Browsing Presentations by imec author "e576afbf43add4095143c6322cedb3ccde8f2762"
Now showing items 21-40 of 90
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Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics
Abell, Thomas; Shamiryan, Denis; Patz, Matthias; Maex, Karen (2003) -
CoSi2 formation using a Ti capping layer - influence of processing conditions on CoSi2 nucleation
Detavernier, C.; Van Meirhaeghe, R.; Maex, Karen (2001) -
Development of an electroless copper deposition bath for via fill applications on TiN seed layers
Palmans, Roger; Maex, Karen (1994) -
Effect of HF solution on the porous structure of low-k SICOH film
Shamiryan, Denis; Baklanov, Mikhaïl; Vanhaelemeersch, Serge; Maex, Karen (2000) -
Effect of implantation oxide on the silicidation of narrow diffused and poly-lines
Naem, Abdalla; Lauwers, A.; de Potter de ten Broeck, Muriel; Maex, Karen (1997) -
Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminium metallizations
Heyvaert, Ilse; Van Hove, Marleen; Witvrouw, Ann; Maex, Karen; Saerens, Annelies; Roussel, Philippe; Bender, Hugo (1999) -
Effect of varying the initial conditions prior to flash-assist rapid thermal processing on dopant activation, diffusion, and defect populations
Camillo-Castillo, Renata; Law, M.E.; Lindsay, Richard; Maex, Karen; Pawlak, Bartek; McCoy, S. (2005) -
Effects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films
Iacopi, Francesca; Waldfried, Carlo; Abell, Thomas; Guyer, Eric; Eyckens, Brenda; Travaly, Youssef; Sajavaara, Timo; Gage, David M.; Beyer, Gerald; Berry, Ivan; Dauskardt, Reinhold; Maex, Karen (2005) -
Electrical and microstructural characterization of narrow Cu interconnects
Wu, Wen; Brongersma, Sywert; Vervoort, Iwan; Bender, Hugo; Van Hove, Marleen; Maex, Karen (2003) -
Electrical evaluation and TEM/SEm investigation of a bottomless I-PVD Ta(N) barrier in a damascene architecture
Yamagishi, Hajime; Tokei, Zsolt; Beyer, Gerald; Donaton, R. A.; Bender, Hugo; Nogami, T.; Maex, Karen (2000) -
Electrical performance and scalability of Ni-monosilicide towards sub 0.13 μm technologies
Lauwers, A.; de Potter de ten Broeck, Muriel; Lindsay, Richard; Steegen, An; Roelandts, Nico; Lossen, F.; Vrancken, Christa; Maex, Karen (2001) -
Electrochemical deposition of copper alloys
Quoc, Toan Le; Vervoort, Iwan; Conard, Thierry; Maex, Karen (2001) -
Electroless copper deposition on TiN
Min, Woo Sig; Palmans, Roger; Maex, Karen; Lee, D. N. (1997) -
Evaluation of post metal etch cleaning by analyzing chemical compositions and distributions
Li, H.; Baklanov, Mikhaïl; Boullart, Werner; Conard, Thierry; Brijs, Bert; Maex, Karen; Froyen, L. (1998) -
Feasability of TiSi2 and CoSi2 for sub quarter micron processes
Vanhaelemeersch, Serge; Baklanov, Mikhaïl; Maex, Karen (1996) -
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Brongersma, Sywert; Maex, Karen (2004) -
Formation of continuous and ultra-thin PtSi layers for infrared detector applications
Donaton, R. A.; Jin, S.; Bender, Hugo; Maex, Karen; Vantomme, Andre; Langouche, G. (1998) -
Grain growth in electroplated copper
Brongersma, Sywert; Kerr, Emma; Vervoort, Iwan; Maex, Karen (2001) -
Growth and characterization of atomic layer deposited WCxNy
Martin Hoyas, Ana; Travaly, Youssef; Schuhmacher, Jorg; Sajavaara, T.; Whelan, Caroline; Eyckens, Brenda; Richard, Olivier; Giangrandi, Simone; Brijs, Bert; Jonas, A.M.; Vantomme, A.; Vandervorst, Wilfried; Celis, Jean-Pierre; Maex, Karen (2005) -
IMP liners for all speed fill
Beyer, Gerald; Maex, Karen; Daniels, Stephen; Maity, Nirmalya; Bassanini, Davide (1998)