Browsing by Author "McIntyre, Greg"
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Publication Design and pitch scaling for affordable node transition and EUV insertion scenario
Proceedings paper2017, Design-Process-Technology Co-optimization for Manufacturability XI, 26/02/2017, p.101480VPublication Design technology co-optimization for N10
Proceedings paper2014, IEEE Proceedings of the Custom Integrated Circuits Conference - CICC, 15/09/2014, p.1-8Publication Driving the industry towards a consensus on high numerical aperture (High-NA) extreme ultraviolet (EUV)
Proceedings paper2014, Extreme Ultraviolet (EUV) Lithography V, 24/02/2014, p.90481OPublication Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Proceedings paper2018, Extreme Ultraviolet (EUV) Lithography IX, 25/02/2018, p.105830UPublication EUV single patterning for logic metal layers: achievement and challenge
Proceedings paper2017, International Conference on Extreme Ultraviolet Lithography, 17/09/2017, p.1045004Publication EUVL Gen 2.0: Key requirements for constraining semiconductor cost in advanced technology node manufacturing
Proceedings paper2018, Extreme Ultraviolet (EUV) Lithography IX, 25/02/2018, p.1058326Publication IMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend
Proceedings paper2018, Design-Process-Technology Co-optimization for Manufacturability XII, 22/02/2018, p.105880NPublication Impact of a SADP flow on the design and process for N10/N7 layers
Proceedings paper2015, Design-Process-Technology Co-optimization for Manufacturability IX, 7/02/2015, p.942709Publication Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms
Proceedings paper2015, 26th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 3/05/2015, p.19-22Publication Mask 3D effect mitigation by source optimization and assist feature placement
Proceedings paper2016, International Symposium on Extreme Ultraviolet Lithography - EUVL, 24/10/2016Publication Metal stack optimization for low-power and high-density for N7-N5
Proceedings paper2016, Design-Process-Technology Co-optimization for Manufacturability X, 24/02/2016, p.97810QPublication N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV
Proceedings paper2017, 49th International Conferece on Solid State Devices and Materials - SSDM, 19/09/2017, p.385-386Publication Performance of FlexRay, a fully programmable illumination system for generation of freeform sources on high NA immersion systems
;Mulder, Melchior ;Engelen, Andre ;Noordman, Oscar ;Streutker, Gertvan Drieenhuizen, BertProceedings paper2010, Optical Microlithography XXIII, 21/02/2010, p.76401PPublication Reticle enhancement techniques toward iN7 metal2
Proceedings paper2017, Extreme Ultraviolet (EUV) Lithography VIII, 27/02/2017, p.1014314Publication SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform
Proceedings paper2017, Extreme Ultraviolet (EUV) Lithography VIII, 27/02/2017, p.101430HPublication Single exposure EUV patterning for BEOL metal layers on the imec iN7 platform
Proceedings paper2017, Extreme Ultraviolet (EUV) Lithography VIII, 26/02/2017, p.1014318Publication The imec iN7 EUV platform: M2-Block and Via patterning developments
Proceedings paper2016, International Symposium on Extreme Ultraviolet Lithography - EUVL, 24/10/2016