Browsing by author "Buisson, Thibault"
Now showing items 1-15 of 15
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300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11) -
3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012) -
3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
3D stacking using ultra thin dies
La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012) -
An IC-centric biocompatible chip encapsulation fabrication process
Op de Beeck, Maaike; La Manna, Antonio; Buisson, Thibault; Dy, Eric; Velenis, Dimitrios; Axisa, Fabrice; Soussan, Philippe; Van Hoof, Chris (2010) -
Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices
La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06) -
Development of integrated wet cleans for 3D-SIC technologies
Suhard, Samuel; Simms, Ihsan; Brown, Ian; Shogo, Mizota; Koji, Kagawa; Claes, Martine; Buisson, Thibault; Jourdain, Anne; Beyer, Gerald; De Gendt, Stefan (2013) -
Dry etch solutions for 3D integration technology
Tutunjyan, Nina; Van Cauwenberghe, Marc; Verdonck, Patrick; Majeed, Bivragh; Buisson, Thibault; Civale, Yann; Boullart, Werner (2010) -
Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
Buisson, Thibault; Potoms, Goedele; Phommahaxay, Alain; Verbinnen, Greet; Jaenen, Patrick; La Manna, Antonio; Travaly, Youssef; Beyne, Eric (2011) -
Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications
Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Redolfi, Augusto; Thangaraju, Sarasvathi; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2011) -
Key elements for sub-50μm pitch micro bump processes
De Vos, Joeri; Bogaerts, Lieve; Buisson, Thibault; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio; Beyne, Eric (2013) -
Ultra thin chip embedding technology (UTCS-UTCP)
Beyne, Eric; Christiaens, Wim; Torfs, Tom; Huwel, W.; Perdu, Wim; Vanfleteren, Jan; Iker, Francois; Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Jamieson, Geraldine; Soussan, Philippe; Van Hoof, Chris (2010) -
Ultra thin die embedding technology with 20um-pitch interconnection
Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Beyne, Eric; Iker, Francois (2010) -
Wafer thinning and back side processing to enable 3D stacking
Detalle, Mikael; Bogaerts, Lieve; La Manna, Antonio; Buisson, Thibault; Velenis, Dimitrios; Beyne, Eric (2012)