Browsing by author "Dictus, Dries"

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

van der Veen, Marleen; Vandersmissen, Kevin; Dictus, Dries; Demuynck, Steven; Liu, Ran; Bin, Xiaomin; Nalla, Praveen; Lesniewska, Alicja; Hall, Laurie; Croes, Kristof; Zhao, Larry; Boemmels, Juergen; Kolics, Artur; Tokei, Zsolt (2015)

Cobalt UBM for fine pitch microbump applications in 3DIC

Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015)

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects

van der Veen, Marleen; Inoue, Fumihiro; Vandersmissen, Kevin; Dictus, Dries; Tanaka, Tetsu; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2016)

Demonstration of a cost effective Cu electroless TSV metallization scheme

Vandersmissen, Kevin; Inoue, Fumihiro; Velenis, Dimitrios; Li, Yunlong; Dictus, Dries; Frees, Bart; Van Huylenbroeck, Stefaan; Kondo, M.; Seino, T.; Heylen, Nancy; Struyf, Herbert; van der Veen, Marleen (2015)

Development of a new metallization scheme for making nanoscale interconnects based on plasma-functionalization and electroless deposition

Dictus, Dries; Dordi, Y.; Gurer, E.; Krishtab, Mikhail; Baklanov, Mikhaïl; Carbonell, Laure; van der Veen, Marleen; El-Mekki, Zaid; Tokei, Zsolt (2013)