Browsing by author "Liebens, Maarten"
Now showing items 1-15 of 15
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Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Defect learning methodology applied to microbump process at 20μm pitch and below
Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Stoerring, M.; Hiebert, S.; Cross, A. (2018) -
Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020) -
Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Suhard, Samuel; Iwasaki, Akihisa; Liebens, Maarten; Stiers, Karen; Slabbekoorn, John; Holsteyns, Frank (2016) -
Epitaxial growth of active Si on top of SiGe etch stop layer in view of 3D device integration
Loo, Roger; Jourdain, Anne; Rengo, Gianluca; Porret, Clément; Hikavyy, Andriy; Liebens, Maarten; Becker, Lucas; Storck, Peter; Beyer, Gerald; Beyne, Eric (2020-09) -
Epitaxial growth of active Si on top of SiGe etch stop layer in view of 3D device integration
Loo, Roger; Jourdain, Anne; Rengo, Gianluca; Porret, Clément; Hikavyy, Andriy; Liebens, Maarten; Becker, Lucas; Storck, Peter; Beyer, Gerald; Beyne, Eric (2020-07) -
Epitaxial Growth of Active Si on Top of SiGe Etch Stop Layer in View of 3D Device Integration
Becker, L.; Storck, P.; Loo, Roger; Jourdain, Anne; Rengo, Gianluca; Porret, Clément; Hikavyy, Andriy; Liebens, Maarten; Beyer, Gerald; Beyne, Eric (2021) -
Free-standing carbon nanotube films for extreme ultraviolet pellicle application
Timmermans, Marina; Pollentier, Ivan; Mariano, Marina; Korytov, Maxim; Liebens, Maarten; Schapmans, Elie; Huyghebaert, Cedric; Gallagher, Emily (2019) -
In-line metrology and defectivity for 3D-SOC, Process control at multiple interconnect levels
Liebens, Maarten (2017) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, G.; Stoerring, Moritz; Hiebert, S.; Cross, Andrew (2017) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, Gerard; Stoerring, Moritz; Hiebert, Stephen; Cross, Andrew (2019) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten (2019) -
Non-destructive acoustic metrology and void detection in 3x50μm TSV
Mair, Robin; Liebens, Maarten; Murray, T. (2016) -
Non-destructive in-line IMC thickness measurement using acoustic metrology
Mukundhan, Priya; Hou, Lin; Derakhshandeh, Jaber; Liebens, Maarten (2019) -
What's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging
Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Yeoh, Richard; Krah, T.; Vangal, A.; Hiebert, S.; Cross, A. (2019)