Recently added

Detection, binning, and analysis of defects in a GaN-on-Si process for high brightness light emitting diodes

Halder, Sandip; Miller, Andy; Osman, Haris; Dutta, Barundeb; Mani, Antonio; Jones, Chris; McCance, Syd; Burkeen, Frank (2012)

Metrology and inspection requirements for 3D stacking of ICs

Halder, Sandip; Miller, Andy; Maenhoudt, Mireille; Beyer, Gerald; Swinnen, Bart; Beyne, Eric; Grant, David; Marx, David; Dudley, Russ; Ford, Maurice (2012)

In-line metrology and inspection for process control during 3D stacking of IC�s

Halder, Sandip; De Wolf, Ingrid; Phommahaxay, Alain; Miller, Andy; Maenhoudt, Mireille; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012)

Compact silicon differential receiver with integrated zero biased balanced detection

Hakansson, Andreas; Aamer, Mariam; Sotiropoulos, Nikolaos; Brimont, Antoine; Sanchis, Pablo; Fedeli, Jean-pierre; Marris-Morini, Delphine; Cassan, Eric; Vivien, Laurent; Gilbert, Karen; Grosse, Philippe; Hartmann, Jean Michel; Vermeulen, Diedrik; Roelkens, Gunther (2012-08)

A wireless sensor a day keeps the doctor away

Gyselinckx, Bert (2012)

Towards high mobility GeSn channel nMOSFETs: improved surface passivation using novel ozone oxidation method

Gupta, Somya; Vincent, Benjamin; Yang, B.; Lin, Dennis; Gencarelli, Federica; Lin, J.-Y. J.; Chen, R.; Richard, Olivier; Bender, Hugo; Magyari-Koepe, B.; Caymax, Matty; Dekoster, Johan; Nishi, Y.; Saraswat, K. C. (2012)

GeSn channel nMOSFETs: material potential and technological outlook

Gupta, Somya; Vincent, Benjamin; Lin, Dennis; Gunji, M.; Firrincieli, Andrea; Gencarelli, Federica; Magyari-Kope, B.; Yang, B.; Douhard, Bastien; Delmotte, Joris; Franquet, Alexis; Caymax, Matty; Dekoster, Johan; Nishi, Y.; Saraswat, K.C. (2012)

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012)

Impact of through silicon via induced mechanical stress on fully depleted bulk FinFET technology

Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Cherman, Vladimir; Eneman, Geert; De Wachter, Bart; Togo, Mitsuhiro; Redolfi, Augusto; Kubicek, Stefan; Civale, Yann; Chiarella, Thomas; Vandevelde, Bart; Croes, Kristof; De Wolf, Ingrid; Debusschere, Ingrid; Mercha, Abdelkarim; Thean, Aaron; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012)

COMPLEX - COdesign and power Management in PLatform-based design space EXploration

Gruttner, Kim; Hartmann, Philipp A.; Hylla, Kai; Rosinger, Sven; Nebel, Wolfgang; Herrera, Fernando; Villar, Eugenio; Brandolese, Carlo; Fornaciari, William; Palermo, Gianluca; Couvreur, Chantal; Quaglia, Davide; Ferrero, Francisco; Valencia, Raul (2012)

Quantification of shot noise contributions to contact hole local CD non-uniformity

Gronheid, Roel; Winroth, Gustaf; Vaglio Pret, Alessandro; Younkin, Todd (2012)

Recent trends in the electrical characterization and reliability assessment of CMOS devices

Groeseneken, Guido; Degraeve, Robin; Cho, Moon Ju; Franco, Jacopo; Kaczer, Ben; Martens, Koen; Roussel, Philippe; Toledano Luque, Maria (2012)

On the microscopic origin of the frequency dependence of hole trapping in pMOSFETs

Grasser, Tibor; Reisinger, Hans; Rott, Karina; Toledano Luque, Maria; Kaczer, Ben (2012-12)

On the frequency dependence of the bias temperature instability

Grasser, Tibor; Kaczer, Ben; Reisinger, Hans; Wagner, Paul-Jurgen; Toledano Luque, Maria (2012)

Effect of an in-situ H2 plasma pretreatment on the minority carrier lifetime of a-Si:H(i) passivated crystalline silicon

Granata, Stefano; Bearda, Twan; Dross, Frederic; Gordon, Ivan; Poortmans, Jef; Mertens, Robert (2012)

Improved surface cleaning by in-situ hydrogen plasma for amorphous/crystalline silicon heterojunction solar cells

Granata, Stefano; Bearda, Twan; Dross, Frederic; Gordon, Ivan; Poortmans, Jef; Mertens, Robert (2012)

Al2O3 surface passivation characterized on hydrophobic and hydrophilic c-Si by a combination of QSSPC, CV, XPS and FTIR

Goverde, Hans; Vermang, Bart; Morato, Alessandro; John, Joachim; Horzel, Jörg; Meneghesso, Gaudenzio; Poortmans, Jef (2012)

Field-driven ultrafast sub-ns programming in W\Al2O3\Ti\CuTe-based 1T1R CBRAM system

Goux, Ludovic; Sankaran, Kiroubanand; Kar, Gouri Sankar; Jossart, Nico; Opsomer, Karl; Degraeve, Robin; Pourtois, Geoffrey; Rignanese, G.-M.; Detavernier, C.; Clima, Sergiu; Chen, Yangyin; Fantini, Andrea; Govoreanu, Bogdan; Wouters, Dirk; Jurczak, Gosia; Altimime, Laith; Kittl, Jorge (2012)

Thermal-stability optimization of Al2O3/Cu-Te based CBRAM systems

Goux, Ludovic; Opsomer, Karl; Kar, Gouri Sankar; Jossart, Nico; Muller, Robert; Detavernier, C.; Wouters, Dirk; Jurczak, Gosia; Kittl, Jorge (2012)

Ultralow sub-500nA operating current high-performance TiN\Al2O3\HfO2\Hf\TiNbipolar RRAM achieved through understanding-based stack-engineering

Goux, Ludovic; Fantini, Andrea; Kar, Gouri Sankar; Chen, Yangyin; Jossart, Nico; Degraeve, Robin; Clima, Sergiu; Govoreanu, Bogdan; Lorenzo, G.; Pourtois, Geoffrey; Wouters, Dirk; Kittl, Jorge; Altimime, Laith; Jurczak, Gosia (2012)

Conference contributions: Recent submissions

Detection, binning, and analysis of defects in a GaN-on-Si process for high brightness light emitting diodes ﻿

Metrology and inspection requirements for 3D stacking of ICs ﻿

In-line metrology and inspection for process control during 3D stacking of IC�s ﻿

Compact silicon differential receiver with integrated zero biased balanced detection ﻿

A wireless sensor a day keeps the doctor away ﻿

Towards high mobility GeSn channel nMOSFETs: improved surface passivation using novel ozone oxidation method ﻿

GeSn channel nMOSFETs: material potential and technological outlook ﻿

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps ﻿

Impact of through silicon via induced mechanical stress on fully depleted bulk FinFET technology ﻿

COMPLEX - COdesign and power Management in PLatform-based design space EXploration ﻿

Quantification of shot noise contributions to contact hole local CD non-uniformity ﻿

Recent trends in the electrical characterization and reliability assessment of CMOS devices ﻿

On the microscopic origin of the frequency dependence of hole trapping in pMOSFETs ﻿

On the frequency dependence of the bias temperature instability ﻿

Effect of an in-situ H2 plasma pretreatment on the minority carrier lifetime of a-Si:H(i) passivated crystalline silicon ﻿

Improved surface cleaning by in-situ hydrogen plasma for amorphous/crystalline silicon heterojunction solar cells ﻿

Al2O3 surface passivation characterized on hydrophobic and hydrophilic c-Si by a combination of QSSPC, CV, XPS and FTIR ﻿

Field-driven ultrafast sub-ns programming in W\Al2O3\Ti\CuTe-based 1T1R CBRAM system ﻿

Thermal-stability optimization of Al2O3/Cu-Te based CBRAM systems ﻿

Ultralow sub-500nA operating current high-performance TiN\Al2O3\HfO2\Hf\TiNbipolar RRAM achieved through understanding-based stack-engineering ﻿