Recently added

Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Murdoch, Gayle; De Vos, Joeri; Boemmels, Juergen; Beyne, Eric; Tokei, Zsolt (2016)

Atomic resolution quality control for Fin oxide recess by atomic resolution profiler

Kim, Tae-Gon; Ryu, Heon-Yul; Kenis, Karine; Jo, Ah-jin; Cho, Sang-Joon; Park, Sang-il; Schmidt, Sebastian; Irmer, Bernd (2016)

In-line critical dimension and sidewall roughness metrology study for compound nanostructure process control by in-line 3D atomic force microscopy

Kim, Tae-Gon; Ryu, Henry; Jo, Ah-jin; Cho, Sang-Joon; Park, Sang-il; Vandeweyer, Tom (2016)

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

Kim, Soon-Wook; Detalle, Mikael; Peng, Lan; Nolmans, Philip; Heylen, Nancy; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016)

Improvement of the CMOS characteristics of bulk Si FinFETs by high temperature ion implantation

Kikuchi, Yoshiaki; Hopf, Toby; Mannaert, Geert; Tao, Zheng; Waite, A.; Cournoyer, J.; Borniquel, J.; Schreutelkamp, Rob; Ritzenthaler, Romain; Kim, Min-Soo; Kubicek, Stefan; Chew, Soon Aik; Devriendt, Katia; Schram, Tom; Demuynck, Steven; Variam, N.; Horiguchi, Naoto; Mocuta, Dan (2016)

The impact of process variation and stochastic aging in nanoscale VLSI

Kiamehr, Saman; Weckx, Pieter; Tahoori, Mehdi; Kaczer, Ben; Kukner, Halil; Raghavan, Praveen; Groeseneken, Guido; Catthoor, Francky (2016)

Hybrid integration on low-cost flex foils using photonic flash soldiering

Khoshfetrat Pakazad, Saeed; Barink, Marco; Arutinov, Gari; Hendriks, Rob; Kusters, Roel; Cauwe, Maarten; van den Brand, Jeroen (2016)

Structure-property relations of high permittivity cathode interlayer materials towards bulk heterojunction organic solar cells

Kesters, Juren; Govaerts, Sanne; Pirotte, Geert; Chevrier, Michele; Van den Brande, Nico; Liu, Xianjie; Fahlman, Mats; Van Mele, Bruno; Lutsen, Laurence; Vanderzande, Dirk; Manca, Jean; Clément, Sébastien; von Hauff, Elizabeth; Maes, Wouter (2016)

Impact of dissolved oxygen in dilute HF solution on material etch

Kesters, Els; Iwasaki, Akihisa; Le, Quoc Toan; Holsteyns, Frank (2016)

On-chip fluorescence excitation and collection by focusing grating couplers

Kerman, Sarp; Vercruysse, Dries; Claes, Tom; Mahmud Ul Hasan, Hasan MD; Neutens, Pieter; Mukund, Vignesh; Rottenberg, Xavier; Lagae, Liesbet; Van Dorpe, Pol (2016)

Effect of integrated protection layer on photolithographic patterned organic light emitting diodes

Ke, Tung Huei; Malinowski, Pawel; Nakamura, Atsushi; Wuyts, Magalie; Gu, Danli; Lee, Jeong-Hwan; Steudel, Soeren; Janssen, Dimitri; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Heremans, Paul (2016)

Thin-film integrated circuits for IoT and sensor systems

Ke, Tung Huei (2016)

Hardware accelerated SDR platform for adaptive air interfaces

Kazaz, Tarik; Van Praet, Christophe; Kulin, Merima; Willemen, Pieter; Moerman, Ingrid (2016)

An integrated photonics reservoir computing approach to signal equalization for telecommunications

Katumba, Andrew; Schneider, Bendix; Dambre, Joni; Bienstman, Peter (2016)

Uniform large-area slot-die coating of soluble metal oxide semiconductor towards mass production of high-performance TFT backplanes

Katsouras, lias; Maas, Joris; van der Steen, Jan Laurens; Gelinck, Gerwin; Takata, Ryo; Marinkovic, Marko; Neumann, Anita; Pham, Duy-Vu; Anselmann, Ralf; Ke, Tung Huei; Smout, Steve; Schols, Sarah (2016)

Conference contributions: Recent submissions

Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

Atomic resolution quality control for Fin oxide recess by atomic resolution profiler

In-line critical dimension and sidewall roughness metrology study for compound nanostructure process control by in-line 3D atomic force microscopy

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

Improvement of the CMOS characteristics of bulk Si FinFETs by high temperature ion implantation

The impact of process variation and stochastic aging in nanoscale VLSI

Hybrid integration on low-cost flex foils using photonic flash soldiering

Structure-property relations of high permittivity cathode interlayer materials towards bulk heterojunction organic solar cells

Impact of dissolved oxygen in dilute HF solution on material etch

On-chip fluorescence excitation and collection by focusing grating couplers

Effect of integrated protection layer on photolithographic patterned organic light emitting diodes

Thin-film integrated circuits for IoT and sensor systems

Hardware accelerated SDR platform for adaptive air interfaces

An integrated photonics reservoir computing approach to signal equalization for telecommunications

Uniform large-area slot-die coating of soluble metal oxide semiconductor towards mass production of high-performance TFT backplanes

Design strategy for integrating DSA via patterning in sub-7 nm interconnects

Templated DSA vias in sub-7 nm circuits: Design strategy and DSA-aware via decomposition

Impact of DSA process variability on circuit performance

Device breakdown optimization of Al2O3/GaN E-mode MISFETs

Unified radio and network control across heterogeneous hardware platforms

Conference contributions: Recent submissions

Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging ﻿

Atomic resolution quality control for Fin oxide recess by atomic resolution profiler ﻿

In-line critical dimension and sidewall roughness metrology study for compound nanostructure process control by in-line 3D atomic force microscopy ﻿

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process ﻿

Improvement of the CMOS characteristics of bulk Si FinFETs by high temperature ion implantation ﻿

The impact of process variation and stochastic aging in nanoscale VLSI ﻿

Hybrid integration on low-cost flex foils using photonic flash soldiering ﻿

Structure-property relations of high permittivity cathode interlayer materials towards bulk heterojunction organic solar cells ﻿

Impact of dissolved oxygen in dilute HF solution on material etch ﻿

On-chip fluorescence excitation and collection by focusing grating couplers ﻿

Effect of integrated protection layer on photolithographic patterned organic light emitting diodes ﻿

Thin-film integrated circuits for IoT and sensor systems ﻿

Hardware accelerated SDR platform for adaptive air interfaces ﻿

An integrated photonics reservoir computing approach to signal equalization for telecommunications ﻿

Uniform large-area slot-die coating of soluble metal oxide semiconductor towards mass production of high-performance TFT backplanes ﻿

Design strategy for integrating DSA via patterning in sub-7 nm interconnects ﻿

Templated DSA vias in sub-7 nm circuits: Design strategy and DSA-aware via decomposition ﻿

Impact of DSA process variability on circuit performance ﻿

Device breakdown optimization of Al2O3/GaN E-mode MISFETs ﻿

Unified radio and network control across heterogeneous hardware platforms ﻿

Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

Atomic resolution quality control for Fin oxide recess by atomic resolution profiler

In-line critical dimension and sidewall roughness metrology study for compound nanostructure process control by in-line 3D atomic force microscopy

Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

Improvement of the CMOS characteristics of bulk Si FinFETs by high temperature ion implantation

The impact of process variation and stochastic aging in nanoscale VLSI

Hybrid integration on low-cost flex foils using photonic flash soldiering

Structure-property relations of high permittivity cathode interlayer materials towards bulk heterojunction organic solar cells

Impact of dissolved oxygen in dilute HF solution on material etch

On-chip fluorescence excitation and collection by focusing grating couplers

Effect of integrated protection layer on photolithographic patterned organic light emitting diodes

Thin-film integrated circuits for IoT and sensor systems

Hardware accelerated SDR platform for adaptive air interfaces

An integrated photonics reservoir computing approach to signal equalization for telecommunications

Uniform large-area slot-die coating of soluble metal oxide semiconductor towards mass production of high-performance TFT backplanes

Design strategy for integrating DSA via patterning in sub-7 nm interconnects

Templated DSA vias in sub-7 nm circuits: Design strategy and DSA-aware via decomposition

Impact of DSA process variability on circuit performance

Device breakdown optimization of Al2O3/GaN E-mode MISFETs

Unified radio and network control across heterogeneous hardware platforms