Browsing by Author "Verlinden, Bert"

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Verlinden, Bert

Journal article

2009, Journal of Electronic Materials, (38) 9, p.1881-1895

Publication

A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders

Ratchev, Petar

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Loccufier, Tony

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Verlinden, Bert

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Teliszewski, Steven

Proceedings paper

2005, Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC, 12/06/2005, p.248-252

Publication

An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

Limaye, Paresh

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Vandepitte, Dirk

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Verlinden, Bert

Proceedings paper

2009, 59th Electronic Components and Technology Conference - ECTC, 25/05/2009, p.704-712

Publication

Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints

Limaye, Paresh

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Verlinden, Bert

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Vandepitte, Dirk

Proceedings paper

2005-09, SMTA International Annual Conference, 25/09/2005, p.371-377

Publication

Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading

Limaye, Paresh

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Vandepitte, Dirk

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Verlinden, Bert

Proceedings paper

2007, 9th Electronics Packaging Technology Conference - EPTC, 10/12/2007, p.703-712

Publication

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Yang, Yu

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Bender, Hugo

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Arstila, Kai

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Verlinden, Bert

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De Wolf, Ingrid

Journal article

2008, Microelectronics Reliability, (48) 8_9, p.1517-1520

Publication

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Dimcic, Biljana

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Journal article

2012, Microelectronics Reliability, (52) 9_10, p.1971-197

Publication

Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder

Ratchev, Petar

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Verlinden, Bert

Proceedings paper

2005-10, IPC/JEDEC 10th International Conference on Lead Free Electronic Components and Assemblies, 18/10/2005

Publication

Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-raman spectroscopy

Okoro, Chukwudi

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Yang, Yu

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Vandepitte, Dirk

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Verlinden, Bert

Proceedings paper

2008, 11th International Interconnect Technology Conference - IITC, 1/06/2008, p.16-18

Publication

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Okoro, Chukwudi

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Journal article

2011, Journal of Materials Science, (46) 11, p.3868-3882

Publication

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Okoro, Chukwudi

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Vanstreels, Kris

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Luhn, Ole

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Verlinden, Bert

Journal article

2010, Journal of Micromechanics and Microengineering, (20) 4, p.45032

Publication

Influence of intermetallic properties of lead-free flip chip solder joints

Limaye, Paresh

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Vandepitte, Dirk

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Verlinden, Bert

Journal article

2008, IEEE Transactions on Advanced Packaging, (31) 1, p.51-57

Publication

Influence of the processing method on the amount and development of voids in miniaturized interconnections

Dimcic, Biljana

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Zhang, Wenqi

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De Wolf, Ingrid

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Verlinden, Bert

Proceedings paper

2010, Electronics System Integration Technology Conference - ESTC, 13/09/2010

Publication

Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers

Limaye, Paresh

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Ratchev, Petar

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Beyne, Eric

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Vandepitte, Dirk

Proceedings paper

2005, Proceedings 15th European Microelectronics and Packaging Conference - EPMC, 12/06/2005, p.253-258

Publication

Low-temperature enbrittlement of lead-free solders in joint level impact testing

Limaye, Paresh

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Maurissen, Wout

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Lambrinou, Konstantza

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Duflos, Frederic

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Proceedings paper

2007-12, 9th Electronics Packaging Conference - EPTC, 10/12/2007, p.140-151

Publication

Phase formation in Cu/Ni/Sn thin film system

Dimcic, Biljana

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De Messemaeker, Joke

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Zhang, Wenqi

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Croes, Kristof

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Vanstreels, Kris

Proceedings paper

2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012

Publication

Process induced sub-surface damage in mechanically ground silicon wafers

Yang, Yu

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De Munck, Koen

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Cotrin Teixeira, Ricardo

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Verlinden, Bert

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De Wolf, Ingrid

Journal article

2008-07, Semiconductor Science and Technology, (23) 7, p.75038

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Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures

Yang, Yu

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Ling, Fangzhou

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Zhao, Chao

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Radisic, Alex

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Van Olmen, Jan

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Travaly, Youssef

Journal article

2010, Microelectronics Reliability, (50) 9_11, p.1636-1640

Publication

Statistical analysis of the influence of thinning processes on the strength of silicon

Yang, Yu

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Cotrin Teixeira, Ricardo

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Roussel, Philippe

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Verlinden, Bert

Proceedings paper

2009, Materials Technology for 3-D Integration, 1/12/2008, p.1112-E03-09

Publication

Study of the mechanism of bulk embrittlement of Sn-based Pb-free solders

Lambrinou, Konstantza

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