Browsing by Author "De Roest, David"

A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

A new approach for the calculation of line capacitances of two-layer IC interconnects

A physics-based VLSI interconnect model including substrate and conductor skin effects

Accurate analytic expressions for frequency-dependent inductance and resistance of single on-chip interconnects on conductive silicon Substrate

Admittance matrix calculations of on-chip interconnects on lossy silicon substrate using multilayer Green's function

Advanced solutions for copper and low k technology

CAD-oriented analytic formulas for self and mutual capacitance of interconnects on an Si-SiO2 substrate

Characterization and integration in Cu damascene structures of AURORA, an inorganic low-k dielectric

Characterization and integration of a new Si-O-C film deposited by CVD

Characterization and optimization of porogen based PECVD deposited extreme low-k materials as a function of UV-cure time

Critical issues in the integration of Copper and low-k dielectrics

Deposition and characterization of porogen based PECVD deposited and UV-cured extreme low-k materials

Dielectric reliability of 50nm half pitch structures in Aurora® LK

Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance

Electrical characteristics of P-type bulk Si fin field-effect transistor using solid-source doping with 1-nm phosphosilicate glass

Electrical characterization of low-k dielectrics and copper interconnects

Exploration of a low-temperature PEALD technology to trim and smooth 193i photoresist

Fast and accurate analysis of the multiconductor interconnects

Frequency-dependent expressions for inductance and resistance of microstrip line on silicon substrate