Browsing by Author "Vandenberghe, Geert"
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Publication 22nm node imaging and beyond: a comparison of EUV and ArFi double patterning
Proceedings paper2010, International Symposium on Lithography Extensions, 20/10/2010Publication 22nm node imaging and beyond: When will EUV take over?
Proceedings paper2010, International Symposium on Extreme Ultraviolet Lithography, 18/10/2010Publication 248 nm lithography for the 0.18 μm generation
Proceedings paper1996, Proceedings of the Microlithography Seminar INTERFACE'96, 27/10/1996, p.29-42Publication 3D Mask modeling for EUV lithography
Proceedings paper2012, Extreme Ultraviolet (EUV) Lithography III, 12/02/2012, p.832224Publication 60nm half pitch contact layer printing: exploring the limits at 1.35NA lithography
Proceedings paper2008, Optical Microlithography XXI, 24/02/2008, p.69243APublication A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography
Proceedings paper2004-12, Technical Digest International Electron Devices Meeting - IEDM, 13/12/2004, p.269-272Publication A 65-nm node SRAM solution using alt-PSM with ArF lithography
Publication A methodology for double patterning compliant split and design
Proceedings paper2008, SPIE Lithography Asia, 4/11/2008, p.71401XPublication A Novel Main Chain Scission Type Photoresists for EUV Lithography
Proceedings paper2020, Conference on Extreme Ultraviolet Lithography, SEP 21-25, 2020, p.115170DPublication A progress report on DSA of high-chi silicon containing block co-polymers
Publication Achievements and concerns of 193 nm immersion lithography
Proceedings paper2005, DNS Forum Semicon West Breakfast Seminar, 13/07/2005Publication Advanced lithography materials as key scaling enablers
Proceedings paper2014, 27th International Microprocesses and Nanotechnology Conference - MNC, 4/11/2014, p.7A-8-2Publication AIMS TM 45 inspection of CH treated with inverse lithography
Proceedings paper2008, 5th International Symposium on Immersion Lithography Extensions, 22/09/2008Publication AIMS-45 image validation of contact hole patterns after inverse lithography at NA 1.35
Proceedings paper2008, Photomask Technology 2008, 7/10/2008, p.71221EPublication Alternative EUV mask technology for mask 3D effect compensation
Proceedings paper2014, International Symposium on Extreme Ultraviolet Lithography - EUVL, 27/10/2014Publication Alternative EUV mask technology to compensate for mask 3D effects
Proceedings paper2015, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 20/04/2015, p.96580IPublication Analysis of the impact of reticle CD variations on the available process windows for a 100nm CMOS process
Proceedings paper2002, 22nd Annual BACUS Symposium on Photomask Technology, 3/10/2002, p.197-208Publication Application of pixel-based mask optimization technique for high-transmission attenuated PSM
Proceedings paper2009, Design for Manufacturability through Design-Process Integration III, 22/02/2009, p.72750XPublication ArF immersion lithography for low k1 lines and contacts
Proceedings paper2004-08, International Symposium on Immersion and 157nm Lithography, 2/08/2004, p.?Publication ArF lithography options for 100-nm technologies
Proceedings paper2001, Optical Microlithography XIV, 27/02/2001, p.179-190