Browsing by Author "Nagano, Fuya"
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Publication 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Meeting abstract2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020, p.G01-1650Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Proceedings paper2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020Publication Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Meeting abstract2017, Materials for Advanced Metallization Conference - MAM, 26/03/2017Publication Defect identification in bonding surface layer by positron annihilation spectroscopy
Proceedings paper2019, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019), 21/05/2019Publication Direct Bonding Using Low Temperature SiCN Dielectrics
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.602-607Publication Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
; ; ; ; ; Journal article2020, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (9) 12, p.123011Publication Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/07/2017, p.1-3Publication Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
Proceedings paper2022, International Conference on Electronics Packaging (ICEP), MAY 11-14, 2022, p.59-60Publication Morphology of IMC in the binary systems of Co/Sn and Cu/Sn
Meeting abstract2017, Materials for Advanced MetallizationConference - MAM, 26/03/2017Publication Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance
Journal article2023, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (12) 3, p.Art. 033002Publication The unique properties of SiCN as bonding material for hybrid bonding
Proceedings paper2021, 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), OCT 05-11, 2021, p.38-38Publication Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Journal article2022, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (11) 6, p.063012