Browsing by author "Mao, Ming"
Now showing items 1-20 of 29
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
300mm IGZO nFETs with low-T Ru contacts for localized doping and increased BEOL compatibility
Kljucar, Luka; Smets, Quentin; van Setten, Michiel; Mitard, Jerome; Belmonte, Attilio; Dekkers, Harold; Teugels, Lieve; Mao, Ming; Puliyalil, Harinarayanan; del Agua Borniquel, Jose Ignacio; Delhougne, Romain; Sankaran, Kiroubanand; Tokei, Zsolt (2020) -
Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Li, Yunlong; Cheyns, David; Moreno Hagelsieb, Luis; Georgitzikis, Epimitheas; Lim, Myung jin; Mao, Ming; Witters, Thomas; Leyssens, Kenny; Boulenc, Pierre; Lee, Jiwon; Malinowski, Pawel; Guerrieri, Stefano (2019) -
Co active electrode enhances CBRAM performance and scaling potential
Belmonte, Attilio; Radhakrishnan, Janaki; Donadio, Gabriele Luca; Redolfi, Augusto; Delhougne, Romain; Nyns, Laura; Covello, Angelo; Vereecke, Guy; Franquet, Alexis; Spampinato, Valentina; Kundu, Shreya; Mao, Ming; Goux, Ludovic; Kar, Gouri Sankar (2019) -
Co-optimization of lithographic and patterning processes for improved EPE performance
Maslow, Mark; Timoshkov, Vadim; Kiers, Ton; Jee, Tae Kwon; de Loijer, Peter; Morikita, Shinya; Demand, Mark; Metz, Andrew W; Okada, Soichiro; Kumar, Kaushik A.; Biesemans, Serge; Yaegashi, Hidetami; Di Lorenzo, Paolo; Bekaert, Joost; Mao, Ming; Beral, Christophe; Lariviere, Stephane (2017) -
Contact module at dense gate pitch technology challenges
Demuynck, Steven; Mao, Ming; Kunnen, Eddy; Versluijs, Janko; Croes, Kristof; Wu, Chen; Schaekers, Marc; Peter, Antony; Kauerauf, Thomas; Teugels, Lieve; Boemmels, Juergen (2014) -
Demonstration of an N7 integrated fab process for metal oxide EUV photoresist
De Simone, Danilo; Mao, Ming; Kocsis, Michael; De Schepper, Peter; Lazzarino, Frederic; Vandenberghe, Geert; Yamashita, Fumiko; Stowers, Jason; Meyers, Steven; Grenville, Andrew; Luong, Vinh; Parnell, Doni; Clark, Benjamin L. (2016) -
Design and pitch scaling for affordable node transition and EUV insertion scenario
Kim, Ryan Ryoung han; Ryckaert, Julien; Raghavan, Praveen; Sherazi, Yasser; Debacker, Peter; Trivkovic, Darko; Gillijns, Werner; Tan, Ling Ee; Drissi, Youssef; Blanco, Victor; Bekaert, Joost; Mao, Ming; Lariviere, Stephane; McIntyre, Greg (2017) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Engineering Strain and Texture in Ferroelectric Scandium-Doped Aluminium Nitride
McMitchell, Sean; Walke, Amey; Banerjee, Kaustuv; Mertens, Sofie; Piao, Xiaoyu; Mao, Ming; Katcko, Kostantine; Vellianitis, Georgios; Van Dal, Mark; Lin, Yu-Ming; Van den Bosch, Geert; Delhougne, Romain; Kar, Gouri Sankar (2023) -
EUV process establishment through litho and etch for N7 node
Kuwahara, Yuhei; Kawakami, Shinichiro; Kubota, Minoru; Matsunaga, Koichi; Nafus, Kathleen; Foubert, Philippe; Mao, Ming (2016) -
Exploring the readiness of EUV photo materials for patterning
De Simone, Danilo; Vesters, Yannick; Shehzad, Atif; Vandenberghe, Geert; Foubert, Philippe; Beral, Christophe; Van Den Heuvel, Dieter; Mao, Ming; Lazzarino, Frederic (2017) -
First demonstration of sub-12 nm gate last IGZO-TFTs with oxygen tunnel architecture for front gate devices
Subhechha, Subhali; Rassoul, Nouredine; Belmonte, Attilio; Delhougne, Romain; Donadio, Gabriele Luca; Banerjee, Kaustuv; Dekkers, Harold; van Setten, Michiel; Mao, Ming; Puliyalil, Harinarayanan; Kundu, Shreya; Pak, Murat; Teugels, Lieve; Tsvetanova, Diana; Bazzazian, Nina; Klijs, Lars; Vaisman Chasin, Adrian; Heijlen, Jeroen; Kar, Gouri Sankar (2021) -
imec's iN5 BEOL patterning development
Li, Waikin; Mao, Ming; Trivkovic, Darko; Murdoch, Gayle; Halder, Sandip; Ercken, Monique (2017) -
Impact of EUV resist thickness on local critical dimension uniformities for sub-30 nm CD Via Patterning
Vincent, Benjamin; Maslow, Mask; Bekaert, Joost; Mao, Ming; Ervin, Joseph (2020) -
Impact of sequential infiltration synthesis (SIS) on roughness and stochastic nano-failures for EUVL patterning
Vanelderen, Pieter; Blanco, Victor; Mao, Ming; Tomczak, Yoann; De Roest, David; Kissoon, Nicola; Rincon Delgadillo, Paulina; Rispens, Gijsbert; Schiffelers, Guido; Pathak, Abhinav; Lazzarino, Frederic; De Simone, Danilo; De Poortere, Etienne; Mc Manus, Moyra; Piumi, Daniele; Hendrickx, Eric; Vandenberghe, Geert (2019) -
Influence of etch process on contact hole local critical dimension uniformity in extreme-ultraviolet lithography
Lorusso, Gian; Mao, Ming; Reijnen, Liesbeth; Viatkina, Katja; Knops, Roel; Fliervoet, Timon (2015) -
Metal containing resist readiness for HVM EUV lithography
De Simone, Danilo; Mao, Ming; Lazzarino, Frederic; Vandenberghe, Geert (2016) -
N10 logic patterning
Xu, Kaidong; Tao, Zheng; Hody, Hubert; Mannaert, Geert; Kunnen, Eddy; Mao, Ming; Lazzarino, Frederic; Decoster, Stefan (2014) -
N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV
Lariviere, Stephane; Briggs, Basoene; Wilson, Chris; Mallik, Arindam; Decoster, Stefan; Wan, Danny; Bekaert, Joost; Blanco, Victor; Mao, Ming; Paolillo, Sara; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Boemmels, Juergen; Trivkovic, Darko; Tokei, Zsolt; McIntyre, Greg; Mocuta, Dan (2017)