Browsing by Author "Li, Yunlong"
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Publication A highly reliable 1×5μm via-last TSV module
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.94-96Publication A Thin-Film Pinned-Photodiode Imager Pixel with Fully Monolithic Fabrication and beyond 1Me-Full Well Capacity
Journal article2023, SENSORS, (23) 21, p.Art. 8803Publication Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
; ; Proceedings paper2011, IEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS, 23/01/2011, p.352-355Publication Active-lite interposer for 2.5 & 3D integration
Proceedings paper2015, IEEE Symposium on VLSI Technology, 16/06/2015, p.T222-T223Publication Advanced metallization scheme for 3×50μm via middle TSV and beyond
; ; ; ; ; Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.66-72Publication Advanced physical analysis of 3D interconnect
Publication Anomalous C-V inversion in TSV's: The problem and its cure
; ; ; ; ; Journal article2018, IEEE Transactions on Electron Devices, (65) 4, p.1473-1479Publication As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Journal article2014, Microelectronics Reliability, (54) 9_10, p.1675-1679Publication Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Proceedings paper2005, Materials, Technology, and Reliability of Advanced Interconnects Interconnects, 28/03/2005, p.265-270Publication Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
Proceedings paper2005, Adanced Metallization Conference 2004, 19/10/2004, p.801-805Publication Barrier reliability on sub-100nm copper low-k interconnects
Oral presentation2004, Advanced Metallization ConferencePublication Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Proceedings paper2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.4.38Publication Colloidal quantum dot image sensors: a new vision for infrared
Proceedings paper2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022Publication Considering percolation path growth in low-k dielectric TDDB measurements
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3Publication Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Copper electromigration failure times evaluated over a wide range of voiding phases
Proceedings paper2012, IEEE International Reliability Physics Symposium - IRPS, 15/04/2012, p.EM-1Publication Correlation between field dependent electrical conduction and dielectric breakdown in a SiOCH based low-k (k=2.0) dielectric
Journal article2013, Applied Physics Letters, (103) 3, p.32904Publication Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials
Journal article2015, Journal of Applied Physics, 118, p.164101Publication Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Proceedings paper2009-03, International Semiconductor Technology Conference - ISTC/CSTIC, 19/03/2009, p.453-458