Browsing by Author "Witvrouw, Ann"
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Publication 11-Megapixel CMOS-integrated SiGe micromirror arrays for high-end applications
Journal article2010, Journal of Microelectromechanical Systems, (19) 1, p.202-214Publication 3D total variation denoising in X-CT imaging applied to pore extraction in additively manufactured parts
Journal article2022, MEASUREMENT SCIENCE AND TECHNOLOGY, (33) 4, p.045602Publication A 10 μm thick poly-SiGe gyroscope processed above 0.35 μm CMOS
Publication A 2D MEMS grating based CMOS compatible poly-SiGe variable optical attenuator
Journal article2013, Microelectronic Engineering, 105, p.8-12Publication A CMOS compatible polycrystalline silicon-germanium based piezoresistive pressure sensor
Proceedings paper2011, 16th International Conference on Solid-State Sensors, Actuators and Microsystems - Transducers, 5/06/2011, p.1076-1079Publication A comb based in-plane SiGe capacitive accelerometer for above-IC integration
Proceedings paper2010, 21st Micromechanics and Microsystems Europe Workshop - MME, 26/09/2010, p.212-215Publication A comparison between wet HF etching and vapor HF etching for sacrificial oxide removal
Proceedings paper2000, Micromachining and Microfabrication Process Technology VI, 17/09/2000, p.130-141Publication A detailed study of a novel wafer separation method for surface sensitive MEMS wafers
Oral presentation2011, MRS Fall Meeting Symposium TT: Microelectromechanical Systems: Materials and Devices VPublication A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200° C
Journal article2007, Microsystem Technologies, (13) 11_12, p.1451-1456Publication A new method to determine the internal pressure and leakage rate of MEMS packages
Proceedings paper2013, 17th International Conference on Solid-State Sensors, Actuators and Microsystems - TRANSDUCERS, 16/06/2013Publication A novel gap narrowing process for creating high aspect ratio transduction gaps for MEM HF resonators
Proceedings paper2009, Microelectromechanical Systems - Materials and Devices II, 1/12/2008, p.13 [1139-GG01-05-18Publication A novel gap narrowing process for creating high aspect ratio transduction gaps for MEM HF resonators
Oral presentation2008, MRS Fall Meeting Symposium GG: Micorlectromechanical Systems - Materials and Devices IIPublication A Parylene temporary packaging technique for MEMS wafer handling
Proceedings paper2011, Eurosensors XXV, 4/09/2011, p.1501-1504Publication A parylene temporary packaging technique for MEMS wafer handling
Journal article2011, Procedia Engineering, 25, p.1501-1504Publication A parylene temporary packaging technique for MEMS wafer handling
Journal article2012, Sensors and Actuators A: Physical, 186, p.289-297Publication A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
Proceedings paper2011, 16th International Solid-State Sensors, Acutators and Microsystems Conference - TRANSDUCERS, 5/06/2011, p.982-985Publication Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
; ; Proceedings paper2011, IEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS, 23/01/2011, p.352-355Publication An in-plane SiGe differential capacitive accelerometer for above-IC integration
Journal article2011-07, Journal of Micromechanics and Microengineering, (21) 7, p.74011Publication An investigation of stiction in Poly-SiGe micromirror
Proceedings paper2011, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.157-162Publication Apparent and steady-state etch rates in thin film etching and underetching of microstructures. I: Modeling
Journal article2010, Journal of Micromechanics and Microengineering, (20) 5, p.55033