Browsing by Author "Schuhmacher, Jörg"
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Publication A study of growth mechanism of TiN and WCN barrier films deposited by atomic layer deposition on different substrates
Meeting abstract2002, B-ALD-5: The 5th Baltic Symposium on Atomic Layer Deposition, 24/10/2002, p.21Publication Atomic layer deposition of barriers for interconnect
Publication Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.723-728Publication Characterization of TiN films deposited by atomic layer deposition
Proceedings paper2002, Proceedings of the 3rd AVS International Conference on Microelectronics and Interfaces, 11/02/2002, p.56-58Publication Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects
Journal article2002, Microelectronic Engineering, (64) 1_4, p.233-245Publication Galvanic corrosion testing of WCxNy barrier metal in H202 based slurries
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.95-101Publication Growth mechanism and continuity of atomic layer deposited TiN films on thermal SiO2
Journal article2002, Journal of Applied Physics, (92) 12, p.7641-7646Publication Impact of ALCVD and PVD titanium nitride deposition on metal gate capacitors
Proceedings paper2002, ESSDERC - 32nd European Solid-State Device Research Conference, 24/09/2002, p.583-586Publication Integration of ALD WCN into a dual damascene oxide module
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.759-765Publication Nucleation and growth dependence of ALD WNC on substrate surface condition
Proceedings paper2004, Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics, 12/04/2004, p.141-146Publication Nucleation and growth of TiN films deposited by atomic layer deposition
Proceedings paper2002, Proceedings of the 3rd AVS International Conference on Microelectronics and Interfaces, 11/02/2002, p.52-54Publication Plasma treatments of a low-k dielectric polymer surface
Meeting abstract2003, International Scientific Meeting Belgian Physical Society, 27/05/2003, p.SS2Publication Precursor penetration and sealing of porous CVD SiCOH low k dielectric for atomic layer deposition of WCxNy
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.717-723Publication Process and properties of ALD tungsten nitride carbide barrier films for interconnects
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.755-759Publication Process and properties of ALD tungsten nitride carbide barrier films for interconnects
Oral presentation2003, Advanced Metallization Conference