Browsing by Author "Croes, Kristof"
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Publication 1/f noise measurements for faster electromigration characterization
Proceedings paper2016, IEEE International Reliability Physics Symposium - IRPS, 17/04/2016, p.5B.3Publication 1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections
Journal article2016, Journal of Applied Physics, (119) 18, p.184302Publication 1Xnm copper and low-k reliability
Proceedings paper2011-09, International Conference on Solid State Devices and Materials - SSDM, 28/09/2011, p.777-778Publication 21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Proceedings paper2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.3.4Publication 32x100 GHz WDM filter based on ultra-compact silicon rings with a high thermal tuning efficiency of 5.85 mW/Ï
; ; ; ; Proceedings paper2024, Optical Fiber Communications Conference and Exhibition (OFC), MAR 24-28, 2024Publication 3D IC interconnects: microbump yield electrical characterization and TSV modeling
Proceedings paper2014, Electrical and Computer Engineering Greek Student Conference, 11/04/2014Publication A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
Meeting abstract2012, Materials for Advanced Metallization - MAM, 11/03/2012, p.P3-08Publication A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Journal article2022, MICROELECTRONICS RELIABILITY, 138, p.114632Publication A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
Journal article2024, NANOMATERIALS, (14) 22, p.Art. 1834Publication A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
Journal article2023, JOURNAL OF APPLIED PHYSICS, (134) 13, p.Art. 135102Publication A NEMS based sensor to monitor stress in deep sub-micron Cu/Low-$k$ interconnects
Journal article2009, Semicond. Sci. Technol., (24) 11, p.115018Publication A novel electromigration characterization method based on low-frequency noise measurements
Journal article2019, Semiconductor Science and Technology, (34) 7, p.75002Publication A Novel System-Level Physics-based Electromigration Modelling Framework: Application to the Power Delivery Network
Proceedings paper2021, 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP), NOV 04, 2021, p.1-7Publication A novel test structure to study intrinsic reliability of barrier/low-k
Proceedings paper2009, 47th Annual IEEE International Reliability Physics Symposium - IRPS, 26/04/2009, p.848-850Publication A pragmatic network-aware paradigm for system-level electromigration predictions at scale
Proceedings paper2023, 61st IEEE International Reliability Physics Symposium (IRPS), MAR 26-30, 2023Publication A tool flow for predicting system level timing failures due to interconnect reliability degradation
Proceedings paper2008, Proceedings 18th ACM Great Lakes Symposiun on VLSI, 4/05/2008, p.291-296Publication Accelerated device degradation analysis on high speed Ge waveguide photodetectors
Meeting abstract2019, 2019 IEEE International Reliability Phyics Symposium - IRPS, 31/03/2019Publication Advanced metallization scheme for 3×50μm via middle TSV and beyond
; ; ; ; ; Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.66-72Publication Advanced physical analysis of 3D interconnect
Publication Airgaps in advanced nano-interconnects; mechanics and impact on electromigration
Journal article2016, Journal of Applied Physics, (120) 9, p.95103