Browsing by author "Wang, Teng"
Now showing items 21-40 of 44
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Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2014) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2015) -
Effects of packaging on mechanical stress in 3D-ICs
Cherman, Vladimir; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Van der Plas, Geert; De Vos, Joeri; Wang, Teng; Daily, Robert; Salahouelhadj, Abdellah; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2015) -
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Maggioni, Federica; De Vos, Joeri; Wang, Teng; Daily, Robert; Beyne, Eric (2015-05) -
Exploring process interaction of no-flow underfill and thermo-compression bonding in D2D stacking
Capuz, Giovanni; Daily, Robert; Wang, Teng; Struyf, Herbert; Miller, Andy; Rebibis, Kenneth June (2013) -
Failure analysis challenges for 3D stacked ICs
De Wolf, Ingrid; Phommahaxay, Alain; Wang, Teng; Linten, Dimitri; Guerrieri, Stefano (2014) -
Failure analysis work flow for electrical shorts in triple stacked 3D TSV daisy chains
Gaudestad, Jan; Irizco, A.; De Wolf, Ingrid; Wang, Teng; Webers, Tomas; Kelley, R.; Morrison, T.; Madala, S. (2014) -
Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding
Duval, Fabrice; Wang, Teng; Bex, Pieter; Lofrano, Melina; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric; Gerets, Carine (2017) -
Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration
Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid (2016) -
Light-induced capacitance alteration for non-destructive open failure localization in 3-D TSV structures
Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2017) -
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices
Jacobs, Kristof J.P.; Wang, Teng; Stucchi, Michele; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2017) -
Low warpage wafer level transfer molding post 3D die to wafer assembly
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Potoms, Goedele; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Gal, Wilfred; Zijl, Jurrian; Kersjes, Sebastiaan; Wensink, Henk (2016) -
Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
Vakanas, George; Wang, Teng; Tatsumi, Koji; Marinissen, Erik Jan; Rebibis, Kenneth June; Cherman, Vladimir; Croes, Kristof; Hua, Fay; De Wolf, Ingrid; Beyne, Eric (2014) -
New approach to investigate wettability and stability of capping layers on UBMs for 3D stacking applications
Hou, Lin; Derakhshandeh, Jaber; Bex, Pieter; Capuz, Giovanni; Van De Peer, Myriam; Wang, Teng; Houshmand Sharifi, Shamin; De Preter, Inge; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017) -
On the feasibility of die-to-wafer inorganic dielectric bonding
Wang, Teng; Podpod, Arnita; Capuz, Giovanni; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Bex, Pieter; Dubey, Vikas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Picking large thinned dies with high topography on both sides
Gerets, Carine; Derakhshandeh, Jaber; Wang, Teng; Capuz, Giovanni; Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H. (2014) -
Reflow process optimization for micro-bumps applications in 3D technology
Derakhshandeh, Jaber; De Preter, Inge; England, Luke; Schmid, Daniel; Slabbekoorn, John; Vakanas, George; Wang, Teng; Beyer, Gerald; Beyne, Eric; Marinissen, Erik Jan; Rebibis, Kenneth June; Lerch, Wilfried; Miller, Andy (2014) -
Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Cadacio Jr., Francisco; Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014)