Browsing imec Publications by author "Zahedmanesh, Houman"
Now showing items 41-60 of 65
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Mechanical stability of advanced nano-interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020) -
Mechanical stability of airgaps in nano-interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020) -
Mechanically conscious design of airgaps in nano-interconnects
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Metrology for evaluating elastic and fracture properties of porous low dielectric constant materials
Okudur, Oguzhan Orkut; Vanstreels, Kris; Zahedmanesh, Houman; De Wolf, Ingrid (2015) -
Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients
Zahedmanesh, Houman; Croes, Kristof (2020) -
Nano-Ridge Bending during Conformal Ruthenium Metallization: Implications for Interconnect Fabrication
Zahedmanesh, Houman; Vega Gonzalez, Victor; Tokei, Zsolt (2021) -
Novel membrane solutions for the EUV pellicle : better or not ?
Pollentier, Ivan; Lee, Jae Uk; Timmermans, Marina; Adelmann, Christoph; Zahedmanesh, Houman; Huyghebaert, Cedric; Gallagher, Emily (2017) -
Numerical analysis of airgap stability under process-induced thermo-mechanical loads
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2015) -
Numerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2015) -
Optical testing of EUV pellicle materials
Pollentier, Ivan; Vanpaemel, Johannes; Zahedmanesh, Houman; Adelmann, Christoph; Huyghebaert, Cedric; Gallagher, Emily; Brose, Sasha; Danylyuk, Serhij; Bergmann, Klaus (2015) -
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects
Nair, Sarath Mohanachandran; Bishnoi, Rajendra; Tahoori, Mehdi B.; Zahedmanesh, Houman; Croes, Kristof; Garello, Kevin; Kar, Gouri Sankar; Catthoor, Francky (2020) -
Process-oriented modelling of stresses and mechanical confinement in advanced nano-interconnects; implications for electromigration
Zahedmanesh, Houman; Croes, Kristof; Tokei, Zsolt (2017) -
Properties and performance of EUVL pellicle membranes
Gallagher, Emily; Vanpaemel, Johannes; Pollentier, Ivan; Zahedmanesh, Houman; Adelmann, Christoph; Huyghebaert, Cedric; Jonckheere, Rik; Lee, Jae Uk (2015) -
Properties and performance of EUVL pellicle membranes
Gallagher, Emily; Vanpaemel, Johannes; Pollentier, Ivan; Zahedmanesh, Houman; Adelmann, Christoph; Huyghebaert, Cedric; Jonckheere, Rik; Lee, Jae Uk (2015) -
Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects
Ceric, H.; Selberherr, S.; de Orio, R. L.; Zahedmanesh, Houman; Croes, Kristof (2021) -
Stress analysis of airgaps under process-induced thermomechanical loads
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Stress induced densification of thin porous low-k films during nanoindentation
Okudur, Oguzhan Orkut; Redzheb, Murad; Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario; De Wolf, Ingrid (2018) -
Stress mitigation of 3D-stacking/packaging induced stresses
Croes, Kristof; Cherman, Vladimir; Lofrano, Melina; Zahedmanesh, Houman; Kljucar, Luka; Gonzalez, Mario; De Wolf, Ingrid; Tokei, Zsolt; Beyne, Eric (2018) -
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents
Zahedmanesh, Houman; Ciofi, Ivan; Zografos, Odysseas; Croes, Kristof; Badaroglu, Mustafa (2022) -
Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures
Vanstreels, Kris; Zahedmanesh, Houman; Hangen, Ude (2015)