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Browsing by Author "McIntyre, Greg"

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    Design and pitch scaling for affordable node transition and EUV insertion scenario

    Kim, Ryan Ryoung han
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    Ryckaert, Julien  
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    Raghavan, Praveen
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    Sherazi, Yasser  
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    Debacker, Peter  
    Proceedings paper
    2017, Design-Process-Technology Co-optimization for Manufacturability XI, 26/02/2017, p.101480V
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    Design technology co-optimization for N10

    Ryckaert, Julien  
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    Raghavan, Praveen
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    Baert, Rogier  
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    Garcia Bardon, Marie  
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    Dusa, Mircea  
    Proceedings paper
    2014, IEEE Proceedings of the Custom Integrated Circuits Conference - CICC, 15/09/2014, p.1-8
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    Driving the industry towards a consensus on high numerical aperture (High-NA) extreme ultraviolet (EUV)

    Kearney, Patrick
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    Wood, Obert
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    Hendrickx, Eric  
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    McIntyre, Greg
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    Soichi, Inoue
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    Goodwin, Frank
    Proceedings paper
    2014, Extreme Ultraviolet (EUV) Lithography V, 24/02/2014, p.90481O
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    Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

    Lariviere, Stephane  
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    Wilson, Chris  
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    Kutrzeba Kotowska, Bogumila  
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    Versluijs, Janko  
    Proceedings paper
    2018, Extreme Ultraviolet (EUV) Lithography IX, 25/02/2018, p.105830U
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    EUV single patterning for logic metal layers: achievement and challenge

    Kim, Ryan Ryoung han
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    Gillijns, Werner  
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    Drissi, Youssef  
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    Trivkovic, Darko  
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    Blanco, Victor  
    Proceedings paper
    2017, International Conference on Extreme Ultraviolet Lithography, 17/09/2017, p.1045004
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    EUVL Gen 2.0: Key requirements for constraining semiconductor cost in advanced technology node manufacturing

    Mallik, Arindam  
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    Debacker, Peter  
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    McIntyre, Greg
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    Kim, Ryan Ryoung han
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    Ronse, Kurt  
    Proceedings paper
    2018, Extreme Ultraviolet (EUV) Lithography IX, 25/02/2018, p.1058326
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    IMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend

    Kim, Ryan Ryoung han
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    Sherazi, Yasser  
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    Debacker, Peter  
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    Raghavan, Praveen
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    Ryckaert, Julien  
    Proceedings paper
    2018, Design-Process-Technology Co-optimization for Manufacturability XII, 22/02/2018, p.105880N
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    Impact of a SADP flow on the design and process for N10/N7 layers

    Gillijns, Werner  
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    Sherazi, Yasser  
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    Trivkovic, Darko  
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    Chava, Bharani
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    Vandewalle, B.
    Proceedings paper
    2015, Design-Process-Technology Co-optimization for Manufacturability IX, 7/02/2015, p.942709
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    Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms

    Halder, Sandip  
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    Truffert, Vincent  
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    Van Den Heuvel, Dieter  
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    Leray, Philippe  
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    Cheng, Shaunee
    Proceedings paper
    2015, 26th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 3/05/2015, p.19-22
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    Mask 3D effect mitigation by source optimization and assist feature placement

    Van Look, Lieve  
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    Mochi, Iacopo
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    Philipsen, Vicky  
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    Gallagher, Emily  
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    Hendrickx, Eric  
    Proceedings paper
    2016, International Symposium on Extreme Ultraviolet Lithography - EUVL, 24/10/2016
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    Metal stack optimization for low-power and high-density for N7-N5

    Raghavan, Praveen
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    Firouzi, Farshad
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    Matti, L.
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    Debacker, Peter  
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    Baert, Rogier  
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    Sherazi, Yasser  
    Proceedings paper
    2016, Design-Process-Technology Co-optimization for Manufacturability X, 24/02/2016, p.97810Q
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    N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV

    Lariviere, Stephane  
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    Briggs, Basoene  
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    Wilson, Chris  
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    Mallik, Arindam  
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    Decoster, Stefan  
    Proceedings paper
    2017, 49th International Conferece on Solid State Devices and Materials - SSDM, 19/09/2017, p.385-386
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    Performance of FlexRay, a fully programmable illumination system for generation of freeform sources on high NA immersion systems

    Mulder, Melchior
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    Engelen, Andre
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    Noordman, Oscar
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    Streutker, Gert
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    van Drieenhuizen, Bert
    Proceedings paper
    2010, Optical Microlithography XXIII, 21/02/2010, p.76401P
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    Reticle enhancement techniques toward iN7 metal2

    Gillijns, Werner  
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    Tan, Ling Ee  
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    Blanco, Victor  
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    Trivkovic, Darko  
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    Kim, Ryan Ryoung han
    Proceedings paper
    2017, Extreme Ultraviolet (EUV) Lithography VIII, 27/02/2017, p.1014314
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    SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform

    Bekaert, Joost  
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    Di Lorenzo, Paolo
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    Mao, Ming  
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    Decoster, Stefan  
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    Lariviere, Stephane  
    Proceedings paper
    2017, Extreme Ultraviolet (EUV) Lithography VIII, 27/02/2017, p.101430H
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    Single exposure EUV patterning for BEOL metal layers on the imec iN7 platform

    Blanco, Victor  
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    Bekaert, Joost  
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    Mao, Ming  
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    Kutrzeba Kotowska, Bogumila  
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    Lariviere, Stephane  
    Proceedings paper
    2017, Extreme Ultraviolet (EUV) Lithography VIII, 26/02/2017, p.1014318
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    The imec iN7 EUV platform: M2-Block and Via patterning developments

    Bekaert, Joost  
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    Franke, Joern-Holger
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    Mao, Ming  
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    Lariviere, Stephane  
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    Decoster, Stefan  
    Proceedings paper
    2016, International Symposium on Extreme Ultraviolet Lithography - EUVL, 24/10/2016

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