Browsing by Author "Schuhmacher, Jörg"
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Publication A study of growth mechanism of TiN and WCN barrier films deposited by atomic layer deposition on different substrates
Meeting abstract2002, B-ALD-5: The 5th Baltic Symposium on Atomic Layer Deposition, 24/10/2002, p.21Publication Atomic layer deposition of barriers for interconnect
Publication Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.723-728Publication Characterization of TiN films deposited by atomic layer deposition
Proceedings paper2002, Proceedings of the 3rd AVS International Conference on Microelectronics and Interfaces, 11/02/2002, p.56-58Publication Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects
Journal article2002, Microelectronic Engineering, (64) 1_4, p.233-245Publication Galvanic corrosion testing of WCxNy barrier metal in H202 based slurries
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.95-101Publication Growth mechanism and continuity of atomic layer deposited TiN films on thermal SiO2
Journal article2002, Journal of Applied Physics, (92) 12, p.7641-7646Publication Impact of ALCVD and PVD titanium nitride deposition on metal gate capacitors
Proceedings paper2002, ESSDERC - 32nd European Solid-State Device Research Conference, 24/09/2002, p.583-586Publication Integration of ALD WCN into a dual damascene oxide module
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.759-765Publication Nucleation and growth dependence of ALD WNC on substrate surface condition
Proceedings paper2004, Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics, 12/04/2004, p.141-146Publication Nucleation and growth of TiN films deposited by atomic layer deposition
Proceedings paper2002, Proceedings of the 3rd AVS International Conference on Microelectronics and Interfaces, 11/02/2002, p.52-54Publication Plasma treatments of a low-k dielectric polymer surface
Meeting abstract2003, International Scientific Meeting Belgian Physical Society, 27/05/2003, p.SS2Publication Precursor penetration and sealing of porous CVD SiCOH low k dielectric for atomic layer deposition of WCxNy
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.717-723Publication Process and properties of ALD tungsten nitride carbide barrier films for interconnects
Oral presentation2003, Advanced Metallization ConferencePublication Process and properties of ALD tungsten nitride carbide barrier films for interconnects
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.755-759