Browsing by author "Carbonell, Laure"
Now showing items 1-20 of 76
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A novel approach to characterization of a low-k dielectric polymer surface
Martin Hoyas, Ana; Schuhmacher, Jorg; Whelan, Caroline; Baklanov, Mikhaïl; Carbonell, Laure; Schaekers, Marc; Celis, Jean-Pierre; Maex, Karen (2002) -
A thermal stability study of Alkane and aromatic thiolate self-assembled monolayers on copper surfaces
Carbonell, Laure; Whelan, Caroline; Kinsella, Michael; Maex, Karen (2004) -
An investigation of ultra low-k dielectrics with high thermal stability for integration in memory devices
Hong, Eun Kee; Demuynck, Steven; Le, Quoc Toan; Baklanov, Mikhaïl; Carbonell, Laure; Van Hove, Marleen; Meynen, Herman (2007) -
Au-free AlGaN/GaN power diode on 8 in Si substrate with gated edge termination
Lenci, Silvia; De Jaeger, Brice; Carbonell, Laure; Hu, Jie; Mannaert, Geert; Wellekens, Dirk; You, Shuzhen; Bakeroot, Benoit; Decoutere, Stefaan (2013) -
Barrier deposition for advanced interconnects
Schaekers, Marc; Tokei, Zsolt; Li, Yong-Li; Carbonell, Laure (2007) -
Bulk properties of MOCVD-deposited HfO2 layers for high-k dielectric applications
Van Elshocht, Sven; Baklanov, Mikhaïl; Brijs, Bert; Carter, R.; Caymax, Matty; Carbonell, Laure; Claes, Martine; Conard, Thierry; Cosnier, Vincent; Date, Lucien; De Gendt, Stefan; Kluth, J.; Pique, Didier; Richard, Olivier; Vanhaeren, Danielle; Vereecke, Guy; Witters, Thomas; Zhao, Chao; Heyns, Marc (2004) -
Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109
Das, Arabinda; Kokubo, Terukazu; Furukawa, Yukiko; Struyf, Herbert; Vos, Ingrid; Sijmus, Bram; Iacopi, Francesca; Van Aelst, Joke; Le, Quoc Toan; Carbonell, Laure; Brongersma, Sywert; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Sleeckx, Erik; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Rosseel, Erik; Van Hove, Marleen; Vanhaelemeersch, Serge; Shiota, A.; Maex, Karen (2002) -
Characterisation of JSR's spin-on hardmask FF-02
Das, Arabinda; Le, Quoc Toan; Furukawa, Yukiko; Nguyen Hoang, Viet; Terzieva, Valentina; de Theije, Femke; Whelan, Caroline; Maenhoudt, Mireille; Struyf, Herbert; Tokei, Zsolt; Iacopi, Francesca; Stucchi, Michele; Carbonell, Laure; Vos, Ingrid; Bender, Hugo; Patz, M.; Beyer, Gerald; Van Hove, Marleen; Maex, Karen (2003) -
Characterization of advanced semiconductor materials by thermal desorption mass spectrometry with atmospheric pressure ionization
Carbonell, Laure; Vereecke, Guy; Van Elshocht, Sven; Caymax, Matty; Van Hove, Marleen; Maex, Karen; Mertens, Paul (2003) -
CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
Comparison between intrinsic and integrated reliability properties of low-k materials
Croes, Kristof; Pantouvaki, Marianna; Carbonell, Laure; Zhao, Larry; Beyer, Gerald; Tokei, Zsolt (2011) -
Continued scalability of copper/low-k interconnects
Brongersma, Sywert; Carbonell, Laure; Vanstreels, Kris; Iacopi, Francesca; D'Haen, Jan; Zhang, Wenqi; Travaly, Youssef; Demuynck, Steven; Tokei, Zsolt; De Ceuninck, Ward; Maex, Karen (2005) -
Copper grain growth in reduced dimensions
Brongersma, Sywert; Vanstreels, Kris; Wu, W.; Zhang, Wenqi; Ernur, Didem; D'Haen, Jan; Terzieva, Valentina; Van Hove, Marleen; Clarysse, Trudo; Carbonell, Laure; Vandervorst, Wilfried; De Ceuninck, Ward; Maex, Karen (2004-06) -
Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
Whelan, Caroline; Kinsella, Michael; Carbonell, Laure; Ho, Meng; Maex, Karen (2003) -
Cu resistivity scaling limits for 20 nm copper damascene lines
Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter (2007) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2008) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2009) -
Defect inspection of Cu metallization
Holsteyns, Frank; Carbonell, Laure; Vos, Ingrid; Vrancken, Evi; Tokei, Zsolt; Mertens, Paul (2002) -
Defectivity study of Cu metallization process by dark- and bright-field inspection
Carbonell, Laure; Holsteyns, Frank; Tokei, Zsolt; O'Reilly, L.; Maex, Karen; Mertens, Paul (2003) -
Development of a new metallization scheme for making nanoscale interconnects based on plasma-functionalization and electroless deposition
Dictus, Dries; Dordi, Y.; Gurer, E.; Krishtab, Mikhail; Baklanov, Mikhaïl; Carbonell, Laure; van der Veen, Marleen; El-Mekki, Zaid; Tokei, Zsolt (2013)