Recently added

Thermoluminescence spectroscopy study of conjugated polymer films: what can we learn from these measurements?

Kadashchuk, Andriy; Bässler, Heinz (2016)

Mapping of CMOS FET degradation in bias space - application to DRAM peripheral devices

Kaczer, Ben; Franco, Jacopo; Tyaginov, Stanislav; O'Sullivan, Barry; Ritzenthaler, Romain; Schram, Tom; Linten, Dimitri; Horiguchi, Naoto; Grasser, Tibor (2016)

On the distribution of the FET threshold voltage shifts due to individual charged gate oxide defects

Kaczer, Ben; Amoroso, S. M.; Hussin, R.; Asenov, A.; Franco, Jacopo; Weckx, Pieter; Roussel, Philippe; Grasser, T.; Rzepa, G.; Horiguchi, Naoto (2016)

CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects

Jourdan, Nicolas; van der Veen, Marleen; Vega Gonzalez, Victor; Croes, Kristof; Lesniewska, Alicja; Varela Pedreira, Olalla; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016)

300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections

Jourdan, Nicolas; Cellier, Daniel; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016)

Extreme wafer thinning optimization for via-last applications

Jourdain, Anne; De Vos, Joeri; Inoue, Fumihiro; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Hopkins, Janet; Ashraf, Huma; Thomas, Dave (2016)

ABI tool performance confirmation by NXE3300 printing results for native EUV blank defects at 16nm half pitch

Jonckheere, Rik; Yamane, Takeshi; Takagi, Noriaki; Watanabe, Hidehiro; Beral, Christophe (2016-11)

Quasi 2D epitaxial Si-O superlattices: growth, device performance and defect analysis

Jayachandran, Suseendran; Martens, Koen; Simoen, Eddy; Caymax, Matty; Vandervorst, Wilfried; Heyns, Marc; Delabie, Annelies (2016)

Micro-opto-mechanical pressure sensor (MOMPS) in SIN integrated photonics platform

Jansen, Roelof; Rochus, Veronique; Goyvaerts, Jeroen; Vandenbosch, Guy; van de Voort, Bob; Neutens, Pieter; O'Callaghan, John; Tilmans, Harrie; Rottenberg, Xavier (2016-05)

Predicting the optimal process window for the coating of single-crystalline organic films with mobilities exceeding 7 cm2/Vs

Janneck, Robby; Vercesi, Federico; Heremans, Paul; Genoe, Jan; Rolin, Cedric (2016)

The role of solvent evaporation dynamics in meniscus-guided coating techniques for high-performance, single-crystalline organic thin-film transistors

Janneck, Robby; Vercesi, Federico; Fesenko, Pavlo; Genoe, Jan; Heremans, Paul; Rolin, Cedric (2016)

Solution-processed, centimeter-sized, single-crystalline layers for high-performance organic thin-film transistors

Janneck, Robby; Bommanaboyena, Satya Prakash; Mehari, Fitsumbirhan Tetemke; Genoe, Jan; Heremans, Paul; Rolin, Cedric (2016)

Al2O3 passivation for copper plated 15.6x15.6 cm2 IBC cells

Jambaldinni, Shruti; Kyuzo, Manabu; O'Sullivan, Barry; Singh, Sukhvinder; Cornagliotti, Emanuele; Zielinski, Bartosz; Debucquoy, Maarten; Szlufcik, Jozef; Poortmans, Jef (2016)

Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration

Jacobs, Kristof J.P.; Khaled, Ahmad; Stucchi, Michele; Wang, Teng; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid (2016)

Rapid recovery process of plasma damaged porous low-k dielectrics by wet surface modifying treatment

Iwasaki, A,; Higuchi, A.; Komori, K.; Sato, M.; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank (2016)

Influence of different UTBB SOI technologies on analog parameters

Itocazu, Vitor. T.; Sonneberg, Victor; Simoen, Eddy; Claeys, Cor; Martino, Joao A. (2016)

SEM based overlay measurement between resist and buried patterns

Inoue, Osamu; Okagawa, Yutaka; Hasumi, Kazuhisa; Shao, Chuanyu; Leray, Philippe; Halder, Sandip; Lorusso, Gian; Baudemprez, Bart (2016)

Edge trimming for wafer-to-wafer 3D integration

Inoue, Fumihiro; Visker, Jakob; Jourdain, Anne; Moeller, Berthold; Yokoyama, Kaori; Peng, Lan; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016)

Characterization of extreme Si thinning proces for wafer-to-wafer stacking

Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016)

Structural and electrical properties of low temperature CVD-grown SiGe epitaxial layers

Ike, Shinichi; Simoen, Eddy; Shimura, Yosuke; Hikavyy, Andriy; Vandervorst, Wilfried; Loo, Roger; Takeuchi, Wakana; Nakatsuka, Osamu; Zaima, Shigeaki (2016)

Conference contributions: Recent submissions

Thermoluminescence spectroscopy study of conjugated polymer films: what can we learn from these measurements? ﻿

Mapping of CMOS FET degradation in bias space - application to DRAM peripheral devices ﻿

On the distribution of the FET threshold voltage shifts due to individual charged gate oxide defects ﻿

CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects ﻿

300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections ﻿

Extreme wafer thinning optimization for via-last applications ﻿

ABI tool performance confirmation by NXE3300 printing results for native EUV blank defects at 16nm half pitch ﻿

Quasi 2D epitaxial Si-O superlattices: growth, device performance and defect analysis ﻿

Micro-opto-mechanical pressure sensor (MOMPS) in SIN integrated photonics platform ﻿

Predicting the optimal process window for the coating of single-crystalline organic films with mobilities exceeding 7 cm2/Vs ﻿

The role of solvent evaporation dynamics in meniscus-guided coating techniques for high-performance, single-crystalline organic thin-film transistors ﻿

Solution-processed, centimeter-sized, single-crystalline layers for high-performance organic thin-film transistors ﻿

Al2O3 passivation for copper plated 15.6x15.6 cm2 IBC cells ﻿

Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration ﻿

Rapid recovery process of plasma damaged porous low-k dielectrics by wet surface modifying treatment ﻿

Influence of different UTBB SOI technologies on analog parameters ﻿

SEM based overlay measurement between resist and buried patterns ﻿

Edge trimming for wafer-to-wafer 3D integration ﻿

Characterization of extreme Si thinning proces for wafer-to-wafer stacking ﻿

Structural and electrical properties of low temperature CVD-grown SiGe epitaxial layers ﻿