Browsing by Author "Sinapi, Fabrice"
- Results Per Page
- Sort Options
Publication A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Oral presentation2007, Advanced Metallization Conference: 17th Asian SessionPublication CMP of a RU based layer in an advanced Cu low-k stack
Proceedings paper2007-10, International Conference on Planarization CMP Technology - ICPT, 25/10/2007, p.43-48Publication Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film
Oral presentation2007, Advanced Metallization Conference - AMCPublication Impact of ceria properties and CMP parameters on STI CMP performance
; Publication Impact of ceria properties and CMP parameters on STI CMP performance
; Publication Impact of direct CMP on surface and bulk properties of high porosity low-k materials
Proceedings paper2007, Advanced Metallization Conference 2006, 17/10/2006, p.549-563Publication Influence of pH on the channel cracking rate of organosilicate films in wet ambients
Oral presentation2007, European Congress and Exhibition on Advanced Materials and Processes - EuromatPublication Influence of ultra low-k material properties on post direct CMP damage
Meeting abstract2007, Advanced Metallization Conference - AMC, 9/10/2007Publication Materials characterization of WNxCy, WNx and WCx films for advanced barriers
Journal article2007, Microelectronic Engineering, (84) 11, p.2441-2465Publication Stress-corrosion of organosilicate glass films in aqueous environments: role of pH
Publication Surface properties restoration and passivation of high porosity ultra low-k dielectric (k~2.3) after direct-CMP
Journal article2007, Microelectronic Engineering, (84) 11, p.2620-2623Publication The critical role of the metal / porous low-k interface in post direct CMP defectivity generation and resulting ULK surface and bulk hydrophilisation
Proceedings paper2007, IEEE International Interconnect Technology Conference - IITC, 4/06/2007, p.164-166Publication Thin film characterization of PEALD Ru layers on an ALD WNC substrate
Proceedings paper2007, Advanced Metallization Conference 2006 - AMC 2006, 17/10/2006, p.227-232