Convolution Based Modeling Methodology for the Fast Thermal Analysis of 3D-ICs

    Maggioni, Federica
    PHD thesis
    2016-05
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    Convolution-based fast thermal model for 3D-ICs: transient experimental validation

    Maggioni, Federica
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    Cherman, Vladimir  
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    Oprins, Herman  
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    Beyne, Eric  
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    De Wolf, Ingrid  
    Journal article
    2017, IEEE Transactions on Components, Packaging and Manufacturing Technology, (7) 2, p.221-228
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    Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

    Oprins, Herman  
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    Cherman, Vladimir  
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    Van der Plas, Geert  
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    Maggioni, Federica
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    De Vos, Joeri  
    Proceedings paper
    2015-05, IEEE Electronic Components & Technology Conference - ECTC, 26/05/2015, p.1134-1141
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    Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact

    Maggioni, Federica
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    Oprins, Herman  
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    Beyne, Eric  
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    De Wolf, Ingrid  
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    Baelmans, Martine
    Journal article
    2014-12, Microelectronics Journal, (45) 12, p.1746-1752
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    Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs

    Maggioni, Federica
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    Oprins, Herman  
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    Beyne, Eric  
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    De Wolf, Ingrid  
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    Baelmans, Martine
    Journal article
    2016, IEEE Transactions on Components, Packaging and Manufacturing Technology, (6) 3, p.424-431
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    New fast distributed thermal model for analysis of GaN based power devices

    Sodan, Vice
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    Maggioni, Federica
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    Oprins, Herman  
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    Stoffels, Steve  
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    Baelmans, Martine
    Proceedings paper
    2016, 46th European Solid-State Device Research Conference - ESSDERC, 12/09/2016, p.172-175
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    Thermal experimental and modeling analysis of high power 3D packages

    Oprins, Herman  
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    Cherman, Vladimir  
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    Van der Plas, Geert  
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    Maggioni, Federica
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    De Vos, Joeri  
    Proceedings paper
    2015-06, International Conference on IC Design and Technology - ICICDT, 1/06/2015, p.1-4
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    Thermal modeling and experimental model validation for 3D stacked ICs

    Oprins, Herman  
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    Maggioni, Federica
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    Cherman, Vladimir  
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    Van der Plas, Geert  
    ;
    Beyne, Eric  
    Book chapter
    2019-04

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