Browsing by author "Verdonck, Patrick"
Now showing items 121-140 of 153
-
Profilométrie des propriétés élastiques des couches minces transporentes par interférométrie acoustique ultrarapide
Mechri, C; Ruello, P; Breteau, J.-M.; Baklanov, Mikhaïl; Verdonck, Patrick; Gusev, V. (2010) -
Reducing agents for the atomic layer deposition of WS2 from the WF6 and H2S precursors
Delabie, Annelies; Heyne, Markus; Groven, Benjamin; Haesevoets, Karel; Meersschaut, Johan; Nuytten, Thomas; Verdonck, Patrick; Van Elshocht, Sven; Heyns, Marc; Radu, Iuliana; Caymax, Matty (2015-07) -
Reliability characteristics of thin porous low-k silica-based interconnect dielectrics
Barbarin, Yohan; Croes, Kristof; Roussel, Philippe; Li, Yunlong; Verdonck, Patrick; Baklanov, Mikhaïl; Tokei, Zsolt; Zhao, Larry (2013) -
Resolving of optical and mechanical inhomogeneity in thin transparent films by means of picosecond acoustic interferometry: experiment
Lomonosov, A.M.; Ruello, P.; Ayouch, A.; Vaudel, G.; Baklanov, Mikhaïl; Verdonck, Patrick; Zhao, Larry; Gusev, V (2011) -
Scaling of Back End of Line Processing : opportunities and challenges
Verdonck, Patrick; Wilson, Chris; Ronse, Kurt; Wen, Liang Gong; Armini, Silvia (2016) -
Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN
Sun, Yiting; Levrau, Elisabeth; Blauw, Michiel; Meersschaut, Johan; Verdonck, Patrick; Struyf, Herbert; Detavernier, Chrostophe; Baklanov, Mikhaïl; De Feyter, Steven; Armini, Silvia (2013) -
Self-assembled monolayers assisted pore sealing of k 2.0 dielectrics
Armini, Silvia; Sun, Yiting; Loyo Prado, Jana; Baumans, Kim; De Cooman, Johan; Redzheb, Murad; Verdonck, Patrick; Swerts, Johan; Baklanov, Mikhaïl; Struyf, Herbert (2013) -
Self-organized organic/inorganic films functional to next generation metallization schemes
Armini, Silvia; Carnevali, Guido; Sun, Yiting; Zhang, Liping; de Marneffe, Jean-Francois; Zhang, Yu; Baklanov, Mikhaïl; Jourdan, Nicolas; Verdonck, Patrick; Teugels, Lieve; Delande, Tinne; Wen, Liang Gong; Struyf, Herbert; Boemmels, Juergen; Tokei, Zsolt (2014) -
Si recess etch for 3D stacked IC applications.
Van Cauwenberghe, Marc; Tutunjyan, Nina; Jamieson, Geraldine; Verdonck, Patrick; Huyghebaert, Cedric; Jourdain, Anne; Conard, Thierry; Boullart, Werner; Travaly, Youssef; Swinnen, Bart (2010) -
Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
Kumaresan, Vishnuvarthan; Wilson, Chris; Verdonck, Patrick; Van Besien, Els; Lazzarino, Frederic; Truffert, Vincent; Boemmels, Juergen; Tokei, Zsolt; Wong, T.K.S. (2014) -
Spectroscopic ellipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films
Marsik, Premysl; Verdonck, Patrick; Schneider, Dieter; De Roest, David; Kaneko, Shinya; Baklanov, Mikhaïl (2008) -
Study of ALD on porous low-k
Verdonck, Patrick (2011) -
Study of porogen removal by atomic hydrogen generated by hot wire chemical vapor deposition for the fabrication of advanced low-k thin films
Godavarthi, Srinivas; Wang, Cong; Verdonck, Patrick; Matsumoto, Y.; Koudriavtsev, I; Dutt, A.; Tielens, Hilde; Baklanov, Mikhaïl (2015) -
Study of porogen removal by HWCVD for the fabrication of advanced low-k films
Godavarthi, Srinivas; Wang, Cong; Verdonck, Patrick; Matsumoto, Yasuhiro; Koudriavtsev, I; Tielens, Hilde; Baklanov, Mikhaïl (2012) -
Study of wet surface activation routes to enable the deposition of monomolecular organic thin films on k2.0 porous dielectrics
Armini, Silvia; Loyo Prado, Jana; Krishtab, Mikhail; Conard, Thierry; Meersschaut, Johan; Le, Quoc Toan; Verdonck, Patrick; Baklanov, Mikhaïl (2014) -
Studying the efficacy of hydrogen plasma treatment for enabling the etching of thermally annealed ruthenium in chemical solutions
Le, Quoc Toan; Arslan, Esen; Rip, Jens; De Coster, Hanne; Verdonck, Patrick; Radisic, Dunja; Schleicher, Filip; Vaesen, Inge; Conard, Thierry; Altamirano Sanchez, Efrain (2023) -
Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020) -
The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition
Sun, Yiting; Swerts, Johan; Verdonck, Patrick; Maheshwari, Abhishek; Prado, J.L.; De Feyter, Steven; Armini, Silvia (2013) -
The effects of scaling on back end of line processing
Verdonck, Patrick; Wilson, Chris; Wen, Liang Gong (2014) -
The influence of grinding and cleaning on Deep Reactive Ion Etching
Verdonck, Patrick; Van Cauwenberghe, Marc; Phommahaxay, Alain; Jamieson, Geraldine; Bogaerts, Lieve; Cotrin Teixeira, Ricardo; Huyghebaert, Cedric; Tutunjyan, Nina; Bearda, Twan; Boullart, Werner (2009)