Browsing by author "Van Olmen, Jan"
Now showing items 21-40 of 42
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Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
In-situ SEM observation of electromigration in thin metal films at accelerated stress conditions
D'Haen, Jan; Van Olmen, Jan; Beelen, Z.; Manca, Jean; Martens, T.; De Ceuninck, Ward; D'Olieslaeger, Marc; Schepper, L.; Cannaerts, M.; Maex, Karen (2000) -
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration
Van Olmen, Jan; Huyghebaert, Cedric; Coenen, Jens; Van Aelst, Joke; Sleeckx, Erik; Van Ammel, Annemie; Armini, Silvia; Vaes, Jan; Beyne, Eric; Travaly, Youssef (2010) -
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007) -
Integration of single damascene 85/85nm/L/S copper trenches in black diamond using 193nm optical lithography with dipole illumination
Van Olmen, Jan; Wu, Wen; Van Hove, Marleen; Travaly, Youssef; Brongersma, Sywert; Eyckens, Brenda; Maenhoudt, Mireille; Van Aelst, Joke; Struyf, Herbert; Demuynck, Steven; Tokei, Zsolt; Vervoort, Iwan; Sijmus, Bram; Vos, Ingrid; Ciofi, Ivan; Stucchi, Michele; Maex, Karen; Iacopi, Francesca (2003) -
Integration of tall triple-gate devices with inserted TaxNy gate in a 0.274μm² 6T-SRAM cell and advanced CMOS logic circuits
Witters, Liesbeth; Collaert, Nadine; Nackaerts, Axel; Demand, Marc; Demuynck, Steven; Delvaux, Christie; Lauwers, Anne; Baerts, Christina; Beckx, Stephan; Boullart, Werner; Brus, Stephan; Degroote, Bart; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Ercken, Monique; Goodwin, Michael; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Leray, Philippe; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Willems, Patrick; Wouters, Johan M. D.; Jurczak, Gosia; Biesemans, Serge (2005) -
Low-damage damascene patterning of SiOC(H) low-k dielectrics
Struyf, Herbert; Hendrickx, Dirk; Van Olmen, Jan; Iacopi, Francesca; Richard, Olivier; Travaly, Youssef; Van Hove, Marleen; Boullart, Werner; Vanhaelemeersch, Serge (2005-06) -
Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications, using RELACS shrink and corresponding OPC
Op de Beeck, Maaike; Versluijs, Janko; Wiaux, Vincent; Vandeweyer, Tom; Ciofi, Ivan; Struyf, Herbert; Hendrickx, Dirk; Van Olmen, Jan (2007) -
Monolithic near infrared image sensors enabled by quantum dot photodetector
Malinowski, Pawel; Georgitzikis, Epimitheas; Maes, Jorick; Mamun, Mehedi; Enzing, Oscar; Frazzica, Fortunato; Van Olmen, Jan; De Moor, Piet; Heremans, Paul; Hens, Zeger; Cheyns, David (2017) -
Novel technology for microlenses for imaging
Motsnyi, Vasyl; De Wolf, Ingrid; Rochus, Veronique; Rottenberg, Xavier; Cangar, Ozlem; Van Olmen, Jan; Guerrieri, Stefano; De Moor, Piet; Zahir, Mustapha (2018) -
On a more accurate assessment of scaled copper/low-k interconnects performance
Travaly, Youssef; Bamal, Mandeep; Carbonell, Laure; Tokei, Zsolt; Van Olmen, Jan; Iacopi, Francesca; Van Hove, Marleen; Stucchi, Michele; Maex, Karen (2007-08) -
On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes
Cavaco, Celso; Peng, Lan; Sebaai, Farid; Verbinnen, Greet; Visker, Jakob; Van Olmen, Jan; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2015) -
Optical design of planar microlenses for enhanced pixel performance of CMOS imagers
Rochus, Veronique; Guerrieri, Stefano; Van Olmen, Jan; Paraschiv, Vasile; De Wolf, Ingrid; De Moor, Piet; Rottenberg, Xavier (2016) -
Overview of the kinetics of the early stages of electromigration under low (=realistic) current density stress
Van Olmen, Jan; Manca, Jean; De Ceuninck, Ward; De Schepper, Luc; D'Haeger, V.; Witvrouw, Ann; Maex, Karen (1998) -
Overview of the kinetics of the early stages of electromigration under low (=realistic) current density stress
Van Olmen, Jan; Manca, Jean; De Ceuninck, Ward; De Schepper, Luc; D'Haeger, V.; Witvrouw, Ann; Maex, Karen (1998) -
Photonics-CMOS 3D integration: copper through-silicon-via approach
Masood, Adil; Bogaerts, Wim; Van Olmen, Jan; Van Aelst, Joke; Van Thourhout, Dries; Sabuncuoglu Tezcan, Deniz (2009) -
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures
Yang, Yu; Labie, Riet; Ling, Fangzhou; Zhao, Chao; Radisic, Alex; Van Olmen, Jan; Travaly, Youssef; Verlinden, Bert; De Wolf, Ingrid (2010) -
Self aligned CuGeN process for 32/22nm nodes and beyond
Liu, C.S.; Chen, H.C.; Bao, T.I.; Van Olmen, Jan; Croes, Kristof; Van Besien, Els; Pantouvaki, Marianna; Zhao, Chao; Sleeckx, Erik; Beyer, Gerald; Yu, C.H. (2008) -
Temperature dependent electrical characteristics of through-si-via (TSV) interconnections
Katti, Guruprasad; Mercha, Abdelkarim; Stucchi, Michele; Tokei, Zsolt; Velenis, Dimitrios; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Oprins, Herman; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal lines
De Ceuninck, Ward; D'Haeger, V.; Van Olmen, Jan; Witvrouw, Ann; Maex, Karen; De Schepper, Luc; De Pauw, P.; Pergoot, A. (1998)