Browsing by author "Briggs, Basoene"

Now showing items 21-38 of 38

    • Impact of Mn-based barriers on dielectric breakdown voltage and capacitance 

      Lesniewska, Alicja; Wu, Chen; Jourdan, Nicolas; Briggs, Basoene; Boemmels, Juergen; Tokei, Zsolt; Croes, Kristof (2016)

    • Inspection and metrology challenges for 3 nm node devices and beyond 

      Shohjoh, T.; Ikota, M.; Isawa, M.; Lorusso, Gian; Horiguchi, Naoto; Briggs, Basoene; Mertens, Hans; Bogdanowicz, Janusz; De Bisschop, Peter; Charley, Anne-Laure (2021)

    • Integration challenges of spin torque majority gatelogic 

      Wilson, Chris; Manfrini, Mauricio; Thiam, Arame; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Vaysset, Adrien; Trivkovic, Darko; Ercken, Monique; Swerts, Johan; Briggs, Basoene; Sayan, Safak; Radu, Iuliana; Mocuta, Dan (2016)

    • Intrinisic reliability of local interconnects for N7 and beyond 

      Croes, Kristof; Lesniewska, Alicja; Wu, Chen; Ciofi, Ivan; Banczerowska, Aga; Briggs, Basoene; Demuynck, Steven; Tokei, Zsolt; Boemmels, Juergen; Saad, Y.; Gao, Weimin (2015)

    • Modeling of tone inversion process flow for N5 interconnect to characterize block tip to tip 

      Guissi, Sofiane; Clark, William; Juncker, Aurélie; Ervin, J.; Greiner, K.; Fried, D.; Briggs, Basoene; Devriendt, Katia; Sebaai, Farid; Charley, Anne-Laure; Wilson, Chris; Boemmels, Juergen; Tokei, Zsolt (2017)

    • N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV 

      Lariviere, Stephane; Briggs, Basoene; Wilson, Chris; Mallik, Arindam; Decoster, Stefan; Wan, Danny; Bekaert, Joost; Blanco, Victor; Mao, Ming; Paolillo, Sara; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Boemmels, Juergen; Trivkovic, Darko; Tokei, Zsolt; McIntyre, Greg; Mocuta, Dan (2017)

    • N5 technology node dual-damascene interconnects enabled using multi patterning 

      Briggs, Basoene; Wilson, Chris; Devriendt, Katia; van der Veen, Marleen; Decoster, Stefan; Paolillo, Sara; Versluijs, Janko; Kesters, Els; Sebaai, Farid; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Verdonck, Patrick; Wan, Danny; Varela Pedreira, Olalla; Croes, Kristof; Dutta, Shibesh; Ryckaert, Julien; Mallik, Arindam; Lariviere, Stephane; Boemmels, Juergen; Tokei, Zsolt (2017)

    • New bending mode in SAQP Si fins and its mitigation 

      Sepulveda Marquez, Alfonso; Hellin, David; Zhang, Liping; Kenis, Karine; Batuk, Dmitry; Baudot, Sylvain; Briggs, Basoene; Mountsier, Tom; Barla, Kathy; Morin, Pierre; Altamirano Sanchez, Efrain (2022)

    • Patterning challenges in 193i-based tip to tip in N5 interconnects 

      Briggs, Basoene; Versluijs, Janko; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt; Mallik, Arindam; Soethoudt, Job (2018)

    • Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node 

      Decoster, Stefan; Paolillo, Sara; Kesters, Els; Briggs, Basoene; van der Veen, Marleen; Lazzarino, Frederic; Piumi, Daniele; Yamashita, Fumiko; Demand, Marc; Kumar, Kaushik (2016)

    • Recess metrology challenges for 3D device architectures in advanced technology nodes 

      Santoro, Gaetano; Houchens, Kevin; Bogdanowicz, Janusz; Elizov, Moshe; Yaron, Lior; Chemama, Michael; Goldenshtein, Alex; Zakay, Amit; Amit, Noam; Briggs, Basoene; Pacco, Antoine; Delhougne, Romain; Cockburn, Andrew; Abramovitz, Yaniv; Tam, Aviram; Adan, Ofer; Mertens, Hans; Charley, Anne-Laure; Horiguchi, Naoto; Leray, Philippe; Lorusso, Gian (2022)

    • Reliability study on cobalt and ruthenium as alternative metals for advance interconnects 

      Varela Pedreira, Olalla; Croes, Kristof; Lesniewska, Alicja; Wu, Chen; van der Veen, Marleen; De Messemaeker, Joke; Vandersmissen, Kevin; Jourdan, Nicolas; Wen, Liang Gong; Adelmann, Christoph; Briggs, Basoene; Vega Gonzalez, Victor; Boemmels, Juergen; Tokei, Zsolt (2017)

    • Ruthenium metallization for advanced interconnects 

      Wen, Liang Gong; Adelmann, Christoph; Varela Pedreira, Olalla; Dutta, Shibesh; Popovici, Mihaela Ioana; Briggs, Basoene; Heylen, Nancy; Vanstreels, Kris; Wilson, Chris; Van Elshocht, Sven; Croes, Kristof; Bommels, Juergen; Tokei, Zsolt (2016)

    • Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails 

      Veloso, Anabela; Jourdain, Anne; Radisic, Dunja; Chen, Rongmei; Arutchelvan, Goutham; O'Sullivan, Barry; Arimura, Hiroaki; Stucchi, Michele; De Keersgieter, An; Hosseini, Maryam; Hopf, Toby; D'have, Koen; Wang, Shouhua; Dupuy, Emmanuel; Mannaert, Geert; Vandersmissen, Kevin; Iacovo, Serena; Marien, Philippe; Choudhury, Subhobroto; Schleicher, Filip; Sebaai, Farid; Oniki, Yusuke; Zhou, X.; Gupta, Anshul; Schram, Tom; Briggs, Basoene; Lorant, Christophe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Geypen, Jef; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Soulie, Jean-Philippe; Devriendt, Katia; Chan, BT; Demuynck, Steven; Hiblot, Gaspard; Van der Plas, Geert; Ryckaert, Julien; Beyer, Gerald; Dentoni Litta, Eugenio; Beyne, Eric; Horiguchi, Naoto (2022)

    • Spin torque majority gate devices: towards 300mm wafer integration 

      Manfrini, Mauricio; Vaysset, Adrien; Ciubotaru, Florin; Yan, Jingdong; Radisic, Dunja; Ercken, Monique; Trivkovic, Darko; Swerts, Johan; Briggs, Basoene; Wilson, Chris; Lin, Dennis; Mocuta, Anda; Nikovov, D.E; Sayan, S; Manipatruni, S.; Young, I. A.; Radu, Iuliana; Thean, Aaron (2016)

    • Spintronic majority gates 

      Radu, Iuliana; Zografos, Odysseas; Vaysset, Adrien; Ciubotaru, Florin; Yan, Jingdong; Swerts, Johan; Radisic, Dunja; Briggs, Basoene; Soree, Bart; Manfrini, Mauricio; Ercken, Monique; Wilson, Chris; Raghavan, Praveen; Sayan, Safak; Adelmann, Christoph; Thean, Aaron; Amaru, L.; Gaillardon, P.E.; De Micheli, G.; Nikonov, D.E.; Manipatruni, S.; Young, I.A. (2015)

    • Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium 

      Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020)

    • Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node 

      Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019)