Browsing by Author "Zhao, Larry"
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Publication A new perspective of barrier material evaluation and process optimization
Proceedings paper2009, IEEE International Interconnect Technology Conference - IITC, 1/06/2009, p.206-208Publication A novel test structure to study intrinsic reliability of barrier/low-k
Proceedings paper2009, 47th Annual IEEE International Reliability Physics Symposium - IRPS, 26/04/2009, p.848-850Publication Advanced interconnects: materials, processing, and reliability
Journal article2015, ECS Journal of Solid State Science and Technology, (4) 1, p.Y1-Y4Publication Advanced organic polymers for the aggressive scaling of low-k materials
; ; Publication Advanced organic polymers for the aggressive scaling of low-k materials
Proceedings paper2010, International Conference on Solid State Devices and Materials - SSDM, 22/09/2010, p.844-845Publication Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.25-28Publication Comparison between intrinsic and integrated reliability properties of low-k materials
Meeting abstract2011, IEEE International Reliability Physics Symposium - IRPS, 10/04/2011, p.142-148Publication Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Proceedings paper2009, Advanced Metallization Conference 2008 (AMC 2008), 23/09/2008, p.237-242Publication Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Meeting abstract2008, Advanced Metallization Conference - AMC, 23/09/2008Publication Depth-profiling of the elastic and optical properties of submicrometer thick optically transparent films by picosecond ultrasonics inteferometry
; Zhao, LarryMeeting abstract2011, 5th Conference on Emerging Technologies in Non Destructive Testing ETNDT, 19/09/2011, p.59Publication Development of metamorphic dual-junction solar cells
Proceedings paper2007, 22nd European Photovoltaic Solar Energy Conference, 3/09/2007, p.765-768Publication Direct observation of the 1/E dependence of time dependent
Journal article2011, Applied Physics Letters, (98) 3, p.32107Publication Effect of porogen residue on electrical characteristics of ultra low-k materials
Journal article2011, Microelectronic Engineering, (88) 6, p.990-993Publication Electromigration and thermal storage study of barrierless Co vias
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.48-50Publication Evaluation of Mn-based Cu barriers for interconnect applications
; ; ; ; Oral presentation2011, AVS 58th International Symposium and ExhibitionPublication Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers
Journal article2011, Thin Solid Films, (520) 1, p.662-666Publication High quality NH2SAM (Self Assembled Monolayer) diffusion barrier for advanced copper interconnects
Proceedings paper2010, Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics, 5/04/2010, p.F02.01Publication Impact of carbon-doping on time dependent dielectric breakdown of SiO2-based films
Journal article2015, Applied Physics Letters, (106) 7, p.72902Publication Influence of porosity on electrical properties of low-k dielectrics
Journal article2012, Microelectronic Engineering, (92) 1, p.59-61Publication Influence of porosity on electrical properties of low-k dielectrics
Meeting abstract2010, Advanced Metallization Conference - AMC, 5/10/2010
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