Recently added

112 Gbit/s single-polarization silicon coherent receiver with hybrid-integrated BiCMOS linear TIA

Verbist, Jochem; Zhang, Jing; Moeneclaey, Bart; van Weerdenburg, John; van Uden, Roy; Okonkwo, Chigo; Yin, Xin; Bauwelinck, Johan; Roelkens, Gunther (2015)

Gate-all-around NWFETs vs. triple-gate FinFETs: junctionless vs. extensionless and conventional junction devices with controlled EWF modulation for multi-VT CMOS

Veloso, Anabela; Hellings, Geert; Cho, Moon Ju; Simoen, Eddy; Devriendt, Katia; Paraschiv, Vasile; Vecchio, Emma; Tao, Zheng; Versluijs, Janko; Souriau, Laurent; Dekkers, Harold; Brus, Stephan; Geypen, Jef; Lagrain, Pieter; Bender, Hugo; Eneman, Geert; Matagne, Philippe; De Keersgieter, An; Fang, W.; Collaert, Nadine; Thean, Aaron (2015)

Processing active devices on Si interposer and impact on cost

Velenis, Dimitrios; Detalle, Mikael; Hellings, Geert; Scholz, Mirko; Marinissen, Erik Jan; Van der Plas, Geert; La Manna, Antonio; Miller, Andy; Linten, Dimitri; Beyne, Eric (2015)

Design of cavity-enhanced photothermal mid-infrared spectroscopy for sensing applications

Vasiliev, Anton; Malik, Aditya Singh; Muneeb, Muhammad; Baets, Roel; Roelkens, Gunther (2015)

Challenges and solutions for chip package interaction

Vanstreels, Kris; Cherman, Vladimir; Zahedmanesh, Houman; De Wolf, Ingrid; Gonzalez, Mario (2015)

Trends and challenges in tunnel field effect transistors

Vandooren, Anne; Rooyackers, Rita; Alian, AliReza; Verhulst, Anne; Verreck, Devin; Smets, Quentin; Mocuta, Anda; Collaert, Nadine; Thean, Aaron (2015)

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Vandevelde, Bart; Zanon, Franco; Griffoni, Alessio; Li, Xiaoling; Willems, Geert; Meneghini, Matteo (2015)

Advances in metrology for complex epitaxial systems embedded in small volums

Vandervorst, Wilfried; Kumar, Arul; Meersschaut, Johan; Franquet, Alexis; Douhard, Bastien; Delmotte, Joris; Conard, Thierry; Nuytten, Thomas; Hantschel, Thomas; Loo, Roger (2015-05)

Demonstration of a cost effective Cu electroless TSV metallization scheme

Vandersmissen, Kevin; Inoue, Fumihiro; Velenis, Dimitrios; Li, Yunlong; Dictus, Dries; Frees, Bart; Van Huylenbroeck, Stefaan; Kondo, M.; Seino, T.; Heylen, Nancy; Struyf, Herbert; van der Veen, Marleen (2015)

ExaSHARK+GASPI: Reducing the burden to program large HPC systems since 2014

Vander Aa, Tom; Chakroun, Imen; Wuyts, Roel; Rahn, Mirko; Siummendinger, Christian (2015)

ExaShark: A scalable hybrid array kit for exascale simulation

Vander Aa, Tom (2015)

Photonic subsystems for optical packet/burst switches based on heterogeneous SOI and III-V integration

Van Thourhout, Dries; Tassaert, Martijn; De Heyn, Peter; Raz, Oded; Calabretta, N.; Dorren, H.J.S.; Roelkens, Gunther (2015)

Hybrid graphene-silicon photonics devices

Van Thourhout, Dries; Hu, Yingtao; Pantouvaki, Marianna; Alexander, Koen; Kuyken, Bart; Brems, Steven; Asselberghs, Inge; Huyghebaert, Cedric; Allessandri, Chiara; Absil, Philippe; Van Campenhout, Joris (2015)

Patterning options for N7 logic : Prospects and challenges for EUV

van Setten, Eelco; Wittebrood, Friso; Psara, Eleni; van Oorschot, Dorothe; Philipsen, Vicky (2015)

Edge placement error analysis for N7 logic patterning options

van Setten, Eelco; Psara, Eleni; Wittebrood, Friso; Oorschot, Dorothe; van Dijk, Joep; Schiffelers, Guido; Finders, Jo; Dusa, Mircea; Philipsen, Vicky; Hendrickx, Eric (2015)

Si and SiN biophotonic technology platform, applied to biosensing, spectroscopy, and lens-free imaging

Van Roy, Wim; Neutens, Pieter; Claes, Tom; Jansen, Roelof; Subramanian, Ananth; Jans, Karolien; Vos, Rita; O'Callaghan, John; Vercruysse, Dries; Stahl, Richard; Mukund, Vignesh; Du Bois, Bert; Helin, Philippe; Stassen, Andim; Severi, Simone; Martens, Daan; Bienstman, Peter; Deshpande, Paru; Baets, Roel; Lambrechts, Andy; Lagae, Liesbet; Rottenberg, Xavier; Van Dorpe, Pol (2015)

Conference contributions: Recent submissions

112 Gbit/s single-polarization silicon coherent receiver with hybrid-integrated BiCMOS linear TIA

Gate-all-around NWFETs vs. triple-gate FinFETs: junctionless vs. extensionless and conventional junction devices with controlled EWF modulation for multi-VT CMOS

Processing active devices on Si interposer and impact on cost

Design of cavity-enhanced photothermal mid-infrared spectroscopy for sensing applications

Challenges and solutions for chip package interaction

Trends and challenges in tunnel field effect transistors

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Advances in metrology for complex epitaxial systems embedded in small volums

Demonstration of a cost effective Cu electroless TSV metallization scheme

ExaSHARK+GASPI: Reducing the burden to program large HPC systems since 2014

ExaShark: A scalable hybrid array kit for exascale simulation

Photonic subsystems for optical packet/burst switches based on heterogeneous SOI and III-V integration

Hybrid graphene-silicon photonics devices

Patterning options for N7 logic : Prospects and challenges for EUV

Edge placement error analysis for N7 logic patterning options

Si and SiN biophotonic technology platform, applied to biosensing, spectroscopy, and lens-free imaging

Alternative EUV mask technology to compensate for mask 3D effects

Experimental validation of novel mask technology to reduce mask 3D effects

Experimental validation of novel EUV mask technology to reduce mask 3D effects

An inductorless electrical-balance 360° phase-shifter for 0.5-1.15GHz in 0.18μm CMOS

Conference contributions: Recent submissions

112 Gbit/s single-polarization silicon coherent receiver with hybrid-integrated BiCMOS linear TIA ﻿

Gate-all-around NWFETs vs. triple-gate FinFETs: junctionless vs. extensionless and conventional junction devices with controlled EWF modulation for multi-VT CMOS ﻿

Processing active devices on Si interposer and impact on cost ﻿

Design of cavity-enhanced photothermal mid-infrared spectroscopy for sensing applications ﻿

Challenges and solutions for chip package interaction ﻿

Trends and challenges in tunnel field effect transistors ﻿

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis ﻿

Advances in metrology for complex epitaxial systems embedded in small volums ﻿

Demonstration of a cost effective Cu electroless TSV metallization scheme ﻿

ExaSHARK+GASPI: Reducing the burden to program large HPC systems since 2014 ﻿

ExaShark: A scalable hybrid array kit for exascale simulation ﻿

Photonic subsystems for optical packet/burst switches based on heterogeneous SOI and III-V integration ﻿

Hybrid graphene-silicon photonics devices ﻿

Patterning options for N7 logic : Prospects and challenges for EUV ﻿

Edge placement error analysis for N7 logic patterning options ﻿

Si and SiN biophotonic technology platform, applied to biosensing, spectroscopy, and lens-free imaging ﻿

Alternative EUV mask technology to compensate for mask 3D effects ﻿

Experimental validation of novel mask technology to reduce mask 3D effects ﻿

Experimental validation of novel EUV mask technology to reduce mask 3D effects ﻿

An inductorless electrical-balance 360° phase-shifter for 0.5-1.15GHz in 0.18μm CMOS ﻿

112 Gbit/s single-polarization silicon coherent receiver with hybrid-integrated BiCMOS linear TIA

Gate-all-around NWFETs vs. triple-gate FinFETs: junctionless vs. extensionless and conventional junction devices with controlled EWF modulation for multi-VT CMOS

Processing active devices on Si interposer and impact on cost

Design of cavity-enhanced photothermal mid-infrared spectroscopy for sensing applications

Challenges and solutions for chip package interaction

Trends and challenges in tunnel field effect transistors

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Advances in metrology for complex epitaxial systems embedded in small volums

Demonstration of a cost effective Cu electroless TSV metallization scheme

ExaSHARK+GASPI: Reducing the burden to program large HPC systems since 2014

ExaShark: A scalable hybrid array kit for exascale simulation

Photonic subsystems for optical packet/burst switches based on heterogeneous SOI and III-V integration

Hybrid graphene-silicon photonics devices

Patterning options for N7 logic : Prospects and challenges for EUV

Edge placement error analysis for N7 logic patterning options

Si and SiN biophotonic technology platform, applied to biosensing, spectroscopy, and lens-free imaging

Alternative EUV mask technology to compensate for mask 3D effects

Experimental validation of novel mask technology to reduce mask 3D effects

Experimental validation of novel EUV mask technology to reduce mask 3D effects

An inductorless electrical-balance 360° phase-shifter for 0.5-1.15GHz in 0.18μm CMOS