Browsing by author "Drijbooms, Chris"
Now showing items 1-20 of 38
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3D-carrier profiling in FinFETs using scanning spreading resistance microscopy
Mody, Jay; Zschaetzsch, Gerd; Koelling, Sebastian; De Keersgieter, An; Eneman, Geert; Kambham, Ajay Kumar; Drijbooms, Chris; Schulze, Andreas; Chiarella, Thomas; Horiguchi, Naoto; Hoffmann, Thomas; Eyben, Pierre; Vandervorst, Wilfried (2011) -
Buried power rail integration with FinFETs for ultimate CMOS scaling
Gupta, Anshul; Varela Pedreira, Olalla; Arutchelvan, Goutham; Zahedmanesh, Houman; Devriendt, Katia; Hanssen, Frederik; Tao, Zheng; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, Noemie; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min-Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Cousserier, Joris; Yakimets, Dmitry; Lazzarino, Frederic; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Jaysankar, Manoj; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Boemmels, Juergen; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node
Gupta, Anshul; Mertens, Hans; Tao, Zheng; Demuynck, Steven; Boemmels, Juergen; Arutchelvan, Goutham; Devriendt, Katia; Varela Pedreira, Olalla; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Zahedmanesh, Houman; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, N.; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Yakimets, Dmitry; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Cousserier, Joris; Jaysankar, Manoj; Lazzarino, Frederic; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Combining TEM and 3D scanning spreading resistance microscopy, a hybrid approach, to the analysis of Ge gate-all-around nano-wires
Favia, Paola; Celano, Umberto; Drijbooms, Chris; Witters, Liesbeth; Arimura, Hiroaki; Capogreco, Elena; Vancoille, Eric; Bender, Hugo (2018) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Corrosion of FIB-milled Cu during air exposure
Bender, Hugo; Richard, Olivier; Van Marcke, Patricia; Drijbooms, Chris (2005-04) -
Corrosion of FIBed Cu
Bender, Hugo; Richard, Olivier; Benedetti, Alessandro; Van Marcke, Patricia; Drijbooms, Chris (2005) -
Cu plating of through-Si vias for 3D-stacked integrated circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2008) -
Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Degradation and failure analysis of copper and tungsten contacts under high fluence stress
Kauerauf, Thomas; Butera, Geni; Croes, Kristof; Demuynck, Steven; Wilson, Chris; Roussel, Philippe; Drijbooms, Chris; Bender, Hugo; Lofrano, Melina; Vandevelde, Bart; Tokei, Zsolt; Groeseneken, Guido (2010) -
Dual beam FIB/SEM cross-section imaging of nano-structures
Bender, Hugo; Drijbooms, Chris; Van Marcke, Patricia; Geypen, Jef; Marrant, Koen (2007) -
Fabrication of conductive AFM probes and their use in microelectronics
Fouchier, Marc; Alvarez, David; Eyben, Pierre; Duhayon, Natasja; Petry, Jasmine; Drijbooms, Chris (2003) -
Ferroelectricity in Si-doped hafnia: probing challenges in absence of screening charges
Celano, Umberto; Gomez, Andres; Piedimonte, Paola; Neumayer, Sabine; Collins, Liam; Popovici, Mihaela Ioana; Florent, Karine; McMitchell, Sean; Favia, Paola; Drijbooms, Chris; Bender, Hugo; Paredis, Kristof; Di Piazza, Luca; Jesse, Stephen; Van Houdt, Jan; van der Heide, Paul (2020) -
FIB preparation of cross-sectional transmission electron microscopy specimens of unpassivated device structures
Bender, Hugo; Van Marcke, Pieter; Drijbooms, Chris; Roussel, Philippe (1997) -
FIB/SEM structural analysis of through-silicon-vias
Bender, Hugo; Drijbooms, Chris; Radisic, Alex (2011) -
FIB/SEM structural analysis of through-silicon-vias
Bender, Hugo; Drijbooms, Chris; Radisic, Alex (2011) -
Focused ion beam preparation for cross-sectional transmission electron microscopy investigation of the top surface of unpassivated or partially processed ULSI devices
Bender, Hugo; Van Marcke, Pieter; Drijbooms, Chris; Roussel, Philippe (1998) -
Focused ion beam sample preparation: applications in materials science
Bender, Hugo; Benedetti, Alessandro; Richard, Olivier; Van Marcke, Patricia; Drijbooms, Chris (2003) -
Grain size and orientation in ternary Co1-xNixSi2 thin films on Si(100): influence of the Ni content
Smeets, D.; Vantomme, Andre; Drijbooms, Chris; Bender, Hugo (2004) -
Individual device analysis using hybrid TEM-scalpel SSRM metrology
Celano, Umberto; Favia, Paola; Drijbooms, Chris; Dixon-Luinenburg, Oberon; Richard, Olivier; Bender, Hugo; Vancoille, Eric; Paredis, Kristof; Loo, Roger; Schulze, Andreas; Hikavyy, Andriy; Witters, Liesbeth; Mitard, Jerome; Collaert, Nadine; Horiguchi, Naoto; Vandervorst, Wilfried (2017)