Browsing by author "Boemmels, Juergen"
Now showing items 1-20 of 126
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12-EUV layer Surrounding Gate Transistor (SGT) for vertical 6-T SRAM: 5-nm-class technology for ultra-density logic devices
Kim, Min-Soo; Harada, N.; Kikuchi, Yoshiaki; Boemmels, Juergen; Mitard, Jerome; Huynh Bao, Trong; Matagne, Philippe; Tao, Zheng; Li, Waikin; Devriendt, Katia; Ragnarsson, Lars-Ake; Lorant, Christophe; Sebaai, Farid; Porret, Clément; Rosseel, Erik; Dangol, Anish; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Jourdan, Nicolas; Sepulveda Marquez, Alfonso; Puliyalil, Harinarayanan; Jamieson, Geraldine; van der Veen, Marleen; Teugels, Lieve; El-Mekki, Zaid; Altamirano Sanchez, Efrain; Li, Y.; Nakamura, H.; Mocuta, Dan; Matsuoka, F. (2019) -
300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections
Jourdan, Nicolas; Cellier, Daniel; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016) -
3D Nanofabric: Layout Challenges and Solutions for Ultra-scaled Logic Designs
Giacomin, Edouard; Boemmels, Juergen; Ryckaert, Julien; Catthoor, Francky; Gaillardon, Pierre-Emmanuel (2021) -
3D sequential low temperature top tier devices using dopant activation with excimer laser anneal and strained silicon as performance boosters
Vandooren, Anne; Wu, Zhicheng; Parihar, Narendra; Franco, Jacopo; Parvais, Bertrand; Matagne, Philippe; Debruyn, Haroen; Mannaert, Geert; Devriendt, Katia; Teugels, Lieve; Vecchio, Emma; Radisic, Dunja; Rosseel, Erik; Hikavyy, Andriy; Chan, BT; Waldron, Niamh; Mitard, Jerome; Besnard, G.; Alvarez, A.; Gaudin, G.; Schwarzenbach, W.; Radu, I.; Nguyen, B. Y.; Huet, K.; Tabata, T.; Mazzamuto, F.; Demuynck, Steven; Boemmels, Juergen; Collaert, Nadine; Horiguchi, Naoto (2020) -
3D SRAM Macro Design in 3D Nanofabric Process Technology
Abdi, Dawit; Salahuddin, Shairfe Muhammad; Boemmels, Juergen; Giacomin, Edouard; Weckx, Pieter; Ryckaert, Julien; Hellings, Geert; Catthoor, Francky (2023) -
A method to pattern tight tip-to-tip in 32nm-pitch N5 interconnect using Ru area selective deposition tone inversion process
Briggs, Basoene; Soethoudt, Job; Delabie, Annelies; Wilson, Chris; Tokei, Zsolt; Boemmels, Juergen; Devriendt, Katia; Sebaai, Farid; Lorant, Christophe; Hody, Hubert (2018) -
A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow
Clark, William; Juncker, Aurelie; Paladugu, E.; Fried, David; Wilson, Chris; Pourtois, Geoffrey; Gallagher, Emily; de Jamblinne de Meux, Albert; Piumi, Daniele; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2016) -
A Multiply-and-Accumulate Array for Machine Learning Applications Based on a 3D Nanofabric Flow
Giacomin, Edouard; Gudaparthi, Sumanth; Boemmels, Juergen; Balasubramonian, Rajeev; Catthoor, Francky; Gaillardon, Pierre-Emmanuel (2021) -
A way to integrate multiple block layers for middle of line contact patterning
Kunnen, Eddy; Demuynck, Steven; Brouri, Mohand; Boemmels, Juergen; Versluijs, Janko; Ryckaert, Julien (2015) -
Advanced experimental Back-End-Of-Line (BEOL) stability test: measurements and simulations
Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; De Wolf, Ingrid; Van der Plas, Geert; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2015) -
Advanced experimental BEOL stability test: measurements and simulations
Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; De Wolf, Ingrid; Van der Plas, Geert; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2014) -
Alternative integration of ultra low-k dielectrics by template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Heylen, Nancy; Murdoch, Gayle; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Alternative metals for advanced interconnects
Adelmann, Christoph; Wen, Liang Gong; Peter, Antony; Siew, Yong Kong; Croes, Kristof; Swerts, Johan; Popovici, Mihaela Ioana; Sankaran, Kiroubanand; Pourtois, Geoffrey; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2014) -
Alternative metals for advanced interconnects
Adelmann, Christoph; Wen, Liang Gong; Peter, Antony; Siew, Yong Kong; Dutta, Shibesh; Croes, Kristof; Swerts, Johan; Popovici, Mihaela Ioana; Sankaran, Kiroubanand; Pourtois, Geoffrey; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2014-10) -
Alternative metals for advanced interconnects
Adelmann, Christoph; Wen, Liang Gong; Dutta, Shibesh; Boemmels, Juergen; Tokei, Zsolt (2015) -
Alternative metals: from ab initio screening to calibrated narrow line models
Adelmann, Christoph; Sankaran, Kiroubanand; Dutta, Shibesh; Gupta, Anshul; Kundu, Shreya; Jamieson, Geraldine; Moors, Kristof; Pinna, Nicolo; Ciofi, Ivan; Van Elshocht, Sven; Boemmels, Juergen; Boccardi, Guillaume; Wilson, Chris; Pourtois, Geoffrey; Tokei, Zsolt (2018) -
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Tang, Baojun; Croes, Kristof; Barbarin, Yohan; Wang, Yunqi; Degraeve, Robin; Li, Yunlong; Toledano Luque, Maria; Kauerauf, Thomas; Boemmels, Juergen; Tokei, Zsolt; De Wolf, Ingrid (2014) -
Atomic layer deposition of ruthenium for advanced interconnect applications
Adelmann, Christoph; Popovici, Mihaela Ioana; Groven, Benjamin; Wen, Liang Gong; Dutta, Shibesh; Boemmels, Juergen; Tokei, Zsolt; Van Elshocht, Sven (2016) -
Barrier/liner stacks for scaling the Cu interconnect metallization
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Wilson, Chris; Heylen, Nancy; Varela Pedreira, Olalla; Struyf, Herbert; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, Anne; Wu, Zhicheng; Khaled, Ahmad; Franco, Jacopo; Parvais, Bertrand; Li, W.; Witters, Liesbeth; Walke, Amey; Peng, Lan; Rassoul, Nouredine; Matagne, Philippe; Jamieson, Geraldine; Inoue, Fumihiro; Nguyen, B.Y.; Debruyn, Haroen; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Radisic, Dunja; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Besnard, G.; Schwarzenbach, W.; Gaudin, G.; Radu, Iuliana; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Ryckaert, Julien; Collaert, Nadine; Mocuta, Dan (2019)