Browsing Conference contributions by imec author "bb67ce8ea3054c9bb891cae122936e03f65e5694"

Now showing items 1-20 of 35

    • 25Gb/s Silicon-Photonics WDM Platform for Low-Power Optical I/O 

      Van Campenhout, Joris; Verheyen, Peter; Pantouvaki, Marianna; De Heyn, Peter; Selvaraja, Shankar; Lepage, Guy; De Coster, Jeroen; Rakowski, Michal; Ryckaert, Julien; Masood, Adil; Pathak, Shibnath; Bogaerts, Wim; Dumon, Pieter; Van Thourhout, Dries; Baets, Roel; Absil, Philippe (2013)

    • 3D stacked IC demonstration using a through silicon via first approach 

      Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008)

    • 3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV) 

      Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009)

    • 3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding 

      Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009)

    • 50Gb/s silicon photonics platform for short-reach optical interconnects 

      Pantouvaki, Marianna; De Heyn, Peter; Rakowski, Michal; Verheyen, Peter; Snyder, Brad; Srinivasan, Ashwyn; Chen, Hongtao; De Coster, Jeroen; Lepage, Guy; Absil, Philippe; Van Campenhout, Joris (2016)

    • A 4×20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver 

      Rakowski, Michal; Pantouvaki, Marianna; De Heyn, Peter; Verheyen, Peter; Ingels, Mark; Chen, Hongtao; De Coster, Jeroen; Lepage, Guy; Snyder, Brad; De Meyer, Kristin; Steyaert, Michiel; Pavarelli, Nicola; Lee, Jun Su; O'Brien, Peter; Absil, Philippe; Van Campenhout, Joris (2015)

    • A low-voltage biasing scheme for aggressively scaled bulk FinFET 1T-DRAM featuring 10s retention at 85°C 

      Collaert, Nadine; Aoulaiche, Marc; De Wachter, Bart; Rakowski, Michal; Redolfi, Augusto; Brus, Stephan; De Keersgieter, An; Horiguchi, Naoto; Altimime, Laith; Jurczak, Gosia (2010)

    • Advances in silicon photonics WDM devices 

      Absil, Philippe; De Heyn, Peter; Dumon, Pieter; Van Thourhout, Dries; Verheyen, Peter; Selvaraja, Shankar; Lepage, Guy; Pantouvaki, Marianna; Rakowski, Michal; Van Campenhout, Joris (2014)

    • Analysis of sense margin and reliability of 1T-DRAM fabricated on thin-film UTBOX substrates 

      Collaert, Nadine; Aoulaiche, Marc; Rakowski, Michal; De Wachter, Bart; Bourdelle, K.; Nguyen, B.-Y.; Boedt, F.; Delprat, D.; Jurczak, Gosia (2009)

    • CMOS compatible anodization process for low cost high density capacitors 

      Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010)

    • CMOS compatible anodization process for low cost high density capacitors 

      Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010)

    • Comparison of scaled floating body RAM architectures 

      Collaert, Nadine; Rosmeulen, Maarten; Rakowski, Michal; Rooyackers, Rita; Witters, Liesbeth; Veloso, Anabela; Van Houdt, Jan; Jurczak, Gosia (2008)

    • Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology 

      Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Locorotondo, Sabrina; Lazzarino, Frederic; Altamirano Sanchez, Efrain; Huffman, Craig; De Keersgieter, An; Brus, Stephan; Demand, Marc; Struyf, Herbert; De Backer, Johan; Hermans, Jan; Delvaux, Christie; Baudemprez, Bart; Vandeweyer, Tom; Van Roey, Frieda; Baerts, Christina; Goossens, Danny; Dekkers, Harold; Ong, Patrick; Heylen, Nancy; Kellens, Kristof; Volders, Henny; Hikavyy, Andriy; Vrancken, Christa; Rakowski, Michal; Verhaegen, Staf; Dusa, Mircea; Romijn, Leon; Pigneret, Charles; van Dijk, Andre; Schreutelkamp, Rob; Cockburn, Andrew; Gravey, Virginie; Meiling, H.; Hultermans, B.; Lok, S.; Shah, K.; Rajagopalan, R.; Gelatos, J.; Richard, Olivier; Bender, Hugo; Vandenberghe, Geert; Beyer, Gerald; Absil, Philippe; Hoffmann, Thomas Y.; Ronse, Kurt; Biesemans, Serge (2009-12)

    • Design issues and cosiderations for low-cost 3D TSV IC technology 

      Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010)

    • Full-field EUV and immersion lithography integration in 0.186μm² FinFET 6T-SRAM cell 

      Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Demand, Marc; de Marneffe, Jean-Francois; Altamirano Sanchez, Efrain; De Keersgieter, An; Delvaux, Christie; De Backer, Johan; Brus, Stephan; Hermans, Jan; Baudemprez, Bart; Van Roey, Frieda; Lorusso, Gian; Baerts, Christina; Goossens, Danny; Vrancken, Christa; Mertens, Sofie; Versluijs, Janko; Truffert, Vincent; Huffman, Craig; Laidler, David; Heylen, Nancy; Ong, Patrick; Parvais, Bertrand; Rakowski, Michal; Verhaegen, Staf; Hikavyy, Andriy; Meiling, H.; Hultermans, B.; Romijn, L.; Pigneret, C.; Lok, S.; Van Dijk, A.; Shah, K.; Noori, A.; Gelatos, J.; Arghavani, R.; Schreutelkamp, Rob; Boelen, Pieter; Richard, Olivier; Bender, Hugo; Witters, Liesbeth; Collaert, Nadine; Rooyackers, Rita; Absil, Philippe; Lauwers, Anne; Jurczak, Gosia; Hoffmann, Thomas Y.; Vanhaelemeersch, Serge; Cartuyvels, Rudi; Ronse, Kurt; Biesemans, Serge (2008)

    • High yield sub-0.1μm² 6T-SRAM Cells, featuring high-k/metal-gate Finfet devices, double gate patterning, a novel Fin etch strategy, full-field EUV lithography and optimized junction design & layout 

      Horiguchi, Naoto; Demuynck, Steven; Ercken, Monique; Locorotondo, Sabrina; Lazzarino, Frederic; Altamirano Sanchez, Efrain; Huffman, Craig; Brus, Stephan; Demand, Marc; Struyf, Herbert; De Backer, Johan; Hermans, Jan; Delvaux, Christie; Vandeweyer, Tom; Baerts, Christina; Mannaert, Geert; Truffert, Vincent; Verluijs, j; Alaerts, Wilfried; Dekkers, Harold; Ong, Patrick; Heylen, Nancy; Kellens, Kristof; Volders, Henny; Hikavyy, Andriy; Vrancken, Christa; Rakowski, Michal; Verhaegen, Staf; Vandenberghe, Geert; Beyer, Gerald; Lauwers, Anne; Absil, Philippe; Hoffmann, Thomas Y.; Ronse, Kurt; Biesemans, Serge (2010)

    • High-speed TSV integration in an active silicon photonics interposer platform 

      Bogaerts, Lieve; El-Mekki, Zaid; Van Huylenbroeck, Stefaan; Nolmans, Philip; Pantano, Nicolas; Sun, Xiao; Rakowski, Michal; Velenis, Dimitrios; Verheyen, Peter; Balakrishnan, Sadhishkumar; De Heyn, Peter; Ban, Yoojin; Srinivasan, Ashwyn; Lardenois, Sebastien; De Coster, Jeroen; Detalle, Mikael; Absil, Philippe; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2018)

    • Highly sensitive, low-power, 10-20Gb/s transimpedance amplifier based on cascaded CMOS inverter gain stages 

      Rakowski, Michal; Ingels, Mark; De Meyer, Kristin; Steyaert, Michiel; Absil, Philippe; Van Campenhout, Joris (2014)

    • Hot hole induced damage in 1T-FBRAM on bulk 

      Aoulaiche, Marc; Collaert, Nadine; Mercha, Abdelkarim; Rakowski, Michal; De Wachter, Bart; Groeseneken, Guido; Altimime, Laith; Jurczak, Gosia (2011)

    • Hybrid 14nm FinFET - Silicon photonics technology for low-power Tb/s/mm2 optical I/O 

      Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Snyder, Brad; Balakrishnan, Sadhishkumar; Van Huylenbroeck, Stefaan; Bogaerts, Lieve; Demeurisse, Caroline; Inoue, Fumihiro; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Bex, Pieter; Srinivasan, Ashwyn; De Coster, Jeroen; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2018)