Browsing by author "Wilson, Chris"
Now showing items 21-40 of 131
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Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
Comparison of EUV and 193i based pattering for advanced node integration
Wilson, Chris (2016) -
Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's
Wilson, Chris; De Wolf, Ingrid; Vandevelde, Bart; De Messemaeker, Joke; Ablett, James M.; Redolfi, Augusto; Simons, Veerle; Beyne, Eric; Croes, Kristof (2012) -
Copper electromigration; prediction of scaling limits
Zahedmanesh, Houman; Varela Pedreira, Olalla; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2019) -
Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
de Marneffe, Jean-Francois; Zhang, Liping; Heyne, Markus; Krishtab, Mikhail; Goodyear, Andy; Cooke, Mike; Heylen, Nancy; Ciofi, Ivan; Wen, Liang Gong; Wilson, Chris; Rutigliani, Vito; Decoster, Stefan; Savage, Travis; Matsunaga, Koichi; Nafus, Kathleen; Boemmels, Juergen; Tokei, Zsolt; Baklanov, Mikhaïl (2014) -
Cu wire resistance improvement using Mn-based self-formed barriers
Siew, Yong Kong; Jourdan, Nicolas; Ciofi, Ivan; Croes, Kristof; Wilson, Chris; Tang, Baojun; Demuynck, Steven; Ai, Huang; Cellier, Daniel; Cockburn, Andrew; Boemmels, Juergen; Tokei, Zsolt (2014) -
Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Degradation and failure analysis of copper and tungsten contacts under high fluence stress
Kauerauf, Thomas; Butera, Geni; Croes, Kristof; Demuynck, Steven; Wilson, Chris; Roussel, Philippe; Drijbooms, Chris; Bender, Hugo; Lofrano, Melina; Vandevelde, Bart; Tokei, Zsolt; Groeseneken, Guido (2010) -
Demonstration of a submicron damascene Cu/low-k mechanical sensor to monitor stress in BEOL metallisation
Wilson, Chris; Croes, Kristof; Tokei, Zsolt; Beyer, Gerald; Horsfall, Horsfall; O'Neill, Anthony G. (2009) -
Design and application of a sensor to monitor stress in deep submicron copper interconnects
Wilson, Chris; Croes, Kristof; Tokei, Zsolt; Beyer, Gerald; Horsfall, A.; Neill, A. (2010) -
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Lesniewska, Alicja; Roussel, Philippe; Tierno, Davide; Vega Gonzalez, Victor; van der Veen, Marleen; Verdonck, Patrick; Jourdan, Nicolas; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020) -
Direct metal nanowire patterning using ion beam etch
Kundu, Shreya; Dutta, Shibesh; Gupta, Anshul; Jamieson, Geraldine; Piumi, Daniele; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt; Adelmann, Christoph (2017) -
Direct observation of the 1/E dependence of time dependent
Zhao, Larry; Tokei, Zsolt; Croes, Kristof; Wilson, Chris; Baklanov, Mikhaïl; Beyer, Gerald; Claeys, Cor (2011) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
Croes, Kristof; Wilson, Chris; Lofrano, Melina; Vereecke, Bart; Beyer, Gerald; Tokei, Zsolt (2010) -
Electron beam metrology for advanced technology nodes
Lorusso, Gian; Horiguchi, Naoto; Boemmels, Juergen; Wilson, Chris; Van den Bosch, Geert; Kar, Gouri Sankar; Ohashi, Takeyoshi; Sutani, Takumichi; Watanabe, Ryota; Takemasa, Yoshikata; Ikota, Masami (2019) -
Enabling CD SEM metrology for 5nm technology node and beyond
Lorusso, Gian; Ohashi, Takeyoshi; Yamaguchi, Astuko; Inoue, Osamu; Sutani, Takumichi; Horiguchi, Naoto; Boemmels, Juergen; Wilson, Chris; Briggs, Basoene; Tan, Chi Lim; Raymaekers, Tom; Delhougne, Romain; Van den Bosch, Geert; Di Piazza, Luca; Kar, Gouri Sankar; Furnemont, Arnaud; Fantini, Andrea; Donadio, Gabriele Luca; Souriau, Laurent; Crotti, Davide; Yasin, Farrukh; Appeltans, Raf; Rao, Siddharth; De Simone, Danilo; Rincon Delgadillo, Paulina; Leray, Philippe; Charley, Anne-Laure; Zhou, Daisy; Veloso, Anabela; Collaert, Nadine; Hasumi, Kazuhisa; Koshihara, Shunsuke; Ikota, Masami; Okagawa, Yutaka; Ishimoto, Toru (2017) -
Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability
Armini, Silvia; Lesniewska, Alicja; Jourdan, Nicolas; Delande, Tinne; Vega Gonzalez, Victor; Wilson, Chris; Struyf, Herbert; Tokei, Zsolt (2017) -
Etch challenges in high aspect ratio aupervia patterning
Puliyalil, Harinarayanan; Feurprier, Yannick; Briggs, Basoene; Lazzarino, Frederic; Wilson, Chris; Kumar, Kaushik (2019) -
Etch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning
Lazzarino, Frederic; Wilson, Chris; Truffert, Vincent; Vereecke, Bart; Demuynck, Steven; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2012)