Browsing Conference contributions by imec author "8c38dd5e192a931bf45f91c2074997a23f8a79b1"
Now showing items 1-20 of 86
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28nm-pitch Ru interconnects patterned with 0.33NA-EUV single exposure
Das, Sayantan; Kisson, Nicola; Mahmud Ul Hasan, Hasan MD; Rynders, Luc; Kljucar, Luka; Halder, Sandip; Leray, Philippe; Dusa, Mircea; Rio, David; Mohsen, Mahmoud; Spence, Chris; De Poortere, Etienne (2021) -
A Comparative Study of Deep-Learning Object Detectors for Semiconductor Defect Detection
Dehaerne, Enrique; Dey, Bappaditya; Halder, Sandip (2022) -
A new paradigm for in-line detection and control of patterning defects
Hunsche, Stefan; Jochemsen, Marinus; Jain, Vivek; Zhou, Xinjian; Chen, Frank; Vellanki, Venu; Spence, Chris; Halder, Sandip; Van Den Heuvel, Dieter; Truffert, Vincent (2015) -
Accuracy assessment between on product and on-optical-target overlay metrology with optical microscopy, SEM and STEM
Abranovitz, Yaniv; Levin, G.; Sarig, L.; Levi, S.; Adan, O.; Tilson, A.; Arjavac, J.; Strauss, M.; Kwakman, L.; Leray, Philippe; Halder, Sandip (2020) -
Acoustic cleaning in nano-electronics
Mertens, Paul; Janssens, Tom; Holsteyns, Frank; Zijlstra, Aaldert; Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Hoyer, Ronald; Barbagini, Francesca; Wada, Masayuki; Franklin, Cole; Kim, Tae-Gon; Kim, K; Kenis, Karine; Le, Quoc Toan; Claes, Martine; Kesters, Els; Vos, Rita; Vereecke, Guy; Bearda, Twan; Heyns, Marc (2008) -
Assessment of light source bandwidth impacts on image contrast enhancement using process window discovery
Alagna, Paolo; Rechtsteiner, G.; Conley, W.; Cross, A.; Sah, K.; Halder, Sandip (2017) -
BEOL N2: M2 through SAxP process from MP21 to MP26: 193i SAQP vs EUV SADP
Hermans, Yannick; Wu, Chen; Buccheri, Nunzio; Schleicher, Filip; Versluijs, Janko; Montero Alvarez, Daniel; Dey, Bappaditya; Wong, Patrick; Rincon Delgadillo, Paulina; Park, Seongho; Tokei, Zsolt; Leray, Philippe; Halder, Sandip (2023-04-28) -
Better prediction on patterning failure mode with hotspot aware OPC modeling
Wei, Chih-I; Wu, Stewart; Deng, Yunfei; Khaira, Gurdaman; Kusnadi, I.; Fenger, G.; Kang, S.; Okamoto, Y.; Maruyama, K.; Yamaszaki, Y.; Das, Sayantan; Halder, Sandip; Gillijns, Werner; Lorusso, Gian (2021) -
CD-SEM distortion quantification for EPE metrology and contour analysis
Dillen, Harm; Kiers, Ton; Halder, Sandip; Wallow, Thomas I.; Van Roey, Frieda (2017) -
Cleaning and damage performance of single wafer cleaning tools using physcial removal forces
Pacco, Antoine; Halder, Sandip; Kenis, Karine; Bearda, Twan; Mertens, Paul (2009) -
Cleaning and damage performance of single wafer cleaning tools using physical removal forces
Pacco, Antoine; Halder, Sandip; Kenis, Karine; Bearda, Twan; Mertens, Paul (2009) -
Connected component analysis of review-SEM images for sub-10nm node process verification
Halder, Sandip; Leray, Philippe; Sah, Kaushik; Cross, Andrew; Parisi, Paolo (2017) -
Current and future requirements for metrology and inspection for advanced patterning
Leray, Philippe; Wong, Patrick; Halder, Sandip; Foubert, Philippe (2016) -
Damage cluster analysis of patterned wafers during solvent spray cleaning
Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Wada, Masayuki; Brems, Steven; Bearda, Twan; Pacco, Antoine; Kenis, Karine; Vos, Rita; Mertens, Paul (2009) -
Damage cluster analysis of patterned wafers during solvent spray cleaning
Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Wada, Masayuki; Brems, Steven; Bearda, Twan; Pacco, Antoine; Kenis, Karine; Mertens, Paul; Vos, Rita (2009) -
Deep learning-based defect detection using large FOV SEM for 28 nm pitch BEOL layer patterned with 0.33NA single exposure EUV
Das, Sayantan; Sah, Kaushik; Liang, Ardis; Roy, Hemanta; Tran, Kha; Babu, Binesh; Hegde, Arjun; Cross, Andrew; Leray, Philippe; Halder, Sandip (2021) -
Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes
Sah, Kaushik; Cross, Andrew; Das, Sayantan; Blanco, Victor; Kljucar, Luka; Halder, Sandip; Leray, Philippe (2021) -
Defect detection and classification on imec iN5 node BEoL test vehicle with MultiSEM
Neumann, Jens Timo; Srikantha, Abhilash; Huthwohl, Philipp; Lee, Keumsil; William, James B.; Korb, Thomas; Foca, Eugen; Garbowski, Tomasz; Boecker, Daniel; Das, Sayantan; Halder, Sandip (2022) -
Defect-free isolation on high-thermal-conductivity SOI substrates for complementary BiCMOS technology
Van Wichelen, Koen; Ong, Patrick; Moussa, Alain; Radisic, Dunja; Devriendt, Katia; Halder, Sandip; Kenis, Karine; Lee, Willie; Vandevelde, Bart; Soonekindt, Christophe; Shahar, Abdul Hadi; Smet, Tom; Van Huylenbroeck, Stefaan; Decoutere, Stefaan; Seacrist, Mike; Ries, Mike; Drobny, Vladimir; Wise, Rick (2009) -
Design-based metrology: beyond CD/EPE metrics to evaluate printability performance
Halder, Sandip; Mailfert, Julien; Leray, Philippe; Rio, David; Peng, Hsin-Ying; Laenens, Bart (2016)