Browsing Conference contributions by imec author "16ae8db2f870dcb03f423a4e5c30e3509c6aa3c8"
Now showing items 1-20 of 66
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Additives in Cu plating for microelectronics applications
Radisic, Alex; Ross, Frances; Haesevoets, Karel; Struyf, Herbert; Vereecken, Philippe (2018) -
An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Radisic, Alex; Honore, Mia; De Coster, Jeroen; Cherman, Vladimir; Bex, Pieter; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Rebibis, Kenneth June (2018) -
Bath stability monitoring for electroless Cu seed formation in high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Armini, Silvia; Radisic, Alex; Civale, Yann; Leunissen, Peter; Shingubara, Shose (2012) -
Biocompatible encapsulation and interconnection technology for implantable electronic devices
Op de Beeck, Maaike; O'Callaghan, John; Qian, Karen; Morcos, Bishoy; Radisic, Alex; Malachowski, Karl; Amira, M-F.; Van Hoof, Chris (2012) -
Bottom-up filling of through-silicon vias due to suppressor desorption
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
Luhn, Ole; Radisic, Alex; Vereecken, Philippe; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating for 3d interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, Katrien; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, K.; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Copper plating uniformity on resistive substrate with segmented anode
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2009) -
CuNi alloy electrodeposition for microbumps using benzotriazole
Haesevoets, Karel; Radisic, Alex; Vereecken, Philippe (2018) -
Development of a biocompatible encapsulation and interconnect technology for implantable electronics
Op de Beeck, Maaike; Qian, Karen; Morcos, Bishoy; Radisic, Alex; Malachowski, Karl; Van Hoof, Chris (2013) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; Demuynck, Steven; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Radisic, Alex; Heylen, Nancy; Beyer, Gerald; Leunissen, Peter; Vereecken, Philippe (2011-05) -
Direct copper plating on a RuTa substrate
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2010) -
Electrochemical deposition of manganese and copper-manganese alloy on silicon
Radisic, Alex; Hernandez, Jose Luis; Tokei, Zsolt; Beyer, Gerald; Vereecken, Philippe (2007) -
Electrochemical deposition of manganese oxides on carbon nano-sheets
Radisic, Alex; Cott, Daire; Deheryan, Stella; Etman, Ahmed; Zargouni, Yafa; Vereecken, Philippe (2014) -
Electrochemical deposition of manganese oxides on carbon nano-sheets
Radisic, Alex; Cott, Daire; Deheryan, Stella; Zargouni, Yafa; Etman, Ahmed; Vereecken, Philippe (2014) -
Electrochemical deposition of platinum interconnects on flexible biocompatible substrates
Radisic, Alex; Morcos, Bishoy; Op de Beeck, Maaike; O'Callaghan, John; Van Hoof, Chris (2013)