Browsing by Author "Wu, Tian-Li"
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Publication Analysis of slow de-trapping phenomena after a positive gate bias on AlGaN/GaN MIS-HEMTs with in-situ Si3N4/Al2O3 bilayer gate dielectrics
Journal article2015, Solid-State Electronics, 103, p.127-130Publication Analysis of the gate capacitance-voltage characteristics in p-GaN/AlGaN/GaN heterostructures
Journal article2017, IEEE Electron Device Letters, (38) 12, p.1696-1699Publication Combined PEALD gate-dielectric and in-situ SiN cap-layer for reduced Vth shift and RDS-ON dispersion of AlGaN/GaN HEMTs on 200 mm Si wafer
Proceedings paper2014, International Solid State Devices and Materials Conference - SSDM, 8/09/2014Publication Combined plasma-enhanced-atomic-layer-deposition gate dielectric and in situ SiN cap layer for reduced threshold voltage shift and dynamic ON-resistance dispersion of AlGaN
Journal article2015, Japanese Journal of Applied Physics, (54) 4S, p.04DF02Publication Comprehensive Investigation of Constant Voltage Stress Time-Dependent Breakdown and Cycle-to-Breakdown Reliability in Y-Doped and Si-Doped HfO2 Metal-Ferroelectric-Metal Memory
Journal article2023, NANOMATERIALS, (9) 10, p.Art. 2104Publication Comprehensive investigation of on-state stress on D-mode AlGaN/GaN MIS-HEMTs
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.3C.5Publication Correlation of interface states/border traps and threshold voltage shift on AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors
Journal article2015, Applied Physics Letters, (107) 9, p.93507Publication Demonstration of 64 Conductance States and Large Dynamic Range in Sidoped HfO2 FeFETs under Neuromorphic Computing Operations
Proceedings paper2022, 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 18-21 April 2022Publication Device breakdown optimization of Al2O3/GaN E-mode MISFETs
Proceedings paper2016, IEEE International Reliability Physics Symposium - IRPS, 17/04/2016, p.CD-5Publication Device optimization for 200V GaN-on-SOI Platform for Monolithicly Integrated Power Circuits
Proceedings paper2022, 52nd IEEE European Solid-State Device Research Conference (ESSDERC), SEP 19-22, 2022, p.245-248Publication Direct comparison of GaN-based e-mode architectures (recessed MISHEMT and p-GaN HEMTs) processed on 200mm GaN-on-Si with Au-free technology
; ;Van Hove, Marleen; ; ; Proceedings paper2015, Gallium Nitride Materials and Devices X, 13/02/2015, p.936311Publication Evidence of hot-electron degradation in GaN-based MIS-HEMTs submitted to high temperature constant source current stress
Journal article2016, IEEE Electron Device Letters, (37) 11, p.1415-1417Publication Failure mode for p-GaN gates under forward gate stress with varying Mg concentration
Proceedings paper2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.4B-4Publication Forward bias gate breakdown mechanism in enhancement-mode p-GaN gate AlGaN/GaN high-electron mobility transistors
Journal article2015, IEEE Electron Device Letters, (36) 10, p.1001-1003Publication Forward gate bias on-state stress on AlGaN/GaN MIS-HEMTs for power switching applications
Meeting abstract2012, Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 28/05/2012Publication Gate stability of enhancement mode GaN power devices
Proceedings paper2016, INC Global Nanotechnology Conference, 10/05/2016Publication Gate stability of GaN-based HEMTs with p-type gate
Journal article2016, Electronics, (5) 2, p.10.3390/electronPublication High temperature behaviour of GaN-on-Si high power MISHEMT devices
Proceedings paper2012, 42nd European Solid-State Device Research Conference - ESSDERC, 17/09/2012, p.302-305Publication High Threshold Voltage Enhancement-Mode Regrown p-GaN Gate HEMTs With a Robust Forward Time-Dependent Gate Breakdown Stability
Journal article2022, IEEE ELECTRON DEVICE LETTERS, (43) 10, p.1625-1628Publication Impact of gate insulator on the dc and dynamic performance of AlGaN/GaN MIS-HEMTs
Journal article2015, Microelectronics Reliability, (55) 9_10, p.1692-1696
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