Browsing Presentations by imec author "e3275834bba7a19afe8cc6230aca641220b5de3f"

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007)

An overview of some recent CMP projects at imec

Teugels, Lieve; Heylen, Nancy; Leunissen, Peter (2011)

Defect characterization in templated DSA through electrical measurements

Rincon Delgadillo, Paulina; Chan, BT; Gronheid, Roel; van der Veen, Marleen; Heylen, Nancy; Vandersmissen, Kevin; Demuynck, Steven; Boemmels, Juergen (2016)

Direct CMP of high porosity ultra low-k materials

Heylen, Nancy (2011)

Effect of CMP slurry filtration on wafer defectivity

Devriendt, Katia; Meuris, Marc; Heylen, Nancy; Vrancken, Evi; Grillaert, Joost; Heyns, Marc; Ling, Zhi Ming (1998)

Electromigration study of ultra narrow copper lines in low-k dielectric

Croes, Kristof; Moon, Kwang Jin; Carbonell, Laure; Struyf, Herbert; Heylen, Nancy; Tokei, Zsolt; Beyer, Gerald (2007)

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005)

Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects

Harada, Ken; Shibata, Toshiaki; Kawase, Yasuhiro; Teugels, Lieve; Heylen, Nancy; Struyf, Herbert (2019)

Influence of pH on the channel cracking rate of organosilicate films in wet ambients

Iacopi, Francesca; Elia, Carmine; Fournier, Teddy; Sinapi, Fabrice; Heylen, Nancy; Travaly, Youssef (2007)

Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask

Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007)

Integration of an organic ultra low-k (k=2.2) material

Pantouvaki, Marianna; Zhao, Larry; Huffman, Craig; Heylen, Nancy; Ferchichi, Abdelkarim; Ono, Y.; Nakajima, M.; Nakatani, K.; Struyf, Herbert; Beyer, Gerald; Baklanov, Mikhaïl (2009)

Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H.; Takamure, N.; Beynet, Julien; Sprey, Hessel; Matsushita, K.; Kobayashi, N.; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009)