Browsing Articles by author "Zahedmanesh, Houman"
Now showing items 1-20 of 23
-
A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Ding, Youqi; Lofrano, Melina; Varela Pedreira, Olalla; Zahedmanesh, Houman; Croes, Kristof; De Wolf, Ingrid (2022) -
A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
Saleh, Ahmed; Croes, Kristof; Ceric, H.; De Wolf, Ingrid; Zahedmanesh, Houman (2023) -
A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2016) -
Airgaps in advanced nano-interconnects; mechanics and impact on electromigration
Zahedmanesh, Houman; Besser, Paul; Wilson, Chris; Croes, Kristof (2016) -
Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods
Ceric, Hajdin; Zahedmanesh, Houman; Croes, Kristof (2019) -
Buried power rail integration with FinFETs for ultimate CMOS scaling
Gupta, Anshul; Varela Pedreira, Olalla; Arutchelvan, Goutham; Zahedmanesh, Houman; Devriendt, Katia; Hanssen, Frederik; Tao, Zheng; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, Noemie; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min-Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Cousserier, Joris; Yakimets, Dmitry; Lazzarino, Frederic; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Jaysankar, Manoj; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Boemmels, Juergen; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Ceric, H.; Zahedmanesh, Houman; Croes, Kristof; Lacerda de Orio, R.; Selberherr, S. (2023) -
High-Performance Radiation-Hardened Spintronic Retention Latch and Flip-Flop for Highly Reliable Processors
Nair, Sarath Mohanachandran; Mayahinia, Mahta; Tahoori, Mehdi B.; Perumkunnil, Manu; Zahedmanesh, Houman; Croes, Kristof; Garello, Kevin; Marinelli, Tommaso; Evenblij, Timon; Kar, Gouri Sankar; Catthoor, Francky (2021) -
Impact of Back-End-Of-Line architecture on chip-package-interaction in advanced interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020) -
In-situ scanning electron microscopy study of fracture events during BEOL microbeam bending tests
Vanstreels, Kris; De Wolf, Ingrid; Zahedmanesh, Houman; Bender, Hugo; Gonzalez, Mario; Lefebvre, J.; Bhowmick, S. (2014) -
Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
Zahedmanesh, Houman; Varela Pedreira, Olalla; Tokei, Zsolt; Croes, Kristof (2019) -
Mechanical integrity of back-end-of-Line with Ru nanowires and airgaps
Zahedmanesh, Houman; Vanstreels, Kris (2020) -
Mechanical integrity of nano-interconnects as brittle-matrix nano-composites
Zahedmanesh, Houman; Vanstreels, Kris; Le, Quoc Toan; Verdonck, Patrick; Gonzalez, Mario (2018) -
Mechanical integrity of nano-interconnects; the impact of metallization density
Zahedmanesh, Houman; Vanstreels, Kris (2019) -
Mechanical stability of airgaps in nano-interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020) -
Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients
Zahedmanesh, Houman; Croes, Kristof (2020) -
Nano-Ridge Bending during Conformal Ruthenium Metallization: Implications for Interconnect Fabrication
Zahedmanesh, Houman; Vega Gonzalez, Victor; Tokei, Zsolt (2021) -
Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects
Ceric, H.; Selberherr, S.; de Orio, R. L.; Zahedmanesh, Houman; Croes, Kristof (2021) -
Stress analysis of airgaps under process-induced thermomechanical loads
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016)