Browsing Conference contributions by author "Zahedmanesh, Houman"
Now showing items 21-38 of 38
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Interconnect metals beyond copper: reliability challenges and opportunities
Croes, Kristof; Adelmann, Christoph; Wilson, Chris; Zahedmanesh, Houman; Varela Pedreira, Olalla; Wu, Chen; Lesniewska, Alicja; Oprins, Herman; Beyne, Sofie; Ciofi, Ivan; Kocaay, Deniz; Stucchi, Michele; Tokei, Zsolt (2018) -
Introducing the EUV CNT pellicle
Lee, Jae Uk; Vanpaemel, Johannes; Pollentier, Ivan; Adelmann, Christoph; Zahedmanesh, Houman; Huyghebaert, Cedric; Timmermans, Marina; De Volder, Michael; Gallagher, Emily (2016) -
Introducing the euv cnt pellicle
Gallagher, Emily; Huyghebaert, Cedric; Lee, Jae Uk; Pollentier, Ivan; Timmermans, Marina; Zahedmanesh, Houman (2016) -
Mechanically conscious design of airgaps in nano-interconnects
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Metrology for evaluating elastic and fracture properties of porous low dielectric constant materials
Okudur, Oguzhan Orkut; Vanstreels, Kris; Zahedmanesh, Houman; De Wolf, Ingrid (2015) -
Novel membrane solutions for the EUV pellicle : better or not ?
Pollentier, Ivan; Lee, Jae Uk; Timmermans, Marina; Adelmann, Christoph; Zahedmanesh, Houman; Huyghebaert, Cedric; Gallagher, Emily (2017) -
Numerical analysis of airgap stability under process-induced thermo-mechanical loads
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2015) -
Numerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2015) -
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects
Nair, Sarath Mohanachandran; Bishnoi, Rajendra; Tahoori, Mehdi B.; Zahedmanesh, Houman; Croes, Kristof; Garello, Kevin; Kar, Gouri Sankar; Catthoor, Francky (2020) -
Process-oriented modelling of stresses and mechanical confinement in advanced nano-interconnects; implications for electromigration
Zahedmanesh, Houman; Croes, Kristof; Tokei, Zsolt (2017) -
Properties and performance of EUVL pellicle membranes
Gallagher, Emily; Vanpaemel, Johannes; Pollentier, Ivan; Zahedmanesh, Houman; Adelmann, Christoph; Huyghebaert, Cedric; Jonckheere, Rik; Lee, Jae Uk (2015) -
Properties and performance of EUVL pellicle membranes
Gallagher, Emily; Vanpaemel, Johannes; Pollentier, Ivan; Zahedmanesh, Houman; Adelmann, Christoph; Huyghebaert, Cedric; Jonckheere, Rik; Lee, Jae Uk (2015) -
Stress induced densification of thin porous low-k films during nanoindentation
Okudur, Oguzhan Orkut; Redzheb, Murad; Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario; De Wolf, Ingrid (2018) -
Stress mitigation of 3D-stacking/packaging induced stresses
Croes, Kristof; Cherman, Vladimir; Lofrano, Melina; Zahedmanesh, Houman; Kljucar, Luka; Gonzalez, Mario; De Wolf, Ingrid; Tokei, Zsolt; Beyne, Eric (2018) -
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents
Zahedmanesh, Houman; Ciofi, Ivan; Zografos, Odysseas; Croes, Kristof; Badaroglu, Mustafa (2022) -
Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits
Okudur, Oguzhan Orkut; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Zahedmanesh, Houman; Varela Pedreira, Olalla; Kim, Soon-Wook; Vanstreels, Kris; Beyne, Eric; De Wolf, Ingrid (2017) -
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters
Ding, Youqi; Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Chavez, T.; Farr, H.; De Wolf, Ingrid; Croes, Kristof (2023) -
Variation-aware physics-based electromigration modeling and experimental calibration for VLSI interconnects
Mohanachandran Nair, Sarath; Bishnoi, Rajendra; B. Tahoori, Mehdi; Zahedmanesh, Houman; Croes, Kristof; Garello, Kevin; Catthoor, Francky (2019)