Browsing by author "Rakowski, Michal"
Now showing items 1-20 of 45
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25Gb/s Silicon-Photonics WDM Platform for Low-Power Optical I/O
Van Campenhout, Joris; Verheyen, Peter; Pantouvaki, Marianna; De Heyn, Peter; Selvaraja, Shankar; Lepage, Guy; De Coster, Jeroen; Rakowski, Michal; Ryckaert, Julien; Masood, Adil; Pathak, Shibnath; Bogaerts, Wim; Dumon, Pieter; Van Thourhout, Dries; Baets, Roel; Absil, Philippe (2013) -
3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009) -
3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding
Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009) -
50Gb/s silicon photonics platform for short-reach optical interconnects
Pantouvaki, Marianna; De Heyn, Peter; Rakowski, Michal; Verheyen, Peter; Snyder, Brad; Srinivasan, Ashwyn; Chen, Hongtao; De Coster, Jeroen; Lepage, Guy; Absil, Philippe; Van Campenhout, Joris (2016) -
A 4×20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver
Rakowski, Michal; Pantouvaki, Marianna; De Heyn, Peter; Verheyen, Peter; Ingels, Mark; Chen, Hongtao; De Coster, Jeroen; Lepage, Guy; Snyder, Brad; De Meyer, Kristin; Steyaert, Michiel; Pavarelli, Nicola; Lee, Jun Su; O'Brien, Peter; Absil, Philippe; Van Campenhout, Joris (2015) -
A low-voltage biasing scheme for aggressively scaled bulk FinFET 1T-DRAM featuring 10s retention at 85°C
Collaert, Nadine; Aoulaiche, Marc; De Wachter, Bart; Rakowski, Michal; Redolfi, Augusto; Brus, Stephan; De Keersgieter, An; Horiguchi, Naoto; Altimime, Laith; Jurczak, Gosia (2010) -
Advances in silicon photonics WDM devices
Absil, Philippe; De Heyn, Peter; Dumon, Pieter; Van Thourhout, Dries; Verheyen, Peter; Selvaraja, Shankar; Lepage, Guy; Pantouvaki, Marianna; Rakowski, Michal; Van Campenhout, Joris (2014) -
Analysis of sense margin and reliability of 1T-DRAM fabricated on thin-film UTBOX substrates
Collaert, Nadine; Aoulaiche, Marc; Rakowski, Michal; De Wachter, Bart; Bourdelle, K.; Nguyen, B.-Y.; Boedt, F.; Delprat, D.; Jurczak, Gosia (2009) -
Benchmarking SOI and bulk FinFET alternatives for PLANAR CMOS scaling succession
Chiarella, Thomas; Witters, Liesbeth; Mercha, Abdelkarim; Kerner, Christoph; Rakowski, Michal; Ortolland, Claude; Ragnarsson, Lars-Ake; Parvais, Bertrand; De Keersgieter, An; Kubicek, Stefan; Redolfi, Augusto; Vrancken, Christa; Brus, Stephan; Lauwers, Anne; Absil, Philippe; Biesemans, Serge; Hoffmann, Thomas Y. (2010) -
Beyond silicon CMOS photonics: a technology for future short distance system interconnects
Pantouvaki, Marianna; Verheyen, Peter; Lepage, Guy; De Heyn, Peter; De Coster, Jeroen; Rakowski, Michal; Snyder, Brad; Chen, Hongtao; Van Campenhout, Joris; Absil, Philippe (2015) -
CMOS circuitry for low-power ring-based silicon photonics optical link
Rakowski, Michal (2014-11) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS compatible polycrystalline silicon-germanium based pressure sensors
Gonzalez, Pilar; Guo, Bin; Rakowski, Michal; De Meyer, Kristin; Witvrouw, Ann (2012) -
CMOS-integrated poly-SiGe piezoresistive pressure sensor
Gonzalez, Pilar; Rakowski, Michal; San Segundo Bello, David; Severi, Simone; De Meyer, Kristin; Witvrouw, Ann (2012) -
Comparison of silicon ring modulators with interdigitated and lateral PN junctions
Pantouvaki, Marianna; Yu, Hui; Rakowski, Michal; Christie, Phillip; Verheyen, Peter; Lepage, Guy; Van Hoovels, Nele; Absil, Philippe; Van Campenhout, Joris (2013) -
Comparison of scaled floating body RAM architectures
Collaert, Nadine; Rosmeulen, Maarten; Rakowski, Michal; Rooyackers, Rita; Witters, Liesbeth; Veloso, Anabela; Van Houdt, Jan; Jurczak, Gosia (2008) -
Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology
Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Locorotondo, Sabrina; Lazzarino, Frederic; Altamirano Sanchez, Efrain; Huffman, Craig; De Keersgieter, An; Brus, Stephan; Demand, Marc; Struyf, Herbert; De Backer, Johan; Hermans, Jan; Delvaux, Christie; Baudemprez, Bart; Vandeweyer, Tom; Van Roey, Frieda; Baerts, Christina; Goossens, Danny; Dekkers, Harold; Ong, Patrick; Heylen, Nancy; Kellens, Kristof; Volders, Henny; Hikavyy, Andriy; Vrancken, Christa; Rakowski, Michal; Verhaegen, Staf; Dusa, Mircea; Romijn, Leon; Pigneret, Charles; van Dijk, Andre; Schreutelkamp, Rob; Cockburn, Andrew; Gravey, Virginie; Meiling, H.; Hultermans, B.; Lok, S.; Shah, K.; Rajagopalan, R.; Gelatos, J.; Richard, Olivier; Bender, Hugo; Vandenberghe, Geert; Beyer, Gerald; Absil, Philippe; Hoffmann, Thomas Y.; Ronse, Kurt; Biesemans, Serge (2009-12) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010)