Browsing by author "Ciofi, Ivan"
Now showing items 21-40 of 101
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Cu resistivity scaling limits for 20 nm copper damascene lines
Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter (2007) -
Cu wire resistance improvement using Mn-based self-formed barriers
Siew, Yong Kong; Jourdan, Nicolas; Ciofi, Ivan; Croes, Kristof; Wilson, Chris; Tang, Baojun; Demuynck, Steven; Ai, Huang; Cellier, Daniel; Cockburn, Andrew; Boemmels, Juergen; Tokei, Zsolt (2014) -
Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Direct etched Cu characterization for advanced interconnects
Wen, Liang Gong; Yamashita, Fumiko; Tang, Baojun; Croes, Kristof; Tahara, Shigeru; Shimoda, Keiichi; Maeshiro, Takeru; Nishimura, Eiichi; Lazzarino, Frederic; Ciofi, Ivan; Boemmels, Juergen; Tokei, Zsolt (2015) -
Effect of line-overlay and via-misalignment on dielectric reliability for different patterning schemes
Croes, Kristof; Ciofi, Ivan; Kocaay, Deniz; Tokei, Zsolt; Boemmels, Juergen (2014) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Electromigration scaling limits of copper interconnects
Varela Pedreira, Olalla; Zahedmanesh, Houman; Ciofi, Ivan; Tokei, Zsolt; Croes, Kristof (2019) -
Evaluation of a new advanced low-k material
Smirnov, Evgeny; Vanstreels, Kris; Verdonck, Patrick; Ciofi, Ivan; Shamiryan, Denis; Baklanov, Mikhaïl; Phillips, Mark (2011) -
Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations
Tierno, Davide; Ciofi, Ivan; Parvais, Bertrand; Croes, Kristof; Varela Pedreira, Olalla (2023) -
High-aspect-ratio ruthenium lnes for buried power rail
Gupta, Anshul; Kundu, Shreya; Teugels, Lieve; Boemmels, Juergen; Adelmann, Christoph; Heylen, Nancy; Jamieson, Geraldine; Varela Pedreira, Olalla; Ciofi, Ivan; Chava, Bharani; Wilson, Chris; Tokei, Zsolt (2018) -
Impact of LER on BEOL dielectric reliability: a quantitative model and experimental validation
Tokei, Zsolt; Roussel, Philippe; Stucchi, Michele; Versluijs, Janko; Ciofi, Ivan; Carbonell, Laure; Beyer, Gerald; Cockburn, Andrew; Augustin, M.; Shah, Kavita (2009) -
Impact of litho-patterning variations on the electrical performance and variability of advanced interconnects
Ciofi, Ivan; Roussel, Philippe; Baert, Rogier; Kocaay, Deniz; Contino, Antonino; Croes, Kristof; Saad, Yves; Gao, Weimin; Moroz, Victor; Wilson, Chris; Mocuta, Dan; Tokei, Zsolt (2018) -
Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
Travaly, Youssef; Eyckens, Brenda; Carbonell, Laure; Rothschild, Aude; Le, Quoc Toan; Brongersma, Sywert; Ciofi, Ivan; Struyf, Herbert; Furukawa, Yukiko; Stucchi, Michele; Schaekers, Marc; Bender, Hugo; Rosseel, Erik; Vanhaelemeersch, Serge; Maex, Karen; Gaillard, F.; Van Autryve, Luc; Rabinzohn, P. (2002) -
Impact of process variability on BEOL TDDB lifetime model assessment
Croes, Kristof; Kocaay, Deniz; Ciofi, Ivan; Boemmels, Juergen; Tokei, Zsolt (2015) -
Impact of wire geometry on interconnect RC and circuit delay
Ciofi, Ivan; Contino, Antonino; Roussel, Philippe; Baert, Rogier; Vega Gonzalez, Victor; Croes, Kristof; Badaroglu, Mustafa; Wilson, Chris; Raghavan, Praveen; Mercha, Abdelkarim; Verkest, Diederik; Groeseneken, Guido; Mocuta, Dan; Thean, Aaron (2016) -
Improved methodology for integrated k-value extractions
Ciofi, Ivan; Borrello, Gianpaolo; Madia, Oreste; Wilson, Chris; Vereecke, Bart; Beyer, Gerald (2012) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Influence of absorbed water components on SiOCH low-k reliability
Li, Yunlong; Ciofi, Ivan; Carbonell, Laure; Heylen, Nancy; Van Aelst, Joke; Baklanov, Mikhaïl; Groeseneken, Guido; Maex, Karen; Tokei, Zsolt (2008-08) -
Influence of porosity on dielectric breakdown of ultralow-k dielectrics
Vanstreels, Kris; Ciofi, Ivan; Barbarin, Yohan; Baklanov, Mikhaïl (2013)