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Browsing by Author "Panarella, Luca"

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    Deep Understanding of Electron Beam Effects on 2D Layered Semiconducting Devices Under Bias Applications

    Lee, Kookjin  
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    Ji, Hyunjin
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    Kim, Yanghee
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    Kaczer, Ben  
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    Lee, Hyebin
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    Ahn, Jae-Pyoung
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    Choi, Junhee
    Journal article
    2022, ADVANCED MATERIALS INTERFACES, (9) 9, p.Art. 2102488
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    Evidence of contact-induced variability in industrially-fabricated highly-scaled MoS2 FETs

    Panarella, Luca  
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    Kaczer, Ben  
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    Smets, Quentin  
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    Tyaginov, Stanislav  
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    Saraza Canflanca, Pablo  
    Journal article
    2024, NPJ 2D MATERIALS AND APPLICATIONS, (8) 1, p.Art. 44
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    Experimental-Modeling Framework for Identifying Defects Responsible for Reliability Issues in 2D FETs

    Panarella, Luca  
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    Tyaginov, Stanislav  
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    Kaczer, Ben  
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    Smets, Quentin  
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    Verreck, Devin  
    Journal article
    2024, ACS APPLIED MATERIALS & INTERFACES, (16) 45, p.62314-62325
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    Exploring manufacturability of novel 2D channel materials: 300 mm wafer-scale 2D NMOS & PMOS using MoS2, WS2, & WSe2

    Dorow, C. J.
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    Schram, Tom  
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    Smets, Quentin  
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    O'Brien, K. P.
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    Maxey, K.
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    Lin, C. -C.
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    Panarella, Luca  
    Proceedings paper
    2023, International Electron Devices Meeting (IEDM), 2023-12-09
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    Gate oxide reliability: upcoming trends, challenges, and opportunities

    Kaczer, Ben  
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    Degraeve, Robin  
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    Franco, Jacopo  
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    Grasser, T.
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    Roussel, Philippe  
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    Bury, Erik  
    Proceedings paper
    2024, IEEE Silicon Nanoelectronics Workshop (SNW) / Symposium on VLSI Technology and Circuits, 2024-06-15, p.3-4
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    Impact of doping and channel inhomogeneities on the stability of industrially fabricated WS2 FETs

    Panarella, Luca  
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    Kaczer, Ben  
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    Smets, Quentin  
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    Nuytten, Thomas  
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    Van Troeye, Benoit  
    Journal article
    2026, NPJ 2D MATERIALS AND APPLICATIONS, (10) 1, p.7
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    Impact of gate stack processing on the hysteresis of 300 mm integrated WS2 FETs

    Panarella, Luca  
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    Kaczer, Ben  
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    Smets, Quentin  
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    Verreck, Devin  
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    Schram, Tom  
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    Cott, Daire  
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    Lin, Dennis  
    Proceedings paper
    2023, 61st IEEE International Reliability Physics Symposium (IRPS), MAR 26-30, 2023
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    Implications of side contact depth on the Schottky barrier of 2D field-effect transistors

    Panarella, Luca  
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    Smets, Quentin  
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    Verreck, Devin  
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    Kaczer, Ben  
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    Tyaginov, Stanislav  
    Journal article
    2025, JOURNAL OF COMPUTATIONAL ELECTRONICS, (24) 1, p.Art. 32
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    Improving IGZO transistor PBTI reliability with hydrogen anneal achieving overdrive voltage of 1.2V for a lifetime of 5 years at 95°C

    Vaisman Chasin, Adrian  
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    Franco, Jacopo  
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    Matsubayashi, Daisuke  
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    Tyaginov, Stanislav  
    Proceedings paper
    2025, IEEE International Electron Devices Meeting (IEDM), 2025-12-06
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    Observation of fully recoverable leakage behaviour in HfO2 gate oxide of WS2 2D FETs induced by local mechanical stress

    Vishwakarma, Kavita  
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    Kaczer, Ben  
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    Smets, Quentin  
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    Panarella, Luca  
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    Kruv, Anastasiia  
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    Schram, Tom  
    Journal article
    2025, 2D MATERIALS, (12) 4, p.045014
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    Positive Bias Temperature Instability (PBTI) in n-and p-channel polysilicon thin-film transistors (TFTs) for high-voltage applications

    Kaczer, Ben  
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    Sadati Faramarzi, Seyed Mojtaba  
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    Panarella, Luca  
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    Berghmans, François  
    Journal article
    2026, SOLID-STATE ELECTRONICS, 236, p.109384
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    Predictive Reliability Modeling for NSFET Optimization-Part II: HCD and BTI

    Tyaginov, Stanislav  
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    Kao, Ethan  
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    Jungemann, Christoph  
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    Makarov, Alexander  
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    Bufler, Fabian M.  
    Journal article
    2026, IEEE TRANSACTIONS ON ELECTRON DEVICES, (73) 8, p.4572-4580
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    Process implications on the stability and reliability of 300 mm FAB MoS2 field-effect transistors

    Illarionov, Yu. Yu.
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    Karl, A.
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    Smets, Quentin  
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    Kaczer, Ben  
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    Knobloch, T.
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    Panarella, Luca  
    Journal article
    2024, NPJ 2D MATERIALS AND APPLICATIONS, (8) 1, p.8
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    Selective etch process for fab-compatible top contacts, replacement oxide, and interlayer removal in 2D FETs

    Smets, Quentin  
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    Schram, Tom  
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    van Dorp, Dennis  
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    Jiang, Yuchao  
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    Opdebeeck, Ann  
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    Cott, Daire  
    Proceedings paper
    2025, IEEE International Electron Devices Meeting (IEDM), 2025-12-06
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    Terman method to study threshold voltage hysteresis of Si/SiGe heterostructures at cryogenic temperatures

    Veryser, Bram  
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    Stampfl, F.
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    Gonzalez-Medina, J.M.
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    Godfrin, Clement  
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    Raes, Bart  
    ;
    Wan, Danny  
    Proceedings paper
    2026, IEEE International Reliability Physics Symposium (IRPS), 2026-03-22, p.1-6

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