Browsing by Author "Barbarin, Yohan"
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Publication As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Journal article2014, Microelectronics Reliability, (54) 9_10, p.1675-1679Publication Characterization of carbon nanotubes based vertical interconnects
Proceedings paper2012, International Conference on Solid State Devices and Materials - SSDM, 25/09/2012, p.648-649Publication Characterization of metal permeation in porous low-k films by spectroscopic ellipsometry
Meeting abstract2013, 6th International Conference on Spectroscopy Ellipsometry - ICSE-VI, 26/05/2013, p.1Publication Correlation between field dependent electrical conduction and dielectric breakdown in a SiOCH based low-k (k=2.0) dielectric
Journal article2013, Applied Physics Letters, (103) 3, p.32904Publication CVD Mn-based self-formed barrier for advanced interconnect technology
Proceedings paper2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.2.3Publication CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies
Meeting abstract2013, 224th ECS Fall Meeting, 27/10/2013, p.2081Publication Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
Proceedings paper2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.105-107Publication Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects
Meeting abstract2013, Materials for Advanced Metallization - MAM, 10/03/2013, p.105-106Publication Electrical improvement of CNT contacts with Cu damascene top metallization
Proceedings paper2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.13-MarPublication Electron mean-free path for CNT in vertical interconnects approaches Cu
Proceedings paper2014, IEEE International Interconnect Technology Conference - IITC, 20/05/2014, p.181-184Publication Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed
Meeting abstract2012, Advanced Metallization Conference, 9/10/2012Publication Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films
Journal article2013, Microelectronic Engineering, 110, p.29-34Publication Growth and integration challenges for carbon nanotubes interconnects
Journal article2014, Microelectronic Engineering, 120, p.188-193Publication Impact of carbon-doping on time dependent dielectric breakdown of SiO2-based films
Journal article2015, Applied Physics Letters, (106) 7, p.72902Publication Influence of porosity on dielectric breakdown of ultralow-k dielectrics
Journal article2013, Journal of Vacuum Science and Technology B, (31) 5, p.50604Publication Low field TDDB of BEOL interconnects using >40 months of data
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.2F.4Publication Low-k a-SiCO:H films as diffusion barriers for advanced interconnects
Journal article2014, Microelectronic Engineering, 120, p.221-224Publication Optimization of vertical carbon nanotube interconnects using the direct electrical comparison of integration steps
Proceedings paper2014-11, 27th International Microprocesses and Nanotechnology Conference - MNC, 4/11/2014, p.7D-8-1Publication Plasma enhanced chemical vapor deposition of manganese on low-k dielectrics for copper diffusion barrier application
Journal article2013, ECS Solid State Letters, (2) 3, p.25-27Publication Reliability characteristics of thin porous low-k silica-based interconnect dielectrics
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.2F.3